TIH_20-22_Industry_Day_Q&A_Updated_Email_Address.pdf

Technology Insertion Hardware (TIH) 20/22 Industry Day Questions and Answers

Question 1: Will the Request for Proposal (RFP) request contractors to bid engineering services as sample tasks?

Answer 1: Please see the RFP. The Government is currently developing the solicitation, including Sections L&M.

Question 2: What incentives does the government intend to use for the incentive portion of the CPIF procurement.

Answer 2: Please see the RFP. The Government is currently developing the solicitation, including Sections L&M.

Question 3: Will the solicitation include sample tasks, and if so, what are those tasks?

Answer 3: Please see the RFP. The Government is currently developing the solicitation, including Sections L&M.

Question 4: Why is the production cost-plus incentive fee (CPIF) now, when the current production contract is fixed-price incentive fee (FPIF)?

Answer 4: The Government plans the acquisition strategy based on the individual procurement.

Question 5: Will there be stepladder pricing?

Answer 5: Please see the RFP. The Government is currently developing the solicitation, including Sections L&M.

Question 6: Why doesn’t ARCI include their cabinets in this procurement?

Answer 6: PMS401 plans its acquisition strategy according to how best to meet its acquisition requirements.

Question 7: Will proposed CPIF production pricing be binding? They were not for TI

16/18 TIH.

Answer 7: Please see the RFP. The Government is currently developing the solicitation, including Sections L&M.

Question 8: What is the government estimate of the dollar value for this contract?

Answer 8: The government estimate will not be provided.

Question 9: What proportion of the dollar value of this contract is hardware procurement and what proportion is engineering development?

Answer 9: Please see the RFP. The Government is currently developing the solicitation, including Sections L&M.

Question 10: What contractor has the contract for TIH 16 & 18 (if applicable)?

Answer 10: DRS Laurel Technologies.

Question 11: Will there be a dedicated Industry Day for the ES system as it relates to TI- 20, and if so when will this occur?

Answer 11: This industry day is for the TIH 20/22 solicitation and there is no information to share regarding other procurements.

Question 12: Does this industry day cover the upcoming Virginia Block 5 Outboard Hardware (e.g. Imaging and Electronic Warfare – Tactically Oriented Tech Insertion Mast (TOTIM) BLQ-10B ESM)? Or, will there be one or two separate industry days

Answer 12: This industry day is for the TIH 20/22 solicitation and there is no information to share regarding other procurements.

Question 13: When will the RFP for B5 TOTIM be issued?

Answer 13: This industry day is for the TIH 20/22 solicitation and there is no information to share regarding other procurements.

Question 14: When will the RFP for B5 Next Generation Electronic Warfare be issued?

Answer 14: This industry day is for the TIH 20/22 solicitation and there is no information to share regarding other procurements.

Question 15: SEA 05 stated a desire to reduce component configurations. (a) Is the desire for common configuration or common capability? (b) How is common configuration, balanced against low cost? (c) Is low cost Acquisition or Life Cycle Cost?

Answer 15: (a) The desire is to reduce the number of unique components. (b) The primary impact is in the area of Integrated Logistics Support. (c) Please see the RFP. The Government is currently developing the solicitation, including Sections L&M

Question 16: Are there opportunities to discuss methods to reduce waste heat generation and space reduction?

Answer 16: Yes, as part of the Technology Insertion (TI) Integrated Production Team (IPT) collaboration process.

Question 17: Will the Industry Day attendee list be posted?

Answer 17: Yes, the list of attendees will be posted on Federal Business Opportunities along with the presentation and a list of the questions and answers provided during industry day.

Question 18: will the data packages posted to E-TIC be the ones that we bid to in April or will a new data package be released with the RFP?

Answer 18: The E-TIC will be populated with Technical Data Packages from previous TIs and any additional information the government identifies is necessary to assist industry in responding to the RFP. It is not build-to-print information for TI-20 and TI-22.

Question 19: Please elaborate on the scope of the design effort for the TIH contractor. It appears that a Bill of Material is supplied by the TI IPT, and the TIH contractor is expected to detail the design, including cabinet, cabling, and mounting bracket designs. Is this correct?

Answer 19: The TIH contractor is a member of the TI IPT process and participates in the meetings to develop the design.

Question 20: What is the typical schedule from TI IPT convergence on the architecture to delivery of the first system?

Answer 20: Projections for TI-20 would include the design being stable in July of 2019 and delivery of the first hardware in January of 2021.

Question 21: Does the government foresee any organizational conflict of interest (OCI) issues with design and production?

Answer 21: At this time, the government has not identified any OCI issues.

Additional questions may be submitted to the TIH email box:

KYPT_TeamSub_TIH@navy.mil