TFLP Chips Requirement.pdf
PDF 101 KB Posted
- Attached to
- Thin-Film Lithium Niobate (TFLN) Photonic Chips
- Solicitation number
- NIST-RFQ-25-7700689
About this file
This is a Requirements Document from NIST for the procurement of custom thin-film lithium niobate (TFLN) photonic chips for quantum communications and networking research. The document outlines requirements for both design support and fabrication services.
The contractor must provide a design manual and process development kit (PDK) allowing NIST to custom-design TFLN photonic chips with capabilities including waveguides, micro rings, delay lines, couplers, and electronic components, with a minimum chip size of 45 mm². Following design consultation and NIST approval, the contractor shall fabricate seven TFLN photonic chips using x-cut thin-film lithium niobate with specific layer requirements (400-700 nm thickness on 2+ micrometer silicon dioxide layer on silicon handle wafer). The period of performance is 10 months from award, with fabrication completed within 4 months of design finalization. Delivery is FOB Destination to NIST's Gaithersburg, MD facility within two weeks after fabrication. Payment terms are Net-30 upon acceptance of deliverables.
View the file
Other files
| File | Type | Posted |
|---|---|---|
| Solicitation TFLN Final _Amend1.pdf | ||
| Q_A TFLN.pdf | ||
| Solicitation TFLN.pdf | ||
| Provisions Clauses.pdf |
On GovTribe
Work with this file
- Download the original file
- Contacts named in this file
- Similar government files
- Ask GovTribe AI about this file
Text version
NIST Requirements Document Thin-Film Lithium Niobate (TFLN) Photonic Chips
I. Background:
The Information Technology Laboratory (ITL) at the National Institute of Standards and Technology (NIST) performs research in quantum communications and networking. ITL is investigating integrated optics using the thin-film lithium niobate (TFLN) platform for manipulating optical states and for performing quantum measurements.
II. Purpose:
The purpose of this acquisition is to procure fabricated TFLN photonic chips with designs specified by NIST.
III. Requirements:
A. Design Support for TFLN Photonic Chips
The Contractor shall provide the Government with a design manual and process development kit (PDK) which allows the Government to custom-design TFLN photonic chips. At a minimum, the design manual and PDK shall allow for the following design capabilities:
• Optical components including waveguides, micro rings, delay lines, 1x2 and
2x2 couplers, edge couplers and surface grating couplers.
• Electronic components including electrical lines and heaters
• Chip size of at least 45 mm2
The Contractor shall provide consultation support services to aid in the chip design process. Consultation support shall confirm that the custom-design is viable for fabrication and use. NIST will approve the final design.
B. Fabrication of Designed TFLN Photonic Chips
The Contractor shall fabricate seven TFLN photonic chips in accordance with the final custom-design TFLN photonic chip developed under Requirement A above.
• Chips shall be fabricated using x-cut thin-film lithium niobate (TFLN) o The lithium niobate film thickness shall be between 400 nm to 700 nm.
o The TFLN layer shall sit on top of a silicon dioxide layer of at least 2 micrometers, which shall sit on top of a silicon handle wafer
Fabrication shall be completed within four months following design finalization.
IV. Period of Performance / Delivery Requirements
The period of performance shall be ten months from date of award and the Contractor shall deliver the fabricated chips to NIST within two weeks after fabrication. Chips shall be delivered FOB Destination.
FOB Destination means the contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in this document, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment at the delivery point specified in this document; and pay all charges to the specified point of delivery.
The delivery shall be made to the NIST Shipping and Receiving address identified below. The delivery will then be directed to the equipment’s final destination, also identified below.
NIST Shipping & Receiving 100 Bureau Drive Building 301 Gaithersburg, MD 20899-0001
NIST Final Delivery Destination 100 Bureau Drive Building 222, Room B225 Gaithersburg, MD 20899-8913
V. Inspection and Acceptance:
In addition to the inspection and acceptance terms articulated in 52.212-4, the Government will inspect the delivery to ensure that all products are provided in accordance with the requirements identified in this Statement of Work. Delivered products found to be deficient or damaged shall be replaced by the Contractor at the Contractor’s expense.
VI. Payment Terms
The Contractor will be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice for accepted deliverables.
File details come from the government source that posted it. Updated .