SATPC0038463 Tab 04 4 SOW.pdf
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- Solicitation number
- 80NSSC25904091Q
About this file
This document is a Statement of Work (SOW) detailing NASA Glenn Research Center's specifications for a thin film optical measurement instrument. The Smart Sensing and Electronics System branch requires a new, table-top instrument with specific technical capabilities, including a wavelength range of 190-1700 nm, measurement range of 4 nm to 120 μm, microscope optics with a 15x objective, ability to simultaneously measure at least 3 layers, and compatibility with wafer pieces up to 6-inch wafers. Additional requirements include Windows 11 compatibility, stand-alone software that can be installed on any NASA computer, a 250 μm round aperture for MA-C mount, at least a 1-year warranty, and documented use in government, academic, or semiconductor R&D facilities. The instrument is intended for developing silicon carbide integrated circuits and sensors for aerospace applications, with a focus on obtaining accurate film thickness measurements at various processing stages.
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Specifications of Thin Film Optical Measurement Instrument The Smart Sensing and Electronics System branch at NASA Glenn Research Center (GRC) at Lewis Field focuses on developing silicon carbide (SiC) integrated circuits (ICs) and sensors for aerospace applications. NASA GRC needs an optical thin film measurement instrument to provide an accurate film thickness at various stages of processing.
The instrument should meet the following capabilities/specifications:
1. Must be new
2. Table-top unit
3. System Voltage: ~120 V 1-phase
4. Wavelength range 190~1700 nm
5. Measurement range 4 nm~120 μm
6. Microscope optics
7. 15x objective
8. At least 3 layers simultaneous measurement
9. Obtains Optical Constants (n & k) values
10. Manual Load / Manual Alignment
11. From wafer pieces to 6-inch wafer compatible
12. Windows 11 Compatible
13. SiO2-on-Si thickness standard
14. Stand-alone software: Software can be installed on any available computer at NASA and connected directly to system to obtain thickness measurement
15. 250 μm round aperture for MA-C mount
16. At least 1-yr. warranty
17. Documented use in Govt./academic/semiconductor R&D facilities
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