J&A - Direct Bonding
Awarded Limited / Sole Source Justification Posted
- Solicitation number
- W56KGU26CA004
- Agency
-
ACC Aberdeen Proving Ground
Army Contracting Command, Department of Defense
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- W56KGU26CA004 Federal contract award
- NAICS code
- Not on record
- Place of performance
- Fort Belvoir, Virginia, United States
- Points of contact
Notice details come from SAM.gov. Updated .
About this opportunity
The Army Contracting Command at Aberdeen Proving Ground intends to award a sole-source contract to DRS Network & Imaging Systems, LLC for the development and implementation of direct bonding techniques for compound semiconductors used in dual-band infrared focal plane arrays, with an estimated value of $8.4 million.
The justification cites Title 10 U.S. Code Section 3204(a)(1) as implemented in FAR 6.302-1(a)(2)(ii)(A), identifying DRS as the only responsible source capable of designing, fabricating, and testing focal plane arrays utilizing direct bond hybridization while eliminating or reducing infrared-absorbing epoxy materials to address current sensitivity and yield limitations. Market research included a sources sought announcement posted on SAM.gov on August 21, 2025 (closed September 5, 2025) and a Request for Information distributed to Multi-Award IDIQ RS3 holders; only DRS demonstrated the requisite expertise in direct bonding fabrication and manufacturing processes for compound semiconductors. The 36-month contract will be structured as a single-award Cost-Plus-Fixed-Fee vehicle funded through Research, Development, Test and Evaluation appropriations for fiscal years 2026–2028. Place of performance is Melbourne, Florida. A subcontracting plan is required, with mandatory inclusion of FAR clauses 52.219-8 and 52.219-9 for small business utilization and DFARS clause 252.219-7003 for competitive subcontracting.
Notice text
Redacted J&A for Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays.
Awarded contract W56KGU26CA004 to unknown vendor for unknown amount on 2026-05-18.
Files
| File | Type | Posted |
|---|---|---|
| A02 - JA - Direct Bonding - Redacted.pdf |
Notice history
| Notice | Type | Posted |
|---|---|---|
| This notice | Limited / Sole Source Justification | |
| Direct Bonding for Compound Semiconductor for Use in Dual Band Infrared Focal Plane Arrays | Award Notice |
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