RFP 372326RLP.pdf

Fermi National Accelerator Laboratory Procurement Department

Finance Section 630-840-2454 rhiannon@fnal.gov

Date:

Request for Proposal #:

Proposals Due:

REQUEST FOR PROPOSAL - THIS IS NOT A PURCHASE ORDER

Fermi Forward Discovery Group, LLC (FFDG) anticipates procurement of the following assemblies for Fermi National Accelerator Laboratory (Fermilab). Fermilab Requests your firm-fixed price proposal for the following:

Pg. 1 of 2

ITEM QTY. DESCRIPTION UNIT PRICE DELIV.

Total Extended Proposal Price:

Company Name:

Address:

Terms: Net 30 FOB: Fermilab Signature & Date: Rhiannon Patterson - Procurement Specialist II

REQUEST FOR PROPOSAL

August 18, 2025

RFP 372326RLP

September 3, 2025

Assembly of Full PIP-II HWR/SSR Quench Protection Monitor systems/crates according to supplied statement of work documentation "PIP II HWR/SSR Quench Protection Monitor (QPM)." All parts will be supplied by Fermilab's Power Electronics Systems Department.

1 30 $

Exceptions to specifications and extra charges for containers, tooling, etc. must be clearly indicated

MATERIALS, SUPPLIES OR SERVICES RESULTING FROM

THIS QUOTE ARE FOR WORK DONE UNDER PRIME

CONTRACT NO. DE AC02 07CH11359 WITH THE UNITED

STATES DEPARTMENT OF ENERGY. ANY ITEMS COVERED

BY G.S.A. CONTRACTS SHOULD BE SO INDICATED.

Fermi National Accelerator Laboratory / Kirk and Pine Street / P.O. Box 500 / Batavia, IL 60510 / www.fnal.gov / fermilab@fnal.gov Managed by Fermi Forward Discovery Group, LLC for the U.S. Department of Energy Office of Science

RFP # 372326RLP Pg. 2 of 2

The units will ship to:

Fermilab Receiving Warehouse 2 Kirk Rd and Wilson Street Batavia, IL 60510 United States

Basis for Subcontract Award

FFDG General Terms and Conditions for Commercial Products and Commercial Services (01.2025)

Offers to include F.O.B. Fermilab delivery terms. All freight charges must be included in your quotation.

The following Representations must be completed and returned with your proposal:

SARC - Subcontractor Annual Reps & Certs (Rev. 4) PUR-466 - Proposal Certifications ( Rev. 2 Dated 06/03/2025)

Proposals shall be submitted by 5pm CDT September 3, 2025.

All contractual questions shall be directed to:

Rhiannon Patterson Procurement Specialist II rhiannon@fnal.gov 630-840-2454 (office)

The following terms and conditions shall become a part of any subsequent purchase order/subcontract resulting from this solicitation.

The above referenced terms and conditions are available on the Fermilab Business Services Web Site. They are PDF Format (hard copy forms are available upon request) and can be accessed at the following URL:

https://procurement.fnal.gov/terms-conditions/

The RFP response shall include a completed RFP page, SARC Form, and a PUR-466 Form.

This is a best value source selection. Award shall be made to the supplier who is deemed responsible by FFDG, whose proposal conforms to the solicitation’s requirements, and is judged to represent best value to FFDG. The best value is represented by the lowest price of technically acceptable offerors. FFDG intends to award without discussions.

Fermi National Accelerator Laboratory / Kirk and Pine Street / P.O. Box 500 / Batavia, IL 60510 / www.fnal.gov / fermilab@fnal.gov Managed by Fermi Forward Discovery Group, LLC for the U.S. Department of Energy Office of Science https://procurement.fnal.gov/terms-conditions/ https://procurement.fnal.gov/terms-conditions/ https://procurement.fnal.gov/terms-conditions/ https://procurement.fnal.gov/terms-conditions/ mailto:rhiannon@fnal.gov https://procurement.fnal.gov/terms-conditions/

July 21, 2025

Statement of Work:

PIP II HWR/SSR Quench Protection Monitor (QPM)

Fermilab’s Accelerator Division / Power Electronics Systems Department is seeking bids for assembling our PIP II HWR/SSR Quench Protection Monitor (QPM) systems. This includes assembling the circuit boards, mounting and wiring their front panels, final assembly of the QPM crate, including wiring the backplane to the input power panel, and installing circuit boards, so complete QPM systems are delivered.

A. Items and Total Units Item: PIP II HWR/SSR Quench Protection Monitor System (or QPM Crate) Quantity: 30

Sub-items and quantities listed in table below are required to deliver 30 complete QPM systems (crates).

Sub-item # Name Schematic Number Total Units

1 Digital Interface 438500 60 2 Digital I/O to PC104 438502 60 3 Switcher Analog Interface 438504 60 4 Analog Buffer 438506 60 5 PC104 System Control 438508 30 6 PC104 External Interface 438510 30 7 QPM Backplane 438512 30 8 QPM Input Power Panel 438521 30 9 Final QPM Crate Assembly 30

Dennis Barak 630-840-5720 barakd@fnal.gov

AD / Power Electronics Systems P.O. Box 500, MS 306 Kirk Road and Pine Street Batavia, Illinois 60510-5011 mailto:barakd@fnal.gov

B. Construction Requirements, Testing, and Corrections

1. Assemble complete modules of the Quench Protection Monitor according to supplied documentation and samples of each module. Pictures of similar sample modules are provided in this document.

a. All parts will be supplied by Fermilab.

b. Each QPM module consists of a circuit card assembly and front panel, except for the QPM Backplane 438512.

2. Final assembly of the pre-assembled QPM crates consisting of installing the backplane, the input power panel, wiring from the backplane to the input power panel, and the QPM modules into the crate slots. Pictures of a similar sample crate are provided in this document.

a. Pre-assembled crates and parts will be supplied by Fermilab.

b. Install ten (10) QPM modules in each crate, five on the front panel and five on the rear panel.

3. Completed modules and crates shall be tested by Fermilab. The Contracted Company shall provide first articles and a post-delivery inspection and testing period as detailed below.

a. The Contracted Company shall deliver two (2) first articles of each QPM module and QPM crate for evaluation and testing. Upon receipt, Fermilab will have 10 business days to perform in-house testing and inspection of these first articles against the agreed-upon specifications. Fermilab will provide written notification to the Contracted Company of acceptance or rejection of the first articles. Full release of the remaining units shall not commence until Fermilab provides written acceptance of both first articles. If the first articles are rejected, the Contracted Company shall promptly correct any identified deficiencies and resubmit new first articles for testing at no additional cost to Fermilab.

b. Upon delivery of the full order, Fermilab shall have a period of sixty (60) calendar days to conduct in-house testing and inspection for assembly errors.

During this 60-day period, if any assembly errors are identified, Fermilab shall notify the Contracted Company in writing, providing reasonable detail of the identified errors. The Contracted Company shall, at its sole expense, promptly correct all verified assembly errors, including any necessary re-work or repair of affected modules.

C. MODULE DETAILS

C1. DIGITAL INTERFACE MODULES 438500

1. Printed circuit board

a. Multi-layer board with dimension 9.2in x 6.30in.

b. Contains through-hole leaded mounted components.

c. Digital interface module parts list included in Appendix A.

d. All parts will need to be installed, and the front panel wired to circuit board.

e. Assemble ribbon cables using supplied ribbon cable and connectors.

2. Front Panel

a. 3-10 position rectangular plug connectors and 3-20 pin rectangular plug connectors

b. Ribbon cable connections to circuit board

3. Fully assembled Digital Interface Module 438500.

Figure 1 Fully assembled Digital Interface Module 438500. a) top view showing ribbon cable details, b) top of board, c) front panel and d) bottom of board.

C2. DIGITAL I/O TO PC104 MODULES 438502

1. Printed circuit board

a. Multi-layer board with dimension 10.5in x 9.2in.

b. Contains through-hole leaded mounted components.

c. Digital I/O to PC 104 module parts list included in Appendix A.

d. All parts will need to be installed.

a. Through holes aligned with circuit board mounted push button and toggle switches as well as double LED packages.

3. Fully assembled Digital I/O to PC 104 Module 438502

Figure 2 Fully assembled Digital I/O to PC104 module 438502. a) top of board, b) bottom of board, c) front panel and d) back of board.

C3. SWITCHER ANALOG INTERFACE MODULES 438504

1. Printed circuit board

a. Multi-layer board with dimension 9.2in x 6.30in

b. Contains through-hole leaded mounted components.

c. Switcher Analog Interface module parts list included in Appendix A.

a. Through holes aligned with circuit board mounted pots, double LED packages and D type connectors. The connectors need to have threaded inserts installed.

3. Fully assembled Analog Interface Module

Figure 3 Fully assembled Switcher Analog Interface Module 438504. a) top of board, b) bottom of board, c) front panel and d) back of board.

C4. ANALOG BUFFER MODULES 438506

1. Printed circuit board

a. Multi-layer board with dimension 10.5in x 9.2in

b. Contains through-hole leaded mounted components.

c. Analog Buffer module parts list included in Appendix A.

a. Through holes aligned with circuit board mounted pots, double LED packages and D type connectors. The connectors need to have threaded inserts installed.

3. Fully assembled Analog Buffer Module

Figure 4 Fully assembled Switcher Analog Interface Module 438506. a) top of board, b) bottom of board, c) front panel and d) back of board.

C5. PC104 SYSTEM CONTROL MODULES 438508

1. Printed circuit board

a. Multi-layer board with dimension 10.5in x 9.2in

b. Contains through-hole leaded mounted components.

c. PC104 System Control module parts list included in Appendix A.

d. All parts will need to be installed, and the front panel wired to circuit board.

a. Front panel push button and 9 pin D connector will need to be mounted and wired to the circuit board.

b. Through holes will need to line up with a circuit board mounted toggle switch, 3 push button switches, 2 D type connectors and double LED packages. The D connectors will all need to have threaded inserts installed.

c. Mount PC104 Master Reset pushbutton switch with attached wires and route connector to the PC104 system as seen in figures 5 and 7.

d. Mount 9 pin D connector using supplied cable and route the other end to the PC104 system. Note, the supplied cable has 2 D type connectors, the connector that is tie wrapped to the cable is not used.

3. PC104

a. Assemble the PC104 system, stacking together the I/O card, DAC card and PC104 card using the supplied standoffs and screws. See Figure 7 for details along with the supplied module.

b. Wire PC104 system power to the circuit board using the supplied cable.

c. Mount the supplied Ethernet cable and using supplied metal plate and standoffs visible in Figures 5 and 7.

d. Assemble 34pin and 50pin ribbon cables and install between the PC104 system and circuit board, using supplied ribbon cable and connectors. See figure 7.

4. Fully assembled PC104 System Control Module

Figure 6 Detail showing the power connection to the PC104 card.

Figure 5 Assembled PC104 System Control Module 438508 a) top view, b) bottom view. Note: this is an older revision of the board so there will not be a jumper as shown.

Figure 7 Fully assembled PC104 System Control Module 438508 a) front panel, b) back of board.

Figure 8 Fully assembled PC104 System Control Module 438508. Pictures show details on board including PC104 assembly, cable and wire routing.

C6. PC104 EXTERNAL INTERFACE MODULES 438510

1. Printed circuit board

a. Multi-layer board with dimension 9.2in x 6.3in

b. Contains through-hole leaded and surface mounted components.

c. PC104 External Interface module parts list included in Appendix A.

d. All parts will need to be installed, and the front panel wired to circuit board.

e. Front panel Burndy connector wired to the circuit board using supplied connector, pins and wire.

a. Install 8 pin Burndy connector and align the connectors that are mounted to the circuit board.

3. Fully assembled External Interface Module

Figure 9 Fully assembled PC104 External Interface Module 438510. a) top of board, b) bottom of board, c) front panel and d) back of board (note: this is an older revision of the board, the most recent revision will not have wire jumpers on the back of the board)

C7. QPM BACKPLANE 438512

1. Printed circuit board

a. Multi-layer board with dimension 10.375in x 13.875in

b. Contains through-hole leaded mounted components.

c. QPM Backplane parts list included in Appendix A.

2. Fully assembled QPM Backplane

C8. QPM INPUT POWER PANEL 438521

1. Input power front panel with 2 Burndy connectors is wired to the QPM Backplane 438512. See attached Appendix B QPM Backplane Wirelist for specific wiring instructions.

Figure 10 Fully Assembled QPM Backplane 438512. Figure shows both sides of the backplane with connectors. Note: the wires are from the QPM chassis and will be installed separately.

2. Input power panel

Figure 11. Input power panel. The Burndy connectors are wired to the QPM Backplane

C9. FINAL QPM CRATE ASSEMBLY

1. Pre-assembled crate will be provided ready for the backplane, input power panel, wiring, and QPM modules to be installed.

2. Install QPM Backplane (438512) using the following steps.

a. When installing the backplane secure it loosely with 4 screws.

b. Install 2 front cards in the farthest left and right-side slots.

c. Adjust the backplane left or right to make the cards as straight as possible, then tighten the 4 backplane screws.

d. Once the 4 backplane screws are tight, install 2 rear cards in the back of the crate on the farthest let and right-side slots.

e. The right-side card should be right up against the side panel, and the left car should have ~1/4in gap from the side panel.

f. If all spacing looks good install additional backplane screws for more support.

g. The crates will be provided ready for the backplane to be installed.

2. Install QPM Input Power Panel (438521) and wiring to Backplane. See attached

Appendix B QPM Backplane Wirelist for specific wiring instructions.

3. Install ten QPM modules into the QPM crate and Backplane connectors.

a. Front panel module layout from left to right when facing the front panel.

Front Panel Module Name Schematic Number Left Digital I/O to PC104 438502

| Analog Buffer 438506 | PC104 System Control 438508 | Analog Buffer 438506 | Digital I/O to PC104 438502

Right Blank Panel *

b. Rear panel module layout from left to right when facing the rear panel.

Rear Panel Module Name Schematic Number Left QPM Input Power Panel 438521

| Blank Panel * | Digital Interface 438500

| Switcher Analog Interface 438504 | PC104 External Interface 438510 | Switcher Analog Interface 438504

Right Digital Interface 438500

c. Leave blank panel slots open if blank panels are not provided.

4. Fully assembled QPM crate with circuit cards installed.

Figure 12 Fully assembled QPM crate. a) front, b) back, c) back and side view, d) front and side view