Minimum_specifications_servers.pdf

Government’s Minimum Specifications

CLIN 0001 3D Display Virtualization Server, Qty 4/ea

General:

- Support for 3-D graphics in multiple Red Hat/KVM virtual machines

- Easy interconnection and integration with external computer systems

Enclosure:

- Modular system

- Each enclosure has a 4U form-factor

- Each enclosure is configurable to be rack-mountable

- Each enclosure is configurable to be free-standing

- Processing and secondary storage in the same enclosure

- Enclosure back-plane can support up to 4 GPU accelerator cards

Processing:

- Dual CPU per processing node

- Minimum 18 cores per processor (36 cores per node)

- Minimum two computing nodes

Microprocessor (CPU):

- 64-bit instruction set

- Minimum clock rate: 2.0 GHz

- Minimum number of cores: 18

- Minimum number of threads: 36

- Minimum Level 3 cache size: 24 MB

- Minimum supported address space: 768 GB

- Minimum memory speed: 2666 MHz

- Maximum Thermal Design Power (TDP): 140 W

Memory:

- Minimum 512 GB DDR4 DRAM memory per node

Secondary Storage:

- Minimum one 512 GB NVMe Disk-on-a-module to separate node boot volume from secondary storage volumes

- Minimum 2 TB drives

- Minimum 8 TB aggregate storage on a node

- Solid-state drive technology for higher reliability and more predictable failure characteristics than electromechanical drives.

- 5.25" Bay Blu-Ray Disc Rewriter

Network Interface:

- Minimum of one network interface card per enclosure

- Four-port optical (SFP+) 10 Gb/sec Ethernet (40 Gb/sec aggregate bandwidth per node)

Display Card:

- Minimum of one display card per enclosure

- Minimum GPU Memory: 2 GB GDDR5

- Memory Interface : 64-bit

- Memory Bandwidth: 32 GB/s

- System Interface PCI Express: 3.0 x16

- Maximum Power Consumption: 30 W

- Display connector type: mDP 1.4

- Minimum number of display connectors: 3

- Number of displays supported: 3

Graphics Processing Unit (GPU) Accelerator:

- Minimum of one accelerator card per enclosure

- Support for OpenCL, OpenACC, DirectCompute, CUDA programming libraries

- Minimum number of compute cores: 5000

- Minimum double-precision performance: 7 TFLOPS

- Minimum single-precision performance: 14 TFLOPS

- Minimum GPU Memory: 16 GB HBM2 (ECC)

- Minimum memory bandwidth: 900 GB/sec

- System interface: PCIe Gen3

- Form-factor: PCIe Full

CLIN 0002 Virtualization Server, Qty 2/ea

General:

- Support for multiple virtualization solutions

- Able to quickly reconfigure system to change the virtualization platform

- Easy interconnection and integration with external computer systems

Enclosure:

- Modular system

- Each module has minimum of four computing nodes

- Each enclosure has a 2U form-factor

- Each enclosure is rack-mountable

- Dual redundant power supplies in each enclosure

- Computing nodes are hot-swappable

- Processing and secondary storage in the same enclosure

Processing:

- Dual CPU per processing node

- Minimum 18 cores per processor (36 cores per node)

- Minimum two computing nodes

Microprocessor (CPU):

- 64-bit instruction set

- Minimum clock rate: 2.0 GHz

- Minimum number of cores: 18

- Minimum number of threads: 36

- Minimum Level 3 cache size: 24 MB

- Minimum supported address space: 768 GB

- Minimum memory speed: 2666 MHz

- Maximum Thermal Design Power (TDP): 140 W

Memory:

- Minimum 512 GB DDR4 DRAM memory per node

Secondary Storage:

- Minimum 2 TB drives

- Minimum 48 TB on an enclosure

- Minimum 12 TB aggregate storage on a node

- Solid-state drive technology for higher reliability and more predictable failure characteristics than electromechanical drives.

Network Interface:

- Minimum of one network interface card per node

- Four-port optical (SFP+) 10 Gb/sec Ethernet (40 Gb/sec aggregate bandwidth per node)