SOW Custom multichip module device (Rhinestone) 22-2C6.pdf

STATEMENT OF WORK (SOW)

DMEA 22-2C6

25 May 2022

1.0 SCOPE:

1.1 TITLE: Custom multichip module device (Rhinestone)

1.2 APPLICABILITY: The custom Rhinestone multichip module device effort will allow DMEA to miniaturize the existing Greystone UHF SATCOM transmitter module. This will utilize Advance Packaging technology by providing an overmold, multi-chip module (MCM), Ball Grid Array (BGA) or Quad-Flat No-Lead (QFN) design and manufacturing/assembly processes.

Rhinestone will be a re-packaged variant of the Greystone UHF SATCOM transmitter module that reduces the size and weight of the Greystone device while improving our OPSEC position when deployed.

1.3 BACKGROUND: The Greystone UHF SATCOM transmitter module was designed and manufactured by DMEA as a Quick Reaction Engineering (QRE) effort. The current device is built as a typical printed circuit board assembly (PCBA); however, new technical requirements provide a need for this system to be miniaturize to an overmolded MCM, BGA or QFN device. Hence, DMEA is seeking the reduction in size and obfuscation of circuit details of our Greystone system.

1.4 PURPOSE: To procure custom DMEA Rhinestone circuit design overmolded multi-chip module (MCM) devices, in a Ball Grid Array (BGA) or Quad-Flat No-Lead (QFN) configuration.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES: None

2.1 GOVERNMENT DOCUMENTS:

Document No. Date Title 3884 8/23/2021 Rhinestone 0.1.1 Design Schematics and Dimensions

2.3 GOVERNMENT FURNISHED EQUIPMENT:

Nomenclature Part Number Date Available SiT5357 MEMs Oscillator Devices SIT5357AE-FQDXXXX000.FP0000 Upon Award

3.0 REQUIREMENTS:

Design, validate, and manufacture overmolded multi-chip module (MCM) devices, in a Ball Grid Array (BGA) or Quad-Flat No- Lead (QFN) configuration with dimensions no larger than 11.0 mm x 11.0 mm x 2.0 mm [LxWxH] +/- 0.25 mm.

3.1 GENERAL REQUIREMENTS:

Must submit examples of previous efforts that are similar in scope and technology (e.g. overmolding/encapsulation, MCM, assembly technology) prior to contract award.

3.2 PROGRAM MANAGEMENT: None

3.2.1 TECHNICAL INTERCHANGE MEETINGS (TIMs): The contractor shall conduct TIMs as necessary in the performance of this task. The TIM with the contractor shall be scheduled when there is need for technical interchange between the government and the contractor. The content of the meeting can include the discussion of any information that has impact upon the task activities, including documentation contents or format. (A002)

3.3 TASK REQUIREMENTS

3.3.1 MCM PACKAGE DESIGN RULE DOCUMENT (PDRD):

3.3.1.1 Design File Format/Requirements: The assembly design is preferred to be in Cadence Allegro BRD format (.BRD) file format. The design file shall consist of all package footprint layers, passive and active surface mount technology (SMT) component symbols placed on the package top layer, MCM dimensions, substrate edge keep-out zones for overmolding processing and all other handling keep out zones. A Gerber type file (.GBR) for all package footprint layers, as well as a Portable

Document Format (.PDF) for all assembly renderings depicting passive and active surface mount technology (SMT) component symbols placed on the package top layer, MCM dimensions, substrate edge keep-out zones for overmolding processing and all other handling keep out zones, will also be acceptable.

3.3.1.2 PDRD Rev 0.0: The contractor shall design an overmolded multi-chip module (MCM) Rhinestone 0.1.1 device that fulfills the requirements and conforms to the specification listed in the Document No. 3884 Rhinestone 0.1.1 Design Schematics and Dimensions, including JTAG specifications. The contractor shall present the design and deliver all required files, which shall conform to paragraph 3.3.1.1 above, at a Preliminary Placement Design Review (PPDR). (A002)

3.3.1.3 PDRD Rev. 0.1: Upon approval of PDRD Rev. 0.0, overmolded multi-chip module (MCM) Rhinestone 0.1.1 design package, the contractor shall provide a PDRD Rev 0.2 design file that shows the connectivity between the SMT components and the package/substrate balls. The contractor shall present the design and deliver all required files, which shall conform to paragraph 3.3.1.1 above, at a Preliminary Placement Design Review (PPDR). (A002)

3.3.1.4 PDRD Rev. 0.2: Upon approval of PDRD Rev. 0.1, the contractor shall provide a PDRD Rev 0.2 design file with substrate completed, routing completed, and components placed. [Note: At this stage the package ball-map will be frozen per PDRD, meaning no package ball swap will be allowed after this point unless otherwise approved by DMEA’s Project Engineer.] The contractor shall present the design and deliver all required files, which shall conform to paragraph 3.3.1.1 above, at a Preliminary Placement Design Review (PPDR). (A002)

3.3.1.5 PDRD Rev. 0.3: Upon approval of PDRD Rev. 0.2, the Contractor will provide a PDRD Rev 0.3 design file. The design shall be clean of any Design Rule Check (DRC) errors. [Note: DMEA engineers will review the design and the Project Engineer will have final approval.] The contractor shall present the design and deliver all required files, which shall conform to paragraph

3.3.1.1 above, at a Preliminary Placement Design Review (PPDR). (A002)

3.3.1.6 PDRD Rev. 0.4: Upon approval of PDRD Rev. 0.1, the Contractor will provide a PDRD Rev 0.4 JTAG design file. The design shall provide final specifications, schematics, and PCB design layout including sockets. The contractor shall present the design and deliver all required files, which shall conform to paragraph 3.3.1.1 above, at a Preliminary Placement Design Review

(PPDR). (A002)

3.3.1.7 PDRD Rev 1.0: The contractor shall provide the frozen design file, manufacturing and mechanical files (to include Mold Tool/Plate Design and Materials), assembly file, and Bill of Materials (BOM). [Note: DMEA engineers will review all submissions and the Project Engineer will have final technical approval to proceed to 3.3.2.] The contractor shall present the design and deliver all required files, which shall conform to paragraph 3.3.1.1 above, at a Preliminary Placement Design Review

(PPDR). (A002) (A007)

3.3.2 Product Introduction Assessment

3.3.2.1 Manufacturing data deliverables by the contractor includes providing Process documents (e.g. to include solder reflow profile(s), mold and assembly process development, initial set-up and programming, maximum temperatures and cycles device are exposed to), build solutions document (e.g. to include tooling, stencil design in a .gbr file format, assembly raw materials), and packaging/manufacturing process flow summary document. (A007)

3.3.3 First Article/Prototype Assemblies: The contractor shall produce and deliver twenty-five (25) overmolded multi-chip module (MCM) Rhinestone 0.1.1 packages delivered using trays. The delivery schedule for all twenty-five (25) yielding devices should not exceed 24 weeks from acceptance of paragraph 3.3.1.7, above.

3.3.4 Production Representatives: Contactor must receive via a TIM, acceptance of paragraph 3.3.3 deliverables and approval to build Production Representatives from DMEA Project Engineer prior to the execution of this paragraph (3.3.4). The contractor shall produce and deliver two-hundred and fifty (250) overmolded multi-chip modules (MCM) Rhinestone 0.1.1, using trays.

Provided no changes to the design, the delivery schedule for all two-hundred and fifty (250) yielding devices shall not exceed 20 weeks from the acceptance of deliverables in paragraph, 3.3.3 above. (A002)

3.3.5 Option 1 (Production Units): The contractor shall produce and deliver up to one-thousand (1,000) overmolded multi-chip modules (MCM) Rhinestone 0.1.1, using trays. [Note: DMEA Project Engineer will identify total production quantities based on customer needs, but will not exceed more than one-thousand (1,000) units.] Provided no changes to the design, the delivery schedule for all yielding production devices shall not exceed 20 weeks from the acceptance of deliverables in paragraph, 3.3.4 above.

3.3.6 SECURITY: The contractor shall use International Traffic in Arms Regulation (ITAR) products

3.4 PROGRAM SUMMARY: None

4.0 DATA ITEMS: The following CDRLs apply to this delivery order and shall be submitted as described below. Indicate on the cover of all delivered data the contract number, delivery order number, CET number, CET title, and the current DMEA Project Engineer name and office symbol.

1. Sequence Number A002

2. Title Conference Minutes

3. Subtitle TIM Minutes

4. Authority DI-ADMN-81250B

5. Contract Reference Para. 3.2.1

6. Requiring Office DMEA/MEAC

7. DD 250 Req LT

8. App Code N/A

9. Distribution Statement Req’d DISTRIBUTION F. Further dissemination only as directed by the

Defense Micro Electronics Activity (May 2022) or higher DoD authority.

10. Frequency ASREQ

11. As of N/A

12. Date of First Submission 10 calendar days after TIM

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

15. Total See Distribution List

16. Remarks Contractor format is acceptable. Include presentation materials in the

TIM minutes and include in the title “[insert SOW Para. Number and PDRD Rev #.# here].”

Block 9: Mark all CDRL items with the distribution statement as shown above in Block 9 and with the following additional statement: "The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do not apply to those items identified as technical data or computer software to be furnished with restrictions.

1. Sequence Number A007

2. Title Engineering Support Data (Rhinestone 0.1.1 Design, Manufacturing and Mechanical Files)

3. Subtitle ESD (3.3.1.7 PDRD Rev 1.0, and 3.3.2.1 Manufacturing Data)

4. Authority DI-ATTS-80285C NOT 1

5. Contract Reference Para. 3.3.1.7 and 3.3.2.1

6. Requiring Office DMEA/MEAC

7. DD 250 Req LT

8. App Code N/A

9. Distribution Statement Req’d DISTRIBUTION F. Further dissemination only as directed by the

Defense Micro Electronics Activity (May 2022) or higher DoD authority.

10. Frequency ASREQ

11. As of Revision and Date

12. Date of First Submission 10 calendar days after TIM

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

15. Total See Distribution List

16. Remarks See 3.3.1.1 Design File Format/Requirements paragraph above for all technical design files. Include in the title “[insert SOW Para. Number and PDRD Rev #.# here].”

Block 9: Mark all CDRL items with the distribution statement as shown above in Block 9 and with the following additional statement: "The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do not apply to those items identified as technical data or computer software to be furnished with restrictions.

5.0 POINTS OF CONTACT:

DMEA/MEA PROJECT ENGINEER:

Address: 4234 54th Street McClellan, CA 95652-2100 Voice:

E-Mail:

DMEA/MEAC SME:

Address: 4234 54th Street McClellan, CA 95652-2100 Voice:

E-Mail: