SOW Q-NEXT Inductively Coupled Etching System.pdf

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Inductively Coupled Etching System
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Statement of Work Summary: Q-NEXT Inductively Coupled Etching System

This Statement of Work defines requirements for procuring one advanced inductively coupled plasma (ICP) etching system with atomic layer etching (ALE) capabilities for Argonne National Laboratory. The system must support precision plasma etching of diamond thin films, devices, quantum materials, compound semiconductors, refractory metals, dielectric materials, and low-dimensional diamond platforms. The contractor shall furnish a complete, integrated research-grade system capable of both ICP-reactive ion etching and ALE process development, with deliverables including equipment design and manufacture, delivery, installation, startup, site acceptance testing, operator and maintenance training, comprehensive documentation, spare parts, warranty coverage, and technical support as specified in the quoted configuration.

The system must meet specific technical requirements including load-lock architecture, reaction chamber with in situ optical monitoring, substrate electrode temperature control from approximately -20°C to 200°C with electrostatic chuck and helium backside cooling, support for 3-inch, 4-inch, and 6-inch wafers plus smaller sample formats, ICP plasma source at 13.56 MHz (nominally 1 kW), bias RF power at 13.56 MHz (nominally 300 W), turbomolecular pumping capacity nominally 1300 L/s, and chamber wall heating capability at 70°C. The contractor must provide five days of onsite installation and training services by qualified engineers, with delivery nominally within eight months of order acceptance. Work shall be performed at the contractor's facility for design and fabrication, with delivery, installation, startup, training, and acceptance testing occurring at Argonne National Laboratory in Lemont, Illinois. The period of performance extends from contract award through equipment delivery, installation, acceptance, training, and warranty commencement.

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APPENDIX B

Statement of Work

SOW for Q-NEXT Inductively Coupled Etching System Project title: Q-NEXT Inductively Coupled Etching System

Project No.: G6-068006 Version created date: 4/27/26

Version #: 0 Period of Performance: From contract award through delivery, installation, acceptance, training, and warranty commencement Version status: Final

Abstract or description

This Statement of Work defines the requirements for the procurement of one advanced inductively coupled plasma etching system with atomic layer etching capabilities to support Argonne National Laboratory research in quantum materials, diamond thin films and devices, compound semiconductors, refractory metals, dielectric materials, and low dimensional diamond platforms. The system shall support both inductively coupled plasma reactive ion etching and atomic layer etching process development, with high precision, reproducibility, customized substrate handling, robust thermal control, and operator safety features suitable for research operation.

Contents

1. Background

2. Scope

3. Objectives

4. Applicable Documents

5. Tasks

5.1 Provide Etching System

5.2 Facility Requirements and Utility Information

5.3 Delivery

5.4 Installation and Startup

5.5 Acceptance Testing

6. Deliverables, Timing, Location, and Documentation

6.1 Deliverables

6.2 Timing

6.3 Location

6.4 Documentation

7. Quality Assurance

8. Government-Owned Property

9. Security

10. Place of Performance

11. Period of Performance

12. Attachments

1 Background

Argonne National Laboratory requires an advanced dry etching platform to support Q-NEXT and related laboratory research involving precision plasma etching of diamond thin films, devices, and related advanced materials.

The system will be used for research and process development requiring both conventional inductively coupled plasma reactive ion etching and novel (main research topic) atomic layer etching recipes and capabilities. The intended work includes demanding etch applications that require stable low-pressure plasma operation, high process repeatability, precise substrate thermal control, support for multiple substrate sizes and sample formats, custom sample platen assemblies, and safe management of process by-products.

This Statement of Work is written in generic, performance-oriented terms and does not disclose supplier-confidential or proprietary design information.

2 Scope

The Contractor shall furnish one complete, integrated inductively coupled plasma etching system and all associated services and items included with the quoted configuration that are required to deliver, install, test, train, document, and support the system for research operation at Argonne National Laboratory.

The scope shall include, at a minimum:

• Equipment design, manufacture, and supply

• Delivery to Argonne National Laboratory

• Installation and startup

• Site acceptance testing and performance verification

• Operator and maintenance training

• Installation, operation, and maintenance documentation

• Spare parts included in the quoted configuration

• Warranty coverage included in the quoted configuration

• Technical or process support included in the quoted configuration

• Facility requirement review and utility verification information needed before shipment and installation

3 Objectives

The Contractor shall provide a system that meets the following objectives:

• Support precision etching of diamond thin films and devices

• Support both ICP-RIE and ALE process development within one integrated platform

• Enable flexible process development for quantum materials and advanced device fabrication

• Provide reproducible plasma processing performance over repeated and extended research use

• Provide robust substrate thermal control for sensitive and demanding etch processes

• Support direct processing of small sample formats

• Provide process monitoring, safety interlocks, and operator protections suitable for hazardous etch environments

• Support maintainability, serviceability, and sustained research uptime

The delivered system will be used to advance Argonne mission-driven research in nanofabrication, quantum materials, and advanced device processing.

4 Applicable Documents

The Contractor shall comply with the current revisions of applicable codes, standards, and contract documents relevant to the equipment and services provided under this Statement of Work, including as applicable:

• Contract and purchase order documents

• Approved technical submittals

• Manufacturer installation, operation, and maintenance requirements

• Applicable electrical, mechanical, and vacuum safety standards

• Applicable compressed gas and hazardous gas handling requirements

• Applicable Argonne safety, site access, and work control requirements for onsite activities

5 Tasks

5.1 Task 1 - Provide Etching System

The Contractor shall provide one complete research-grade inductively coupled plasma etching system configured for precision plasma etching and atomic layer etching process development.

The system shall include the following minimum functional and technical requirements:

1. Capability for both inductively coupled plasma reactive ion etching and atomic layer etching in a single integrated system.

2. Load-lock-based architecture for sample transfer and process chamber isolation.

3. Reaction chamber suitable for high-precision plasma etching of advanced research materials.

4. Chamber and gas delivery configuration compatible with chlorine-based chemistries and additional fluorine-, oxygen-, inert-, and related process gases appropriate for advanced materials etching and ALE development.

5. In situ optical monitoring or equivalent process endpoint capability suitable for research process development and observation.

6. Chamber configuration that supports reduced deposition buildup on critical surfaces and maintains process repeatability over extended operation.

7. Chamber and internal hardware configuration suitable for stable and reproducible plasma conditions for precision etching applications.

8. Design features that support process uniformity, repeatability, and reduced maintenance interruption during repeated research use.

9. Substrate electrode temperature control range from approximately -20 degrees Celsius to 200 degrees Celsius.

10. Electrostatic chuck capability with helium backside cooling for substrate thermal control and process repeatability.

11. Direct support for multiple wafer sizes, including approximately 3-inch, 4-inch, and 6-inch substrates, and smaller sample formats using direct chucking, carriers, trays, or equivalent means.

12. Capability for high process gas flow at low process pressure suitable for precision materials etching and ALE-related process conditions.

13. ICP plasma source power supply at 13.56 MHz, nominally 1 kW, with automatic matching.

14. Bias RF power supply at 13.56 MHz, nominally 300 W, with automatic matching.

15. Controlled air vent or equivalent operator protection feature to reduce exposure risk from process by-products during chamber access following applicable process conditions.

16. Chamber wall heating capability, nominally 70 degrees Celsius, for process stability and by-product management.

17. Dedicated dry pumping arrangement suitable for both load-lock and process chamber support and maintainable operation.

18. Turbomolecular pumping capacity nominally 1300 L/s for process chamber evacuation or equivalent performance.

19. System installation and training services by qualified company engineer(s) for a period of five days.

20. Delivery lead time consistent with the quoted configuration, nominally within eight months after receipt and acceptance of order, unless otherwise agreed in the contract.

5.2 Task 2 - Facility Requirements and Utility Information

The Contractor shall provide utility and facility requirement information for the delivered configuration, including as applicable:

• Electrical service requirements

• Process gas requirements

• Inert gas requirements

• Helium requirements

• Compressed air requirements

• Cooling water requirements

• Exhaust and ducting requirements

• Space, footprint, and access requirements

• Equipment dimensions and handling considerations

The Contractor shall provide this information in sufficient time to support Argonne facility preparation before shipment.

5.3 Task 3 - Delivery

The Contractor shall package, ship, and deliver the system, accessories, spare parts, and required documentation to Argonne National Laboratory.

5.4 Task 4 - Installation and Startup

The Contractor shall provide onsite installation and startup services sufficient to place the system into operational condition. Work shall include assembly, connection guidance, system initialization, operational checkout, and verification of major functions.

5.5 Task 5 - Acceptance Testing

The Contractor shall perform site acceptance testing and demonstration of system operation. Acceptance activities shall include:

• Basic functional checks

• Verification of major subsystems

• Initial operational testing

• Demonstration of recipe execution capability

• Performance verification consistent with quoted and approved system configuration

• Initial recipe setup support, as applicable

5.6 Task 6 - Training

The Contractor shall provide onsite training for Argonne personnel. Training shall cover:

• System operation

• Safety features and interlocks

• Routine maintenance

• Basic troubleshooting

• Basic recipe creation or editing

• Routine system health checks

5.7 Task 7 - Documentation

The Contractor shall furnish all documentation included in the quoted configuration and required to support installation, operation, maintenance, acceptance, and warranty administration.

5.8 Task 8 - Warranty and Support

The Contractor shall provide warranty coverage and post-installation support included in the quoted configuration, including technical or process support identified as part of the offering.

5.9 Task 9 - Spare Parts

The Contractor shall furnish any spare parts included in the quoted configuration.

6 Deliverables, Timing, Location, and Documentation

6.1 Deliverables

The Contractor shall provide the following deliverables:

1. One complete inductively coupled plasma etching system meeting this Statement of Work

2. All standard and included subsystems, accessories, and integrated components required for operation

3. Spare parts included in the quoted configuration

4. Delivery services

5. Installation and startup services

6. Site acceptance testing services

7. Onsite training services

8. Installation manual

9. Operation manual

10. Maintenance documentation

11. Performance or acceptance documentation included with the system

12. Utility and facility requirement documentation

13. Warranty documentation

14. Technical or process support included in the quoted configuration

6.2 Timing

Unless otherwise stated in the contract:

• Utility and facility requirement information shall be provided promptly after award and sufficiently in advance of shipment

• Equipment delivery shall occur within the agreed contract lead time, nominally eight months after receipt and acceptance of order

• Installation, startup, training, and acceptance testing shall occur after delivery on a mutually agreed schedule

6.3 Location

Delivery, installation, startup, training, and acceptance testing shall occur at Argonne National Laboratory, Lemont, Illinois, or at another Argonne location identified in writing after award.

6.4 Documentation

The Contractor shall provide documentation sufficient to verify and support delivery, installation, operation, maintenance, and acceptance, including as applicable:

• Packing list

• Shipping documentation

• Installation instructions

• Utility requirement information

• Operating instructions

• Maintenance instructions

• Safety information

• Spare parts information

• Test records

• Acceptance-related documentation

• Warranty information

• Support contact information

7 Quality Assurance

The Contractor shall provide new equipment and services that conform to the contract requirements and are free from defects in materials and workmanship.

At a minimum:

• The Contractor shall perform appropriate factory inspection and testing prior to shipment

• The Contractor shall identify any deviations from approved requirements for Argonne review

• The Contractor shall promptly disclose nonconformances that may affect safety, fit, function, performance, maintainability, or delivery

• Installation and acceptance activities shall verify that the delivered system is complete, operational, and materially consistent with the contracted configuration

• The Contractor shall provide qualified personnel for onsite installation, testing, and training

Acceptance shall be based on successful completion of delivery, installation, functional checkout, required documentation delivery, and onsite acceptance testing demonstrating that the system performs in accordance with this Statement of Work and the final contract.

8 Government-Owned Property

No government-owned property is anticipated to be furnished to the Contractor under this Statement of Work unless specifically identified in the contract.

9 Security

The Contractor shall comply with Argonne site access, badging, safety, escort, and work control requirements applicable to onsite performance.

No access to Argonne business information systems is authorized unless specifically approved by Argonne.

10 Place of Performance

Work under this Statement of Work shall be performed at the Contractor's facility and at Argonne National Laboratory, as applicable.

• Equipment design, fabrication, assembly, and pre-shipment testing shall occur at the Contractor's facility

• Delivery, installation, startup, training, and acceptance testing shall occur at Argonne National Laboratory

11 Period of Performance

The period of performance shall begin upon contract award and continue through equipment delivery, installation, startup, acceptance testing, training, and completion of documentation necessary to commence warranty coverage.

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