25Q4402_BPA_SOW.pdf

STATEMENT OF WORK (SOW)

C.1 INTRODUCTION

The Weapons Control and Integration Department (H Department), Naval Surface Warfare

Center, Dahlgren Division (NSWCDD) actively supports Naval, Joint, and national needs by providing design and fabrication, rapid prototyping, special acquisition, and technology integration related to circuit board design. The focus of this work will be the fabrication, assembly, and Bill of Material (BOM) procurement on an accelerated delivery schedule. Each request throughout the effort may include any single task or any combination of the tasks specified below.

C.2 SCOPE

The Contractor shall fabricate, assemble, kit, and deliver finished Printed and Bare Circuit

Boards (PCBs) and associated hardware to the Government. All deliveries shall be made in accordance with the specifications within a Government-owned Technical Data Package (TDP).

C.3 APPLICABLE DOCUMENTS & SPECIFICATIONS

Applicable Specifications are below, those clauses with wording that includes “contract,”

“delivery order,” or “task order,” used herein will be understood as “calls.” Not all of these will be used in all agreements. Applicable Specifications for each agreement will be called out in the

Government TDPs provided with future Blanket Purchase Agreement (BPA) calls.

Applicable to PCBs:

IPC-2221B Generic Standard on Printed Circuit Board Designs

IPC-6011 Generic Performance Specification for Printed Boards

IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

IPC-A-600K Acceptability of Printed Boards

IPC-9252B Requirements for Electrical Testing of Unpopulated Printed Boards

IPC-TM-650 Test Methods Manual, No. 2.5.5.7 Characteristic Impedance of Lines on Printed

Boards by TDR

IPC-TM-650 section 2.6.27 , Method 2.6.27, Thermal Stress, Convection Reflow Assembly

Simulation Qualification and Performance Specification for Flexible/Rigid-Flexible Printed

Boards

IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard

Applicable to PCB electronic assemblies:

IPC-J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies

IPC-2223E Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-7095C - Design and Assembly Process Implementation for BGAs

IPC-A-610H Acceptability of Electronic Assemblies

IPC-7711C/7721C Rework, Modification, and Repair of Electronic Assemblies

General:

ISO:9000 certification

AS9100 certification

IPC-2221/2222

EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and WiresIPC J-STD-003B Solderability Tests for Printed Boards

IPC J-STD-004B Requirements for Soldering Fluxes

IPC J-STD-005A Requirements for Soldering Pastes

IPC J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed

Solid Solders for Electronic Soldering Applications

IPC J-STD-012: Implementation of Flip Chip and Chip Scale Technology

IPC J-STD-013: Implementation of Ball Grid Array and Other High Density Technology

IPC J-STD-020F Moisture/Reflow Sensitivity Classification for Non-Hermetic Surface Mount

Devices (SMDS)

IPC J-STD-030A Selection and Application of Board Level Underfill Materials

IPC J-STD-033DHandling, Packing, Shipping and Use of Moisture, Reflow, and Process

Sensitive Devices

C.4 SPECIFIC TASK REQUIREMENTS

The Contractor shall provide the following support as identified in individual BPA calls:

C.4.1 The Contractor shall order and kit required BOM components for completion of a PCB. If a full or partial turn-key build is requested, the Contractor shall also be responsible for storing components throughout the build process. Additional information will be provided in each agreement.

C.4.2 The Contractor shall fabricate PCBs to the standards and specifications identified in the

Government’s design files.

C.4.3 The Contractor shall perform final assembly of PCB components onto fabricated PCBs per the standards and specifications identified in the Government’s design files.

C.4.4 The Contractor shall provide a Certificate of Conformance in accordance with Clause

52.246-15 for all material deliverables.

C.4.5 The Contractor shall manufacture Class II and III boards and/or assemblies in-house. This requirement will be specified at the agreement level if applicable to the BPA call.

C.5 Government Furnished Information (GFI) & Government Furnished Property (GFP)

The Government will provide the Contractor access to all needed and relevant document specifications and standards necessary for the performance of each agreement. In addition, the

Government will transfer files to the Contractor using industry standard Office product formats.

For specialized communications, the Government may use Altium Designer and industry-standard Gerber or ODB files. The Government will transfer Government furnished property

(GFP) to the contractor as necessary for the completion of required tasking. If applicable, GFP will be identified in the agreement.

C.6 Quality Assurance

The Government reserves the right to periodically solicit additional offers to add new vendors to the calling list. Additionally, vendors will continuously be rated based on performance quality.

Vendor acceptance/reject data will be collected from receiving inspection. Calculation percentage for acceptance is equal to total calendar year vendor acceptances divided by total calendar year vendor receipts. Criteria for removal will be if less than a 60% acceptance rate is maintained for a period of more than three (3) purchases or more than one (1) quarter (whichever is greater) before being recommended for removal. The vendor must demonstrate improvement if the acceptance rate is between 60-80%. A qualified performer will maintain an 80% or higher acceptance rate. If the vendor does not demonstrate improvement, the KO will determine if they should be removed from the BPA.

C.7 Security

All work under this BPA will be unclassified. All vendors shall comply with the provisions of the National Institute of Standards and Technology (NIST) Special Publication (SP) 800-171.

Vendors shall have the ability to process and handle International Trafficking in Arms

Regulation (ITAR) designs as necessary. Vendors shall be owned and fully operated within the continental United States (US). This includes maintaining the ability to complete all required tasking within US Facilities.

C.8 Notification of Potential Organizational Conflict(s) of Interest

Offerors are reminded that certain arrangements may preclude, restrict or limit participation, in whole or in part, as either a Sub-Contractor or as a Prime Contractor under this competitive procurement.

C. 9 FEDERAL SUPPLY CODES (FSC):

5962 (Printed Circuit Boards)

5998 (Bare Printed Circuit Board, Electrical and Electronic Assemblies, Cards, and Associated

Hardware)