RFI AM System.docx
DOCX document 22 KB Posted
- Solicitation number
- N68520-26-RFPREQ-600000V-0007
About this file
This is a Request for Information (RFI) document issued by the Naval Air Systems Command (NAVAIR) seeking industry input on commercially available polymer-based additive manufacturing (AM) systems. NAVAIR is pursuing a technology refresh for its current Tier 1 and Tier 2 AM systems deployed across Fleet Readiness Centers and operational units to address evolving operational requirements, improve system reliability, and expand material capabilities. The systems must be capable of supporting shipboard, land-based, expeditionary, and developmental operations, indicating a need for versatile platforms adaptable to diverse Navy environments and mission profiles.
The RFI is structured as a pre-solicitation to gather market information that will inform the development of a future Request for Proposals (RFP). Respondents are expected to provide detailed technical specifications, performance capabilities, material compatibility data, and operational suitability assessments for their polymer-based AM systems. This information will help NAVAIR evaluate available commercial solutions and establish technical requirements for the upcoming formal procurement. The RFI document contains specific instructions for response format, submission procedures, and evaluation criteria that potential offerors must follow to ensure their submissions are properly documented and considered in NAVAIR's technology assessment process.
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REQUEST FOR INFORMATION (RFI)
Additive Manufacturing System Naval Air Systems Command (NAVAIR) This Request for Information (RFI) is issued for market research purposes only and does not constitute a Request for Proposal (RFP) or a commitment by the U.S. Government to procure any goods or services. Responses will be used to inform future acquisition planning for Additive Manufacturing (AM) systems in support of Naval Aviation.
1.0 Program Overview
NAVAIR seeks information from industry regarding commercially available polymer-based additive manufacturing systems capable of supporting shipboard, land-based, expeditionary, and developmental operations. NAVAIR requires an updated capability to additively manufacture polymer parts and components to support shipboard and shore-based operations, sustainment, and logistics. The current polymer additive manufacturing (AM) systems, deployed to various Fleet Readiness Centers and operational units as Tier 1 and Teir 2 AM systems, require a technology refresh to address evolving operational needs, improve reliability, and enhance material capabilities.
1.1 Tier 1 description (Desktop Polymer)
· Manufacture non-critical components
· Build Area: Maximum 36 x 24 / Minimum 13 x 9 inches
· The overall size of the printer shall be constrained to fit within designated shipboard or facility workspaces, considering access, transport, and storage limitations commonly encountered in Navy environments.
· Components shall be broken down into modular units with weights and dimensions that allow personnel to lift and carry parts safely in accordance with MIL-STD-1472.
· Design shall ensure the printer can be safely moved through standard doorways, hatches (26” wide by 76” tall), and confined spaces encountered during shipboard deployment.
· System shall be forward deployable.
· System shall fit within a volume of 60 inches x 40inches x 30 inches
1.2 Tier 2 description (Industrial AM Polymer)
· Manufacture critical components
· Build Area: Maximum 48 x 48 inches/ Minimum 18 x 18 inches
· Shall be permanently installed and not intended for forward deployment.
2.0 Terminology: Definitions for unique terminology are provided below. When this terminology is used in this RFI, the phrase or words for which the terminology is provided is underlined.
1. Non-critical component: Parts in accordance with ASTM F3572-22 Class D
2. Build Area: The area where material is added to fabricate a part. The range given is not to be construed as an adjustable area but rather limits as to what is being considered for this RFI.
3. Critical components: Parts in accordance with AW ASTM F3572-22 Class B
4. Forward deployable/forward deployment: The ability for the equipment to be rapidly (1-2 days) packaged and deployed to a combat location.
5. Technology refresh roadmap: The schedule to which an AM system is generally supported, available for acquisition and finally upgraded/replaced with new technology.
6. Replacement component commonality: The degree to which components, which may fail or need to be replaced during normal maintenance, are available through common sources as opposed to a proprietary source or the AM system manufacturer.
3.0 Information Requested from Respondents for Tier 1 and Tier 2 Systems Respondents are requested to provide the following information, organized in the order listed:
3.1 Product Information
Rough Order of Magnitude (ROM) pricing for system and support Overall system description and commercial product designation Overall system dimensions and weight Build volume dimensions and usable build area Printer setup time and typical operational workflow Material extrusion modality details (nozzle count, extrusion type, drive mechanism) Build plate material, temperature limits, and removal method Auto-calibration and alignment capabilities Material storage, drying, and handling features Power requirements and maximum power consumption Network interface details Environmental operating and storage limits (temperature, humidity, altitude) Any subtractive or postprocessing capabilities Country where the equipment is manufactured List any country other than US and its allies that manufacture system components Is the manufacture compliant with Section 889(a)(1)(B) of the 2019 National Defense Authorization Act Country where the company is headquartered Other Government or DoD customers (with POCs, if available) Any Shipboard Environmental Testing completed (e.g. Shock (MIL-DTL-901E), Vibration (MIL-STD-167-1 Type 1), Electromagnetic Interference (MIL-STD-461), Shipboard Motion) Are there options to ruggedize the AM equipment in order to meet the above testing requirements.
3.2 Printing Capabilities
1. Layer thickness range and achievable resolution Minimum feature size and dimensional accuracy (X, Y, Z) Maximum deposition and traverse speeds As-printed highest and lowest surface finish
3.3 Materials
1. Supported polymer materials (standard and high-temperature) Composite capabilities (i.e. carbon, glass, aramid fiber) (Continuous or chopped).
Multi-material printing capability (if available) Material Property Data Filter requirements for out gassing from the printing process
3.4 Logistics Support
1. Failure data and reliability history including Mean Time Between Failure (MTBF), Mean time to repair and availability data.
Build monitoring and reporting capabilities Technology refresh roadmap and upgrade options Operator Repair capability Maintenance Requirements Operational/User Manuals Cost/availability of unlimited data rights for Manuals Replacement component commonality Any warrantees and service maintenance contract available Available training for operator and/or maintenance and repair
3.5 Software
1. Software included (slicer, monitoring, diagnostics) Supported CAD and file formats Ability to modify or lock build parameters Ability to operate in an air-gapped or restricted network configuration Whether software is open source
3.0 Response Instructions
Interested parties shall adhere to the following instructions for the submittal of their capabilities statements.
1) There is no page limit; however, concise and well-organized responses are preferred.
2) Responses should be submitted in electronic format (PDF preferred)
3) Delivery: Electronic-mail (Email) Submission to the Contracting Officer, Meghan Huett, meghan.e.huett.civ@us.navy.mil and the Contract Specialist, Elden Greuber at elden.j.greuber.civ@us.navy.mil.
4) Response date: Responses are due by 4:00 PM ET on July 22th 2026.
5) No classified information shall be submitted.
6) No phone calls will be accepted.
7) All responses shall include RFI name/number, Company Name, Company Address, Company Business Size, and Points of Contact (POC), including names, phone numbers, and email addresses.
8) All data received in response to this RFI that is marked or designated as corporate or proprietary will be fully protected from any release outside the Government.
9) Any information or materials provided in response to this RFI will not be returned. The Government is not committed nor obligated to pay for the information provided, and no basis for claims against the Government shall arise as a result of a response to this RFI.
4.0 Disclaimer
This RFI is for information-gathering purposes only and shall not be construed as a solicitation or commitment by the Government. The Government will not reimburse respondents for costs incurred in responding to this RFI.
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