RFP CR-373289_Attachment_D_Technical_Proposal_Worksheet.xlsx

XLSX spreadsheet 23 KB Posted

Attached to
LQ3 InfiniBAND CLUSTER
Solicitation number
RH-373289
Issued by

About this file

This is a technical proposal worksheet template for a high-performance computing (HPC) cluster procurement. The document is Attachment D to RFP CR-373289, issued by the Department of Energy's Fermi National Accelerator Laboratory, and serves as the standardized configuration specification form that bidders must complete for the LQ3 InfiniBand Cluster solicitation (RH-373289). The worksheet requires detailed technical specifications across multiple hardware categories including motherboard characteristics (chipset, memory capacity, PCIe slots, BIOS capabilities, IPMI version, and thermal limits), onboard and 10 GigaEthernet adapters (brand, model, speed, and MAC addresses), solid-state drives (capacity, temperature, and power consumption), memory configuration (capacity, speed, ECC support, and thermal specifications), chassis design (dimensions, weight, cooling capacity, and accessibility features), power supply parameters (efficiency ratings, redundancy options, and thermal limits), and management infrastructure details.

The worksheet also mandates disclosure of system-level performance metrics including maximum boot current draw and idle current draw (with measurement methodology and voltage specifications), service support contact information and procedures, BIOS modification documentation, and burn-in testing procedures. Vendors must provide a proposal summary capturing key deployment parameters such as total nodes, nodes per rack, processor specifications, memory configuration, network interface details, power distribution unit specifications, and power consumption data (both measured stress-test and manufacturer maximum ratings). The template explicitly states that vendor responses will be treated as final and that Fermilab assumes no responsibility for inaccurate information provided in the submission.

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RFP CR-373289_Attachment_C_Cost_Proposal.xlsx XLSX spreadsheet
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RH_373289.docx DOCX document
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3. 2022 Onsite Services Insurance Requirements.pdf PDF
v3_SOW_FY25_LQ3_Attachment_A_Specification.docx DOCX document

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Technical Proposal ATTACHMENT D - Technical Proposal

The following Technical Proposal configuration worksheet must be filled in as part of the material submitted for every bid and every configuration.

TECHNICAL CONTACTS
Technical Contact Name
Technical Contact Phone
Technical Contact E-mail
MOTHERBOARD
Brand
Model
Chipset
Maximum memory capacity
Number of DIMM slots
Number, speed and widths of PCIe 4.0 or 5.0 slots available (specify 4.0 or 5.0)
Number of serial ports
Number of USB ports available at the front of case
Number of USB ports available at the rear of case
Able to boot without monitor, keyboard, mouseyes/no
Supports PXE bootyes/no
BIOS settings replication capabilityyes/no
IPMI version
Maximum allowable temp for motherboard components (degrees C)
ONBOARD ETHERNET ADAPTERS
Number of adapters
Specify brand
Specify model
Specify speed(s)
MAC (hardware) address(es) – to be provided with each systemyes/no
Dedicated Ethernet adapter connected to Baseboard Management Card (BMC)yes/no
10 GE ETHERNET ADAPTER (if not onboard)
Specify brand
Specify model
Specify speed(s)
MAC (hardware) address(es) – to be provided with each system
SSDs
Specify Brand(s)
Specify Models
Specify Capacities
Max. allowable operating temperature (degrees C)
Max. power consumption (W)
MEMORY
Total amount of memory installed and number of DIMMs
Brand Name and Model Number
Speed of memory
Size of each DIMM
ECCyes/no
Maximum allowable operating temperature (degrees C)
CHASSIS
Specify Brand
Specify Model
Dimensions (W x L x H)
Weight (kg)
Number of chassis fans (push-pull fans count as 2)
Air path: front-to-back or other (specify)
Estimated total heat that can be removed from chassis (W)
Access to all memory slots without dismantling components?yes/no
Tool-free opening of chassis?yes/no
Type of rails (ball bearing, sliding metal-on-metal, shelf, other)
Drive ports on case labeled correctly?yes/no
POWER SUPPLY
Manufacturer and model
PFC circuitry in power supplyyes/no
Power rating (watts)
Power switch on power supply?yes/no
Maximum allowable operating temperature (degrees C)
Efficiency factor of power supply (idle)
Efficiency factor of power supply (half-load)
Efficiency factor of power supply (full-load)
Redundant power supply?yes/no
Using splitter power cord for redundant power supply?yes/no
MANAGEMENT ETHERNET SWITCH
Specify brand
Specify model
Specify total number of ports
Specify port speed
FULL COMPUTE SYSTEM
Max current draw (amperes) during boot-up
Total current draw (amperes) at idle
How were above current numbers measured?
Were the current numbers measured on a 120V or 208V circuit?120V / 208V
Phone number to open a hardware service call
Email address to report a hardware service call
Procedure to open a service call
Phone number to call for phone support
Person to call for phone support
Single point of contact?yes/no
BIOS CHANGES
Describe any BIOS changes you had to make
BURN-IN
What burn-in procedures are done after system is built?
PROPOSAL SUMMARY
QUESTIONANSWEREXAMPLES
Vendore.g. Acme Industries
Processor Typee.g. Intel - 2670 v3
Total Nodese.g. 177
Nodes/ Racke.g. 28
Nodes in Last Racke.g. 9
Total Rackse.g. 7
Power draw when running mprime stress teste.g. 330
Maximum Power draw per manufacturer specs (W)e.g. 400
Measured: 120/208 (V)120/208
Processor speed (GHz)e.g. 2.3
Threads/ nodee.g. 48
Memory/thread (GB)e.g. 2.67
Memory Speed (MHz)e.g. 2133
Memory DIMMs/nodee.g. 8 x 16 GB
10 GE Network Interface Carde.g. Intel X540
Nodes/ PDUe.g. 14
Power/ rack (W)e.g. 7240
PDU Make & Modele.g. AP7811B
Switched PDUs?yes/no
Single or Dual bank/PDU?Single/Dual

Note: Your input to the above checklist will be considered as your final response. Fermilab cannot be held responsible for any incorrect or inaccurate information provided in the above checklist.

RFP CR-373289

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