Statement of Requirements.docx

STATEMENT OF REQUIREMENTS DOCUMENT

TITLE: BMF HF Vapor Etcher REQUESTING LAB / DIVISION / GROUP: PML/PML Head Quarters/BMF

PURCHASE REQUEST NUMBER:

I. BACKGROUND INFORMATION

a. NIST-Boulder has a state-of-the-art research laboratory (the Katharine Blodgett Gebbie Building) to support the most sensitive research done at NIST. Included in this building is a Class 100 microelectronics fabrication facility, called the Boulder Micro-Fabrication Facility (BMF). One of the tools in the BMF is a Hydrofluoric Acid (HF) vapor etcher that is used to remove films from substrates. The BMF currently has a system that can etch substrates with a size of up to 100 mm, but the BMF requires a system that can etch substrates with a size of up to 150 mm.

PURPOSE/OBJECTIVE: The purpose of this contract is to provide the Government with a HF vapor etching system that meets the needs of the BMF community.

II. SCOPE

a. The goal of this contract is to:

i. provide the Government with the required HF vapor etcher and accessories necessary to meet the needs of the BMF community.

ii. Provide an option for a trade in credit for the Government’s existing HF vapor etcher unit.

III. MINIMUM REQUIREMENTS

The Contractor shall provide a system that meets all technical specifications identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered. The use of “gray market” components are not authorized for sale in the U.S. by the Contractor is not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.

Line Item 0001: HF Vapor Etch Unit Description: HF Vapor Etch Unit Quantity: one (1)

a. The contractor shall supply the Government with an HF vapor unit that meets the following requirements:

i. Due to the extreme danger of HF, the HF vapor etching unit must meet all industry standards for HF.

ii. Only units that use liquid HF for a vapor source will be considered. HF gas units are not technically acceptable due to the hazards of HF in a gas state. The Government has a preference for units that use roughly 48 % HF in water, but other concentrations may be acceptable as long as the unit meets all other technical requirements.

iii. The unit must be able to etch substrates using an HF vapor provided by a liquid in accordance with semiconductor industry standards. It must be able to perform an etch similar to the following protocol:

1. A user loads a substrate that is attached to a holder

2. The holder is able to be heated

3. The substrate is placed over the HF

4. The substrate is etched

5. The substrate is removed

iv. The unit shall meet the following safety requirements:

1. Be constructed such that any surface which comes in contact with a process chemical shall be constructed of material which is resistant to that chemical, specifically 48 % HF.

2. Must meet all industry safety requirements for storing, processing, and maintaining 48 % HF.

3. Allows users to process samples in a way that allows them to not interact with HF. Examples could include: HF liquid could be stored in a reservoir and transferred to an interaction space with the substrate and holder making a seal, HF liquid could be stored below the substrate and exposure to the HF is with a valve, or any other method where a user can process their sample without directly interacting with liquid HF. The only interaction with liquid HF must be able to occur only with maintenance staff for occasional filling and cleaning.

4. A safety device to prevent the sample from falling off of the clamp and into the HF liquid. Examples could include a screen or similar device.

v. The unit shall meet the following physical requirements:

1. Be constructed with materials that are compatible for use in an ISO Class 5 cleanroom.

2. The process unit must be able a tabletop unit that is able to fit on a wet bench. For the process unit with HF, the currently available space is roughly 25 cm x 40 cm x 25 cm (W x L x H). Units slightly large may be technically acceptable depending if they can fit on a wet bench surface. Preference will be given to units that fit in the listed space.

3. Any holders, arms, clamps, etc. are not included in this space, but must be able to fit on a wet bench and take up a smaller size than the HF unit.

4. Any required control electronics must be able to sit on top of the wet bench in a space that is roughly 30 cm x 30 cm x 10 cm (W x L x H).

5. Must be able to mechanically clamp and secure substrates to the processing unit. The unit must be able to mechanically clamp substrates with the following size:

a. Chips down to a size of 5 x 5 mm.

b. Wafers with a lateral dimension of a SEMI spec 3 inch (76.2 mm) wafer

c. Wafers with a lateral dimension of a SEMI spec 100 mm wafer

d. Wafers with a lateral dimension of a SEMI spec 150 mm wafer

e. Preference will be given to systems that also provide an electrostatic chuck or holder system to secure substrates.

6. The system shall be able to reuse HF for multiple runs. It is not acceptable to have a user pour new liquid into the system every time a user runs a process.

7. Be powered by 120 V, 60 Hz, 20 A electrical power.

vi. The unit shall be able to meet the following processing requirements:

1. SiO2 Etch rate: 3 – 30 um/hour

2. Etch Uniformity: Typically 90 % with 50 % guaranteed with a 3 mm exclusion zone around the edge.

3. Have the ability to heat substrates to at least 35 – 60 C with appropriate temperature control.

4. The substrate being etched must be able to come out of the etcher totally dry and able to be totally free of HF residue.

Line Item 0002: OPTION: Credit for the Government’s existing HF vapor unit Description: OPTION: Credit for the Government’s existing HF vapor unit Quantity: one (1) A. Technical Specifications

a. The contractor may provide an option to receive the Government’s existing Idonus VPE 100 system for a credit that will be applied to CLIN 0001. Preference will be given to contractors that will offer a credit.

IV. DELIVERABLES

Standards of Acceptance: The NIST TPOC or COR shall review the HF vapor etching system and respond with an acceptance or request for revision email to the Contractor Point of Contact (POC) within 30 days of receipt of deliverable. This section applies to deliverables which must be reviewed and approved for acceptances (draft plans, drawings, etc.)

V. PLACE OF PERFORMANCE

Contractor’s facility

VI. PERIOD OF PERFORMANCE/LEAD TIME

1 year ARO

VII. DELIVERY TERMS

Delivery shall be F.O.B Destination and shall occur in accordance with the delivery due dates provided in the above table.

FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The contractor shall deliver all Line Items to:

National Institute of Standards and Technology 325 Broadway M.S. 680.09 Attn: TBD at time of award Boulder, CO 80305

***Due to ongoing limited site access of the NIST facilities, the Awardee SHALL confirm with the Designated Government Official and the Contracting Officer prior to ANY shipment to NIST***

VIII. INSPECTION AND ACCEPTANCE

In addition to the inspection and acceptance terms articulated in 52.212-4, the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.

Performance Tests:

The Government will test that

1. SiO2 Etch rate: 3 – 30 um/hour

2. Etch Uniformity: Typically 90 % with 50 % guaranteed with a 3 mm exclusion zone around the edge.

Using a 150 mm wafer with a SiO2 film. The Government will measure the film thickness before and after etching using an ellipsometer to determine etch uniformity.

NIST may choose at its discretion to forego this part of acceptance testing.

A visual inspection of the equipment will be performed by the NIST TPOC to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.

Ownership of the equipment shall transfer to NIST upon acceptance by the Government.

The Government will test, inspect, and accept or reject the equipment within 30 days of the receipt of the equipment unless otherwise indicated above. The Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.

IX. WARRANTY

The contractor shall warranty the entire system for a period of a minimum of (enter required warranty term) after receipt of the equipment and shall be in accordance with terms in FAR 52.212-4. Warranty shall commence upon acceptance of the system by the Government and at a minimum shall include the following:

X. PAYMENT SCHEDULE (This section to be revised as needed) Advance payment is not authorized. The Contractor must invoice in arrears according to the payment schedule. The Contractor shall be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice, in accordance with the following schedule:

1. 100% after installation and acceptance by the TPOC of fully installed system, AND

1. After the successful completion of the testing requirements set forth in this document under section set forth in this document, AND

1. After successful demonstration by the instrumentation that it performs IAW the technical requirements set forth in this document AND

1. After receiving an invoice submitted properly, IAW the purchase order terms and conditions.

NOTE: Partial shipments and partial invoices will not be accepted, unless otherwise requested and accepted by the Contracting Officer prior to award offer. Proposed payment schedules shall be submitted with vendor’s response to the RFQ for consideration.