Custom Multichip Module Device (Rhinestone)
Closed Solicitation Posted
- Solicitation number
- HQ072722QZL02
- Agency
- Defense Microelectronics Activity Department of Defense
- Responses due
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 334412 Bare Printed Circuit Board Manufacturing
- PSC
- 5962 Microcircuits, Electronic
- Place of performance
- McClellan, California 95652, United States
Notice details come from SAM.gov. Updated .
About this opportunity
The Defense Microelectronics Activity seeks to procure custom multi-chip module devices known as Rhinestone in a ball grid array or quad-flat no-lead package measuring no more than 11.0 x 11.0 x 2.0 mm. Quotes are due by July 14, 2022 and will be evaluated based on both quality and price factors to determine best value. The contractor must design, validate, and manufacture the overmolded multi-chip module devices according to specifications through design reviews and deliver 25 first article prototypes within 24 weeks followed by 250 production units within 20 weeks if approved.
There is no set-aside designation. The contractor must deliver first article prototypes within 24 weeks and then have the ability to manufacture up to 1,000 additional production units within 20 weeks if no design changes occur, with all work performed in McClellan Park, California.
Notice text
The purpose of this acquisition is to procure custom DMEA Rhinestone circuit design overmolded multi-chip module (MCM) devices, in a Ball Grid Array (BGA) or Quad-Flat No-Lead (QFN) configuration.
See attached combined synopsis/solicitation and Statement of Work.
Attachments
| File | Type | Posted |
|---|---|---|
| SOW Custom multichip module device (Rhinestone) 22-2C6.pdf | ||
| Combined Synopsis and Solicitation 22-2C6.pdf |
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