SOW 20-0J2 Redacted.pdf

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DMEA-5521 LVDT IC Production Assembly Federal contract opportunity
Solicitation number
HQ072720QRT11
Issued by
Defense Microelectronics Activity

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Statement of Work (SOW)

DMEA 20-0J2

26 June 2020

1.0 SCOPE:

1.1 TITLE: Production Assembly of DMEA-5521 LVDT IC (Re-order)

1.2 APPLICABILITY: To manufacture production units of the DMEA-5521 IC to support Columbia class submarines.

1.3 BACKGROUND: DMEA has been supporting new construction efforts for the Virginia class submarines since 2005 by re-engineering the Linear Variable Differential Transformer (LVDT) integrated circuit (IC) which is no longer available. This component is used in the Submersible Electronic Limit Switch (SELS) assembly on various classes of submarines. This task supports the package, assembly and test of the DMEA-5521 IC for new construction of the Columbia class submarines.

1.4 PURPOSE: The purpose of this SOW is to purchase Production Assembly and Test for the DMEA-5521 LVDT IC (Re-order). The Production Assembly consists of Wafer Dicing, Packaging, and Screening.

2.0 REFERENCE GOVERNMENT PROVIDED RESOURCES:

2.1 GOVERNMENT DOCUMENTS: The data package including a Microcircuit Design Specification (MDS) and bonding diagram (with package/lid drawings) are attached to this SOW.

2.2 OTHER DOCUMENTS: None.

2.3 GOVERNMENT FURNISHED EQUIPMENT: None.

2.4 GOVERNMENT FURNISHED INFORMATION: None.

2.5 GOVERNMENT FURNISHED FACILITIES/ACCESS: None.

2.6 GOVERNMENT FURNISHED MATERIAL: DMEA will provide ten (10) Renesas (Part Number ISL53514AWS2571) four (4) inch wafers to the contractor. After wafer dicing the 10 wafers, each die without an ink-dot and not at the outer edges of the wafer shall be packaged for assembly by the contractor.

3.0 REQUIREMENTS:

3.1 ENGINEERING REQUIREMENTS: The following is an itemized listing of contractor requirements for this task:

3.1.1. The contractor shall provide six hundred forty (640) 18-pin side-brazed ceramic packages (Kyocera KD- 77032) and six hundred forty (640) combo lids (Kyocera CL452715).

3.1.2. The contractor shall perform production assembly of 650 parts which includes: wafer dicing, military 2nd optical, die attach, 1.25 mil gold wire bonding, 3rd optical, sealing, serialization, top mark and lead trimming.

Unused die shall be waffle packed and sent back to DMEA.

3.1.3. The contractor shall perform 100% Screening according to MIL-STD-883, Method 5004 for Class B parts.

Screening shall include: Internal Visual (Method 2010), Temperature Cycling (Method 2010), Constant Acceleration (Method 2001), and Seal – Fine/Gross (Method 1014).

3.1.4. The contractor shall perform Group B and D testing per MIL-STD-883 (DMEA will perform electrical testing after Subgroup 3 and 4 of Group D testing):

GROUP B

Test MIL-STD-883

Method Condition Sample Size

Subgroup 2 Resistance to Solvent

2015 3 devices

Subgroup 3 Solderability

2003 Steam Age for 8 hours 22 lead from 3 devices

Subgroup 5 Bond Strength

2011 15 wires from 4 devices

GROUP D

Test MIL-STD-883

Method Condition Sample Size

Subgroup 1 Physical Dimension

15 devices

Subgroup 2 Lead Integrity Fine leak Gross leak

B = lead fatigue 45 leads min. from 3 devices

Subgroup 3 Thermal Shock Temperature cycle Moisture Resistance Visual Inspection

B= +125C to -55C, 15 cycles C= +150C to -65C, 100 cycles

Visual criteria of 1004 and 1010

15 devices

Subgroup 4 Mechanical Shock Vibration frequency Constant acceleration

B = 1500 g level A = 20 peak acceleration, g E = 30,000 g

15 devices

Subgroup 5 Salt Atmosphere Visual Inspection

A= 24 hours

15 devices

Subgroup 6 Internal Water Vapor

1018 5,000 ppm maximum water content at +100C

3 devices

Subgroup 7 Adhesion of lead finish

15 lead from 3 devices

3.1.5 Contractor shall provide all assembly and qualification test results, summarizing the Mil-Std-883 test results in binders See attached DD1423-1, data item A001.

3.1.6. Contractor shall provide anti-static shipping tubes.

3.1.7. Contractor shall ship the packaged parts in anti-static shipping tubes to the point of contact at DMEA.

3.2 PROGRAM MANAGEMENT: None.

3.3 TASK REQUIREMENTS: None.

3.4 PROGRAM SUMMARY: None.

4.0 POINTS OF CONTACT:

DMEA/

Address: 4234 54th Street McClellan, CA 95652-2100 Voice:

E-Mail:

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