JA 25-5D6_Redacted.pdf
PDF 813 KB Posted
- Attached to
- Hot Bar Reflow Soldering System
- Solicitation number
- HQ072725QNR03
- Issued by
-
Defense Microelectronics Activity
About this file
This document is a Justification and Approval (J&A) for Other than Full and Open Competition for the Defense Microelectronics Activity (DMEA). The document seeks to acquire a Hot Bar Reflow Soldering System from Advanced Integrated Technologies, Inc. (AIT) using RDT&E funds, with a value that has been redacted. The specific requirement is for a precise soldering system capable of connecting flex circuits to rigid circuit boards and Iridium modems with fine pitch footprints in the PAS Lab.
After conducting market research with multiple vendors (AIT, Sunstone Welders, Manncorp, and Amada Weld Tech), the agency determined AIT is the only vendor meeting their unique requirements. Key differentiators include AIT's custom thermode design for specific board layouts, a compact system footprint that fits within limited lab space, precise temperature control, and the ability to handle sensitive circuit components without damage. The solicitation will be posted on SAM.gov, but no further competitive actions will be pursued due to the unique nature of the requirement. The contracting officer, Nicholas Roberts, certified the cost as fair and reasonable on 4/17/25 and committed to monitoring the market for future alternative technologies.
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Other files
| File | Type | Posted |
|---|---|---|
| Combined Synopsis and Solicitation SOW 25-5C0.pdf | ||
| 25-5D6 SOW Hot Bar Soldering System.pdf |
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