PWS 22-2D6 - PCB Fab and Assembly BPA Scope.pdf

PERFORMANCE WORK STATEMENT (PWS)

DMEA 22-2D6

1 March 2023

Project Engineer: Colin Lewis, DMEA/MEAB, (916) 999-2607 Contract Officer Representative: Ajit Sandhu, DMEA/MEAA, (916) 231-1515

1.0 SCOPE: Printed Circuit Board Assemblies (PCBAs) orders enabling a turn key solution for Printed Circuit Board (PCB) Fabrication and Assembly with multiple vendors

1.1 TITLE: Turn Key PCB Fabrication and Assembly – BPA Scope

1.2 APPLICABILITY: DMEA frequently produces developmental, prototype, and production electronics systems for use by Department of Defense (DoD) Programs.

1.3 BACKGROUND: DMEA’s mission includes developing electronics solutions that solve DoD obsolescence issues and/or provides state of the art SatCom solutions to DoD Programs. As such, there is a need to (1) rapidly produce developmental Printed Circuit Board Assemblies (PCBAs) for initial design and development use, (2) quickly produce prototype PCBAs for design validation, and (3) manufacture high quality PCBAs for use in DoD operational environments.

1.4 PURPOSE: Obtain electronics products from industry and commercial PCB Fabrication and/or Assembly companies; specifically those produced by PCB Fabrication and PCB Assembly processes.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES: The government will provide engineering drawings, assembly drawings, material lists (e.g. bill of materials (BOM) and Government Furnished Material (GFM)), and/or requirement specifications (e.g. technical data package (TDP)), to define PCB Fabrication and Assembly requests, as required.

2.1 GOVERNMENT DOCUMENTS:

Document No. Date Title PCB Design and Layout Files PCB Fabrication Specifications Sub-Component Bill of Materials (BOM) PCB Assembly Design Files PCB Assembly Specifications

2.2 GOVERNMENT FURNISHED EQUIPMENT (GFE): The government may provide Electronic Components necessary for the Contractor to assemble PCBAs. Any components that will be provided by DMEA to the contractor shall be identified in a Government Furnish Material (GFM) list, which is a subset of the production Bill of Materials (BOM) required to complete fabrication and assembly. The GFM and BOM may be consolidated into a single list (BOM) so long as quantities of GFM are sufficiently annotated within the BOM.

Nomenclature Part Number Date Available Consigned Electronic Components Refer to GFM/BOM Upon Turn-Key Request

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS: The contractors shall produce/procure the products described within Section 3.1, based on the required specification provided by DMEA through individual production orders. The contractor shall have in-house capabilities for either PCB Fabrication or Assembly, or both.

3.1.1 PCB FABRICATION REQUIREMENT: The contractor shall produce requested quantities of PCBs in accordance with fabrication requirements and specification documents for board thickness, layer count, surface finish, trace tolerance, and any other pertinent fabrication specifications.

3.1.1.1 The contractor shall fabricate PCBs in accordance with specified IPC-A-600 classification; if IPC Classification is not specified in the provided TDP, the contractor shall fabricate PCBs to IPC Class 3 requirements.

3.1.1.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, impedance matching test results, and/or results of Quality Control inspections.

3.1.1.3 Unless otherwise specified in the TDP, the contractor has control over panelization strategies, fiducial markings, and excess materials needed to account for production fall out.

3.1.1.4 If the contractor does not have PCB Fabrication capabilities, it is acceptable to sub-contract PCB Fabrication to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of fabrication/production activities.

3.1.1.5 The contractor shall return all excess PCB materials (GFM) to DMEA after completion of production activities.

3.1.2 COMPONENT PROCUREMENT REQUIREMENT: The contractor shall procure sufficient components, as identified on the BOM, to enable the assembly of requested quantities of PCBAs. Any components that will be consigned to the contractor by DMEA will be identified on the BOM.

3.1.2.1 The contractor shall rapidly review and approve suitability of Government furnished materials and components (GFM) within 8 calendar day from contract award, allowing for receipt of GFM within 3 calendar days.

3.1.2.2 The contractor shall only use authorized distributors or Original Equipment Manufacturers (OEMs) to source components. Any alternative sources, like third party distributers, shall be approved by DMEA prior to components being procured.

3.1.2.3 The contractor shall rapidly execute component orders, to ensure supply chain disruptions can be immediately accounted for. The contractor shall provide evidence of orders being placed and received.

3.1.2.4 The contractor shall identify suitable alternates to components that are not immediately available, or that have prohibitively long lead times. Any alternate components shall be approved by DMEA subject matter experts (SMEs: the PE or COR as identified on the SOW) prior to procurement of the components.

3.1.2.4.1 Note: DMEA may request some additional spares of critical components be procured, to support rework due to post-production test and validation activities; these spares will be identified in the TDP and BOM, when applicable.

3.1.2.5 Unless quantities of components are specifically specified or limited in the TDP, the contractor has control over quantities of sufficient spares needed to accommodate losses possible in their PCB Assembly processes. Any alternate components shall be approved by DMEA SMEs prior to procurement of the components.

3.1.2.6 The contractor shall return all excess BOM materials and components to DMEA after completion of production activities.

3.1.3 PCB ASSEMBLY REQUIREMENT: The contractor shall assemble requested quantities of PCBAs (also referred to as Circuit Card Assemblies (CCAs)) in accordance with layout specifications and assembly requirement documents for solder selection, component placement, bill of materials, stencil design, and any other pertinent assembly specifications.

3.1.3.1 The contractor shall assemble PCBAs in accordance with specified J-STD-001 and IPC-A-610 classification;

if IPC Classification is not specified in the provided TDP, the contract shall assemble PCBAs to IPC Class 2 requirements.

3.1.3.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, and/or results of Quality Control inspections performed in accordance with specified IPC-A-610 inspections.

3.1.3.3 Unless otherwise specified in the TDP, the contractor shall use Tin-Lead (Sn-Pb) solder in all applicable assembly process.

3.1.3.3.1 Note: Some components may be fabricated with Lead-free solder. Unless specified in the TDP, these components shall not be reballed. Hybrid soldering processes are acceptable in the attachment of these components.

3.1.3.4 If the contractor does not have PCB Assembly capabilities, it is acceptable to sub-contract PCB Assembly to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of fabrication/production activities.

3.1.3.5 The contractor shall return all excess materials utilized in PCB Assembly process to DMEA after completion of production activities, including setup units and units that are not functional after assembly. Setup and failed units shall be clearly marked and segregated from the production units.

4.0 DATA ITEMS: The following CDRLs will likely apply to resultant orders and shall be submitted as described below. Provided for context. Indicate on the cover of all delivered data the BPA number, BPA order number, SOW number, SOW title, and the current DMEA Project Engineer name and office symbol.

1. Sequence Number A001

2. Title Technical Report - PCB Electrical Tests

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S.

Government Agencies only. Other requests shall be referred to

DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

15. Total See Distribution List

16. Remarks Contractor format is acceptable.

Block 9: Mark all CDRL items with the distribution statement as shown above in Block 9 and with the following additional statement:

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do not apply to those items identified as technical data or computer software to be furnished with restrictions.

1. Sequence Number A002

2. Title Technical Report – Impedance Test

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S. Government

Agencies only. Other requests shall be referred to DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do

1. Sequence Number A003

2. Title Technical Report – Fabrication and Assembly Inspections

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S.

Government Agencies only. Other requests shall be referred to

DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do

5.0 POINTS OF CONTACT:

DMEA/MEAC:

Steven Nelson Chief, Quick Reaction Engineering Branch Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 999-2785 E-Mail: steven.b.nelson25.civ@mail.mil

DMEA/MEAB

Colin Lewis Project Engineer, QRE Technologies Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 999-2607 E-Mail: colin.b.lewis.civ@mail.mil

DMEA/MEAB

Chris Laney Project Engineer, QRE Technologies Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 999-2697 E-Mail: Christopher.s.laney3.civ@mail.mil

DMEA/MEAB

Henok Tadesse PCB Assembly Engineer, PAS Lab Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 999-2902 E-Mail: Henok.tadesse.civ@mail.mil

DMEA/MEAA

AJ Sandhu Contracting Officer Representative (COR) Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916) 231-1515 E-Mail: ajit.s.sandhu.civ@mail.mil