Q_A TFLN.pdf
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- Attached to
- Thin-Film Lithium Niobate (TFLN) Photonic Chips
- Solicitation number
- NIST-RFQ-25-7700689
About this file
This document is a Questions and Answers (Q&A) file for Solicitation No. NIST-RFQ-25-7700689 for Thin-Film Lithium Niobate (TFLN) Photonic Chips. The Q&A provides detailed clarifications about technical specifications for photonic chip development, including contractor sourcing responsibilities, wafer form factors, optical coupling structures, and fabrication preferences. Key technical points include NIST's preference for etched lithium niobate thin film waveguides, patterned TFLN, minimal waveguide loss (less than 0.3 dB/cm), and edge/surface grating couplers with losses less than 6 dB.
The related federal contract opportunity is a Request for Quotation (RFQ) issued by the National Institute of Standards and Technology's Information Technology Laboratory for quantum communications research. The procurement seeks fabricated TFLN photonic chips with a ten-month performance period, requiring quotation submission by March 12, 2025. The award will be a firm fixed-price purchase order, with an unrestricted competition open to small and other than small businesses under NAICS code 334413. Evaluation will use a best value trade-off method, considering technical approach, corporate experience, and pricing, with technical factors being more important than price.
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Other files
| File | Type | Posted |
|---|---|---|
| Solicitation TFLN Final _Amend1.pdf | ||
| Solicitation TFLN.pdf | ||
| Provisions Clauses.pdf | ||
| TFLP Chips Requirement.pdf |
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Questions & Answers Solicitation No. NIST-RFQ-25-7700689 Thin-Film Lithium Niobate Photonic Chips
1. What is the source of TFLNB?
It is the contractor’s responsibility to source thin film lithium niobate.
2. PIC flow - what wafer form factor is required (200mm, 300mm)?
There is no set wafer form factor requirement. The contractor shall propose its best solution given the requirements in the solicitation.
3. TFLNB on 2um box - what optical coupling structure is envisioned and what are the total coupling and modulation losses required. What extra WG layers are expected between the box and the TFLNB? Do they plan on using SiN or SOI WG's? Patterned TFLN or blanket?
NIST does not expect any extra waveguide layers between the lithium niobate thin film and the buried oxide. If there is metallization, it may be above the lithium niobate thin film layer.
The contractor shall propose its best solution based on the requirements in the solicitation. NIST prefers, but does not require, etched lithium niobate thin film waveguides rather than SiN or SOI WG's. NIST prefers, but does not require, patterned TFLN rather than blanket.
4. Electrical contacts - how is the electric field modulation going to be implemented -proximity, ohmic, or plasmonic. Is the material expected to be polled and if so at what voltage/efield?
Electrical field modulation shall be implemented in accordance with the contractor’s best proposal given the solicitation’s requirements.
NIST does not expect to pole the lithium niobate.
5. TFLNB material transfer onto the PIC - W2W, D2W, are ridge/slab etches required in the TFLNB material. What area density of TFLNB is expected on the PIC?
The contractor shall propose its best solution based on the requirements in the solicitation. NIST prefers, but does not require, TFLN ridge waveguides formed by etching of the lithium niobate layer.
6. Is planarization or encapsulation of the TFLNB required - if so, what thickness, index, guided wavelength targets?
No. Neither planarization nor encapsulation are required.
7. Do FoMs for TFLNB photonic structures include passives interconnect, phase-therm phase shifter, ....?
NIST understands the question to be “do figures of merit (FOMs) for the thin-film lithium niobate photonic structures include FOMs for passives, for interconnects and for thermal phase shifters?” NIST provides the following answer based on this understanding: NIST desires minimal waveguide loss; less than 0.3 dB/cm is preferred. NIST prefers to use both edge couplers and surface grating couplers. For the latter, NIST prefers the loss per couplers to be less than 6 dB. Note that preferences, while considered during evaluation, are not requirements.
The contractor shall propose its best solution based on the solicitation requirements.
8. Is cryogenic stress of the material stack required?
No. No cryogenic stress of the material stack is required.
9. Are all the optical components in SiPh or SiN and not fabricated in the TFLN?
The contractor shall propose its best solution based on the requirements in the solicitation. NIST prefers etching of the TFLN with waveguiding inside the lithium niobate.
10. Can TFLN be a D2W coupon or possibly patterned?
The contractor shall propose its best solution based on the requirements in the solicitation.
- End of Document -
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