SATPC0036069 Tab 04 4 SOW 2.pdf
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- Attached to
- Semi-automated coating/developing platform for semiconductor fabrication Federal contract opportunity
- Solicitation number
- 80NSSC24878735Q
About this file
This document appears to be a Statement of Work (SOW) for a Semi-Automated Photoresist Spin Coater for semiconductor processing required by the National Aeronautics and Space Administration (NASA) Glenn Research Center.
The SOW outlines detailed technical specifications for the spin coater, including the ability to coat photoresist on round substrates from 100mm to 200mm diameter and square substrates from 100mm to 150mm, a Linux-based industrial PC with GUI, storage for over 20 recipes with up to 40 process steps, automated dispense systems, a rotating closed cover, a vacuum chuck, safety features, installation and training, and a 1-year warranty. The system is required to support NASA's development of silicon carbide integrated circuits and sensors.
This SOW is associated with a federal contract opportunity, Solicitation Number 80NSSC24878735Q, for a "Semi-automated coating/developing platform for semiconductor fabrication". This is a Brand Name or Equal To requirement set aside for small businesses, with net 30 FOB Destination payment terms. Vendors are required to provide their CAGE code, UEI number, delivery time/lead time, and any applicable shipping and discount information on their quotes.
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| SATPC0036069 Tab 10 1 RFQ Open Market.pdf | ||
| SATPC0036069 Tab 04 4 SOW 1.pdf |
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Text version
Specifications of Semi-Automated Photoresist Spin Coater for Semiconductor processing
The Smart Sensing and Electronics System branch at NASA Glenn Research Center (GRC) at Lewis Field focuses on developing silicon carbide (SiC) integrated circuits (ICs) and sensors for aerospace applications. NASA GRC solicits quotes for a Semi-Automated Photoresist Spin Coater to coat photoresist onto silicon carbide, silicon and other transparent substrates optimized for UV lithography. The photoresist spin coater should meet the following capabilities/specifications:
1. The system should be new.
2. Ability to coat photoresist on round substrate sizes from 100mm to 200mm diameter including transparent substrates.
3. Capable of depositing photoresist on square substrates with edge lengths from 100mm to
150mm.
4. Rotating closed cover during spin coating to improve film uniformity on square substrates and to minimize backside contamination.
5. Linux-based industrial PC with Graphical User Interface (GUI) screen to:
a. Monitor status of unit and supply tanks.
b. Monitors defined limits and recipe parameters.
c. Report deviations from (b).
6. Capable of storing more than 20 recipes.
7. Capable of up to 40 process steps in a recipe.
8. Built-in edge bead removal on the frontside of the wafer.
9. Backside rinse function.
10. Centering unit for centering the wafer during loading:
a. Mechanical centering of wafer.
b. Centering unit should be able to be operated with one hand.
c. Accuracy of +/- 0.2mm.
d. No mechanical change of parts required for round substrate sizes the system is capable of.
11. Automated dispense arm with two dispense mechanisms for photoresist:
a. First photoresist dispense system shall be a pneumatically driven PTFE bellows pump (IWAKI):
i. Capable of up to 15ml.
ii. Repeatability of +/- 0.2ml.
iii. Capable of pumping photoresists up to 500 cP.
b. Second photoresist dispense system shall be a pressurized dispense CPD system:
i. Time controlled dispense volume.
ii. Min. dispense volume: 1 ml
iii. Repeatability of +/- 5%.
iv. Capable of pumping photoresists from 400 cP to 4000 cP.
v. Consisting of:
1. Pressure vessel for one liter bottle
2. Pressure regulator with gauge; with dual pressure
3. Bubble sensor for empty detection
12. Solvent dispense mechanism with nozzle, with:
a. Flowmeter 25 – 250 ml/min.
b. Suck back valve.
13. Open bowl:
a. Max spin speed of at least 8000rpm +/- 1rpm.
b. Spin acceleration of 1-10000 rpm/s.
14. With rotating closed cover :
a. Electrically driven z-axis.
b. Mounting plate and hub.
15. Additional Vacuum chuck for use with rotating closed cover:
a. Full contact chuck
b. Max spin speed of at least 4000 rpm.
c. PEEK vacuum chuck with metal outer ring and 1mm spacers for thick resist.
16. Process Bowl with separate waste and exhaust channels.
17. Manual load and unloading of wafers.
18. Power requirement for system of 110-230V, 6.5A 50/60Hz single phase.
19. Safety hood cover with ability to see 360 degrees through the hood.
20. Vacuum connector on front of unit for connection of vacuum tweezers.
21. Sensors for detecting leakage, gas and exhaust.
22. Space inside the system (no additional external units) for waste bottle and dispense systems.
a. Included waste management with 1.5-liter waste bottle.
b. Included 5-liter solvent tank.
23. Total system size shall have a footprint of less than 750 by 1050 mm excluding electrical supply box.
24. Manuals provided in English for:
a. Tool operation.
b. Software operation.
c. Preventative maintenance.
d. Schematic diagrams of system.
e. Spare parts list.
25. Installation shall be provided for 3 days with instruction in basic usage.
26. Warranty of at least 1 year.
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