SATPC0036069 Tab 04 4 SOW 1.pdf
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- Attached to
- Semi-automated coating/developing platform for semiconductor fabrication Federal contract opportunity
- Solicitation number
- 80NSSC24878735Q
About this file
This document is a Statement of Work (SOW) for a Semi-Automated Photoresist Developer System for semiconductor processing at the NASA Glenn Research Center (GRC).
The SOW specifies the required capabilities and technical specifications for the developer system, including the ability to coat photoresist on round substrates from 100mm to 200mm diameter, as well as square substrates from 100mm to 150mm edge length. Key requirements include a Linux-based industrial PC with GUI, ability to store over 20 recipes with up to 40 process steps, DI water rinse functions, automated dispense arm, max spin speed of 6000rpm, and 1-year warranty. The system shall have a footprint less than 750 x 1050mm and be provided with manuals and installation/training.
This SOW is related to a federal contract opportunity (Solicitation Number 80NSSC24878735Q) issued by the NASA Shared Services Center, which is seeking a "Semi-automated coating/developing platform for semiconductor fabrication" on a brand name or equal basis, with the procurement set aside for small businesses.
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Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| SATPC0036069 Tab 10 1 RFQ Open Market.pdf | ||
| SATPC0036069 Tab 04 4 SOW 2.pdf |
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Text version
Specifications of Semi-Automated Photoresist Developer System for Semiconductor processing
The Smart Sensing and Electronics System branch at NASA Glenn Research Center (GRC) at Lewis Field focuses on developing silicon carbide (SiC) integrated circuits (ICs) and sensors for aerospace applications. NASA GRC solicits quotes for a Semi-Automated Developer to develop photoresist on silicon carbide, silicon and other transparent substrates. The photoresist developer system should meet the following capabilities/specifications:
1. The system should be new.
2. Ability to coat photoresist on round substrate sizes from 100mm to 200mm diameter including transparent substrates.
3. Capable of depositing photoresist on square substrates with edge lengths from 100mm to
150mm.
4. Linux-based industrial PC with Graphical User Interface (GUI) screen to:
a. Monitor status of unit and supply tanks.
b. Monitors defined limits and recipe parameters.
c. Report deviations from (b).
5. Capable of storing more than 20 recipes.
6. Capable of up to 40 process steps in a recipe.
7. DI water rinse function on the frontside of the wafer.
8. DI water rinse function on the backside of the wafer.
9. N2 from above onto wafer.
10. Centering unit for centering the wafer during loading:
a. Mechanical centering of wafer.
b. Centering unit should be able to be operated with one hand.
c. Accuracy of +/- 0.2mm.
d. No mechanical change of parts required for all substrate sizes the system is capable of.
11. Automated dispense arm with two dispense mechanisms for developer and DI water line:
a. First developer dispense system shall have:
i. Puddle dispense nozzle.
ii. Flow control valve with gauge.
iii. Pressure tank of 5 liters.
b. Second developer dispense system shall have:
i. Puddle dispense nozzle.
ii. Flow control valve with gauge.
iii. Pressure tank of 5 liters.
12. Open bowl set up for 100 to 200 mm round SEMI spec wafers:
a. Max spin speed of at least 6000rpm.
b. Max spin acceleration of at least 7000 rpm/s.
13. Process Bowl with separate waste and exhaust channels.
14. Manual load and unloading of wafers.
15. Power requirement for system of 110-230V, 6.5A 50/60Hz single phase.
16. Safety hood cover with ability to see 360 degrees through the hood.
17. Vacuum connector on front of unit for connection of vacuum tweezers.
18. Sensors for detecting leakage, gas, and exhaust.
19. Space inside the system (no additional external units) for waste bottle and dispense systems.
a. Included waste management with 1.5-liter waste bottle.
b. Two included 5-liter developer tanks.
20. Total system size shall have a footprint of less than 750 by 1050 mm excluding electrical supply box.
21. Manuals provided in English for:
a. Tool operation.
b. Software operation.
c. Preventative maintenance.
d. Schematic diagrams of system.
e. Spare parts list.
22. Installation shall be provided for 3 days with instruction in basic usage.
23. Warranty of at least 1 year.
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