RFP CR-373289_Attachment_D_Technical_Proposal_Worksheet.xlsx
XLSX spreadsheet 23 KB Posted
- Attached to
- LQ3 InfiniBAND CLUSTER
- Solicitation number
- RH-373289
About this file
This is a technical proposal worksheet template for a high-performance computing (HPC) cluster procurement. The document is Attachment D to RFP CR-373289, issued by the Department of Energy's Fermi National Accelerator Laboratory, and serves as the standardized configuration specification form that bidders must complete for the LQ3 InfiniBand Cluster solicitation (RH-373289). The worksheet requires detailed technical specifications across multiple hardware categories including motherboard characteristics (chipset, memory capacity, PCIe slots, BIOS capabilities, IPMI version, and thermal limits), onboard and 10 GigaEthernet adapters (brand, model, speed, and MAC addresses), solid-state drives (capacity, temperature, and power consumption), memory configuration (capacity, speed, ECC support, and thermal specifications), chassis design (dimensions, weight, cooling capacity, and accessibility features), power supply parameters (efficiency ratings, redundancy options, and thermal limits), and management infrastructure details.
The worksheet also mandates disclosure of system-level performance metrics including maximum boot current draw and idle current draw (with measurement methodology and voltage specifications), service support contact information and procedures, BIOS modification documentation, and burn-in testing procedures. Vendors must provide a proposal summary capturing key deployment parameters such as total nodes, nodes per rack, processor specifications, memory configuration, network interface details, power distribution unit specifications, and power consumption data (both measured stress-test and manufacturer maximum ratings). The template explicitly states that vendor responses will be treated as final and that Fermilab assumes no responsibility for inaccurate information provided in the submission.
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Other files
| File | Type | Posted |
|---|---|---|
| RFP CR-373289_Attachment_C_Cost_Proposal.xlsx | XLSX spreadsheet | |
| 4. BLANK Certificate of Insurance.pdf | ||
| 2. FFDG_ SARC_RepsCerts_v4_BLANK.pdf | ||
| RH_373289.docx | DOCX document | |
| 1. PUR-466_Proposal Certifications_r2_06.03.25.pdf | ||
| 5. Exhibit A.docx | DOCX document | |
| 3. 2022 Onsite Services Insurance Requirements.pdf | ||
| v3_SOW_FY25_LQ3_Attachment_A_Specification.docx | DOCX document |
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Text version
Technical Proposal ATTACHMENT D - Technical Proposal
The following Technical Proposal configuration worksheet must be filled in as part of the material submitted for every bid and every configuration.
| TECHNICAL CONTACTS | |
| Technical Contact Name | |
| Technical Contact Phone | |
| Technical Contact E-mail | |
| MOTHERBOARD | |
| Brand | |
| Model | |
| Chipset | |
| Maximum memory capacity | |
| Number of DIMM slots | |
| Number, speed and widths of PCIe 4.0 or 5.0 slots available (specify 4.0 or 5.0) | |
| Number of serial ports | |
| Number of USB ports available at the front of case | |
| Number of USB ports available at the rear of case | |
| Able to boot without monitor, keyboard, mouse | yes/no |
| Supports PXE boot | yes/no |
| BIOS settings replication capability | yes/no |
| IPMI version | |
| Maximum allowable temp for motherboard components (degrees C) | |
| ONBOARD ETHERNET ADAPTERS | |
| Number of adapters | |
| Specify brand | |
| Specify model | |
| Specify speed(s) | |
| MAC (hardware) address(es) – to be provided with each system | yes/no |
| Dedicated Ethernet adapter connected to Baseboard Management Card (BMC) | yes/no |
| 10 GE ETHERNET ADAPTER (if not onboard) | |
| Specify brand | |
| Specify model | |
| Specify speed(s) | |
| MAC (hardware) address(es) – to be provided with each system | |
| SSDs | |
| Specify Brand(s) | |
| Specify Models | |
| Specify Capacities | |
| Max. allowable operating temperature (degrees C) | |
| Max. power consumption (W) | |
| MEMORY | |
| Total amount of memory installed and number of DIMMs | |
| Brand Name and Model Number | |
| Speed of memory | |
| Size of each DIMM | |
| ECC | yes/no |
| Maximum allowable operating temperature (degrees C) | |
| CHASSIS | |
| Specify Brand | |
| Specify Model | |
| Dimensions (W x L x H) | |
| Weight (kg) | |
| Number of chassis fans (push-pull fans count as 2) | |
| Air path: front-to-back or other (specify) | |
| Estimated total heat that can be removed from chassis (W) | |
| Access to all memory slots without dismantling components? | yes/no |
| Tool-free opening of chassis? | yes/no |
| Type of rails (ball bearing, sliding metal-on-metal, shelf, other) | |
| Drive ports on case labeled correctly? | yes/no |
| POWER SUPPLY | |
| Manufacturer and model | |
| PFC circuitry in power supply | yes/no |
| Power rating (watts) | |
| Power switch on power supply? | yes/no |
| Maximum allowable operating temperature (degrees C) | |
| Efficiency factor of power supply (idle) | |
| Efficiency factor of power supply (half-load) | |
| Efficiency factor of power supply (full-load) | |
| Redundant power supply? | yes/no |
| Using splitter power cord for redundant power supply? | yes/no |
| MANAGEMENT ETHERNET SWITCH | |
| Specify brand | |
| Specify model | |
| Specify total number of ports | |
| Specify port speed | |
| FULL COMPUTE SYSTEM | |
| Max current draw (amperes) during boot-up | |
| Total current draw (amperes) at idle | |
| How were above current numbers measured? | |
| Were the current numbers measured on a 120V or 208V circuit? | 120V / 208V |
| Phone number to open a hardware service call | |
| Email address to report a hardware service call | |
| Procedure to open a service call | |
| Phone number to call for phone support | |
| Person to call for phone support | |
| Single point of contact? | yes/no |
| BIOS CHANGES | |
| Describe any BIOS changes you had to make |
| BURN-IN |
| What burn-in procedures are done after system is built? |
| PROPOSAL SUMMARY | ||
| QUESTION | ANSWER | EXAMPLES |
| Vendor | e.g. Acme Industries | |
| Processor Type | e.g. Intel - 2670 v3 | |
| Total Nodes | e.g. 177 | |
| Nodes/ Rack | e.g. 28 | |
| Nodes in Last Rack | e.g. 9 | |
| Total Racks | e.g. 7 | |
| Power draw when running mprime stress test | e.g. 330 | |
| Maximum Power draw per manufacturer specs (W) | e.g. 400 | |
| Measured: 120/208 (V) | 120/208 | |
| Processor speed (GHz) | e.g. 2.3 | |
| Threads/ node | e.g. 48 | |
| Memory/thread (GB) | e.g. 2.67 | |
| Memory Speed (MHz) | e.g. 2133 | |
| Memory DIMMs/node | e.g. 8 x 16 GB | |
| 10 GE Network Interface Card | e.g. Intel X540 | |
| Nodes/ PDU | e.g. 14 | |
| Power/ rack (W) | e.g. 7240 | |
| PDU Make & Model | e.g. AP7811B | |
| Switched PDUs? | yes/no | |
| Single or Dual bank/PDU? | Single/Dual |
Note: Your input to the above checklist will be considered as your final response. Fermilab cannot be held responsible for any incorrect or inaccurate information provided in the above checklist.
RFP CR-373289
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