Statement of Work.pdf
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- Attached to
- Amendment 1 to Automatic Wire Bonder Federal contract opportunity
- Solicitation number
- 1333ND26QNB030043
About this file
This is a Statement of Work for the procurement of an automatic wire bonder system by the National Institute of Standards and Technology (NIST), Physical Measurement Laboratory, Nanoscale Device Characterization Division. NIST requires a new, commercial-grade automatic wire bonder for the Memory Device Characterization Platform project (Lab GC6.05) to bond highly dense, micrometer-sized wires on semiconductor chips. The tool must be fully automatic except for sample loading and capable of completing 256 consecutive bonds on chips with 10 x 10 mm die sizes onto 50 x 50 mm ceramic packages. The system must be ball-wedge type, accept gold wire ranging from 0.5 to 1 mil diameter, accommodate wire lengths up to 8 mm, and bond 50 x 50 micrometer pads with 80 micrometer pitch. The equipment must include a microscope with LCD screen and the ability to pause for mid-bonding inspection. Delivery is due within 16 weeks to NIST in Gaithersburg, Maryland, with F.O.B. Destination terms.
The contractor must install the system within two weeks of delivery, provide operator training for up to two users within two weeks of installation, and supply complete documentation including installation manuals, utility requirements, and system schematics at contract award. The system must meet performance testing requirements, including successful bonding of a CPG25604 ceramic package and NIST 20k chip, with NIST reserving discretion to forego functional testing. Payment is 100 percent upon installation, acceptance, and successful testing and demonstration of system performance. The contractor must provide a minimum one-year warranty covering defective parts and offer service contract options for routine maintenance and repair. The system must comply with cybersecurity and privacy requirements consistent with FISMA, OMB Circular A-130, and NIST SP 800-171, with minimally acceptable controls including system security plans, secure configuration management, multi-factor authentication, encryption (TLS 1.2 or better in transit, FIPS 140-2/140-3 validated encryption at rest), and incident response procedures. All equipment must be new, original manufacturer packaging with original documentation, and "gray market" components are not acceptable.
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| File | Type | Posted |
|---|---|---|
| CSS Provisions and Clauses.docx | DOCX document | |
| Combined Synopsis Solicitation.docx | DOCX document | |
| Statement of Work.pdf |
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Text version
STATEMENT OF WORK
Title: Automatic Wire Bonder
Lab: GC6.05 Memory Device Characterization Platform
I. BACKGROUND INFORMATION
The National Institute of Standards and Technology, (NIST) Physical Measurement Laboratory, (PML), Nanoscale Device Characterization Division, (NDCD), Alternative Computing Group, (ACG), requires the purchase of an automatic wire bonder capable of bonding highly dense, very fine wires for chips produced in this project. This project requires the development of a memory device characterization platform in which emerging technologies will be assessed for their potential in memory applications. To perform characterization, the project requires connecting chips with various footprints onto the platform that performs measurements. Connection is performed by passing a multitude of wires (256 or more) from the chip to a ceramic package that slots into the platform for testing. Wire bonders exist at NIST in other OUs or divisions. The current wire bonders are completely manual and would require extensive time to complete bonding of a single chip. This project could produce tens to hundreds of chips. If purchased, an automatic wire bonder will enable access to advanced packaging methods for emerging technologies without breaking the project’s chain of custody.
II. PURPOSE
The Memory device characterization platform project requires an automatic wire bonder to bond hundreds of novel memory technologies for characterization. This automatic wire bonder will enable high throughput production of highly dense wire bonds for scaled memory characterization applications. For example, one memory test vehicle within our project requires 256 bonds made: each of these bonds are micrometer in size equidistant. Our work aims to build testbeds to evaluate the potential for new materials and devices to be used in next generation chips. This wire bonder will enable us to complete our project deliverables within the proposed time frame, without having to spend hours manually bonding, or lose chain of custody by sending the chips out to vendors.
As stated above, this tool is crucial to performing the listed items for this project. Without such automatic wire bonder, the project will be unable to maintain a high enough throughput to allow characterization of many memory technologies nor allow for enough measurements to gather statistics on each type of device. Seeing as bonding is needed to test any chip, the request for the tool this year is justified to begin the rest of the work as soon as possible. By investing in a tool such as this, we position not only this project, but all projects at NIST that are investigating properties of scaled chips in the new era of semiconductors.
III. MINIMUM REQUIREMENTS
The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered.
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The use of “gray market” components are not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.
Line Item 0001:
Description: Automatic wire bonder Quantity: 1
A. Technical Specifications
a. Tool shall be fully automatable, with the only manual aspect being the loading of the sample
b. The tool shall be capable of bonding die sizes of 10 x 10 mm
c. The tool shall be capable of accepting ceramic packages of 50 x 50 mm with a mechanism for lock down
d. The tool shall be of ball-wedge type
e. The tool shall be capable of completing 256 consecutive bonds
f. The tool shall accept Au wire
g. The tool shall be capable of bonding wires as long as 8 mm
h. The tool shall be capable of bonding 50 x 50 um pads
i. The tool shall be capable to bonding across pads with a 80 um pitch
j. The tool shall accept wire with sizes from 0.5 mil to 1 mil
k. The tool will come equipped with a microscope and LCD screen
l. The tool will have the ability to pause the bonding process for mid bonding inspection
IV. SCHEDULE OF DELIVERABLES
Deliverable Number Description Quantity Due Date
Place of Delivery
1 Automatic wire bonder
1 16 weeks NIST (Gaithersburg)
2 Other related transportation expenses at time of delivery if applicable NTE.
Standards of Acceptance: The NIST TPOC shall review all the above deliverables and respond with an acceptance or request for revision email to the Contractor Technical Point of Contact (TPOC) within 2 weeks of receipt of deliverable.
PLACE OF PERFORMANCE
Work will be performed at NIST (Gaithersburg)
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PERIOD OF PERFORMANCE
16 weeks
V. DELIVERY TERMS
Delivery shall be F.O.B Destination (or equivalent incoterms, such as DDP) and shall occur in accordance with the delivery due dates provided in the below table.
FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery.
The contractor shall deliver all Line Items to:
National Institute of Standards and Technology
Shipping and Receiving
100 Bureau Drive, Building 301
Gaithersburg, MD 20899
Attn: TBD 216/C102
VI. INSTALLATION
The system shall be installed by the Contractor and meet contract specifications no later than 2 weeks after delivery. Installation, at a minimum, shall include uncrating/unpackaging of all equipment, rigging, set-up and hook-up of the system, demonstration of all specifications, and removal of trash. Onsite installation and demonstration shall be done at NIST, (Gaithersburg, MD-
Building C102.) All installation requirements are identified below: (please remember to include site preparation if applicable)
a. The vendor shall inform TPOC of any voltage requirements for the tool 2 weeks in advance in preparation for arrival as well as any other infrastructural requirements for installation
VII. TRAINING
The contractor shall conduct training session for up to 2 users at NIST. The training shall provide a thorough demonstration of all system/solution functions, maintenance, data administration, and basic troubleshooting. The training may be completed at NIST Monday – Friday during the operating hours of 8am to 5 pm immediately after installation and demonstration of specifications and must be completed no later than 2 weeks after installation. Further training requirements are identified below
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a. After the system passes the site acceptance test, the contractor shall train users on the operation and maintenance of the system.
b. The contractor shall supply the initial installation manual, utility requirements, full system design schematics, and a diagram showing the tool footprint, measurements, and wall penetrations for the system at the time of award.
VIII. INSPECTION & ACCEPTANCE
In addition to the inspection and acceptance terms articulated in the specific FAR clause that allows the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.
Performance Tests:
1. Complete bonding of CPG25604 ceramic package and NIST 20k chip with inspection of bonds and chip performance.
a) This includes the inspection of incomplete bonds or failure to meet specs listed above in technical requirements
NIST may choose at its discretion to forego this part of acceptance testing.
A visual inspection of the equipment will be performed by the NIST POC to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.
Ownership of the equipment shall transfer to NIST upon acceptance by the Government.
The Government will test, inspect, and accept or reject the equipment within 10 working days of the receipt of the equipment unless otherwise indicated above. The Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.
IX. WARRANTY
The contractor shall warranty the entire system for a period of a minimum of 1 year after receipt of the equipment and shall be in accordance with terms in FAR 52.212-4.
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Warranty shall commence upon acceptance of the system by the Government and at a minimum shall include the following:
Replacement of any defective parts that compromise use of the tool.
The vendor will also offer service contract options for routine maintenance and repair of the tool
X. PAYMENT SCHEDULE
Define how the contractor will be paid if more information besides what is included in the payment clause is needed. If firm-fixed-price construction, for example, it may warrant further definition.
The Contractor will be paid, in accordance with the payments clause in the contract and as otherwise noted in this document, upon receipt of a proper invoice.
1. 100% after installation and acceptance by the POC of fully installed system, AND
2. After the successful completion of the testing requirements set forth in this document under section set forth in this document, AND
3. After successful demonstration by the instrumentation that it performs in accordance with the requirements set forth in this document.
NOTE: Partial shipments and partial invoices will not be accepted, unless otherwise requested and accepted by the Contracting Officer prior to award offer.
Proposed payment schedules shall be submitted with vendor’s response to the
RFQ for consideration.
XI. CYBERSECURITY PRIVACY REQUIREMENTS
NIST seeks a solution that provides security and privacy protection consistent with requirements defined by applicable federal laws, regulations, policies, and standards
(e.g., the Federal Information Security Management Act (FISMA), OMB Circular A-130, and FIPS Publication 200). The solution provider (including subcontractors) may meet these requirements through various means, including but not limited to FedRAMP authorization, current third-party assessments (e.g., SSAE, PCI), and/or responses to
NIST special publication control set SP 800-171.
Minimally Acceptable Controls
• System security plan describing physical, technical, and administrative controls implemented to protect systems and sensitive personally identifiable information
(SPII).
• IT management processes to establish and manage secure configuration baselines including routine patching for all operating systems and applications.
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• Access to SPII is restricted to those with a need to know. Personnel with access to SPII have background investigations performed (e.g. criminal, financial etc.), and are trained on secure handling of SPII.
• Access Controls for SPII meet or exceed industry best practices for access and identification control including, but not limited to, connectivity to servers and databases, multi-factor authentication for remote accesses for administration, secure configurations for any devices accessing the system, and strong physical security for any place where the data is accessed.
• The solution supports multifactor authentication for users and/or supports integration with customer federation services for Single-Sign capability.
• Processes for scanning on a continual basis for vulnerabilities and proper configurations for all aspects of the system, as well as processes for timely mitigation of findings.
• Auditing and Incident Response processes including customer notification of suspected or actual incidents and logging with sufficient information to perform forensics on any incident. Processes for notifying and providing appropriate mitigations, including but not limited to credit monitoring services, for subsidy applicants in the event of suspected or actual incidents.
• SPII is encrypted in transit using TLS 1.2 or better and encrypted at rest in all places the SPII is stored. All encryption algorithms and modules are FIPS 140- 2/140-3 validated.
If unable to meet any of the requirements listed above, the solution provider may provide details of mitigations or alternative protections in place to ensure the appropriate handling and protection of SPII.
If the solution provider provides services to other Federal agencies, provide a general description of the security risk management approach and client point of contact.
XII. REQUIREMENTS FOR CONTRACTOR PERSONNEL
Identify all qualifications that the Contractor and/or their personnel working on this contract must possess.
Safety: The Contractor employee must be responsible for knowing and complying with all installation safety prevention regulations. Such regulations include, but are not limited to, general safety, fire prevention, and waste disposal.
Security: NIST is a restricted campus. An identification badge is required for access for entry into buildings and is shown to the armed Security Police when entering the campus.
Identification Badges: Contractor employees must comply with NIST identification and access requirements. Each Contractor employee must wear a visible identification badge provided by the NIST Security Office.
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Vehicle Registration: All Contractor employees must register their vehicles with the
NIST Security Office to gain access to the campus. A valid driver’s license, Government-furnished civilian ID, proof of insurance and current registration must be presented to the NIST Security Office, at which time a NIST vehicle pass will be issued.
The pass must be displayed on the vehicle in accordance with NIST Security Office instructions.
Media Inquiries: The Contractor shall not respond to any media inquiries. Any inquiries from the media shall be immediately relayed to the NIST COR and/or Contracting Officer (CO). There shall be no interviews, comments, or any other response without the knowledge and approval of the NIST COR or Designated Government Official.
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