25-5D6 SOW Hot Bar Soldering System.pdf

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Hot Bar Reflow Soldering System
Solicitation number
HQ072725QNR03
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This Statement of Work (SOW) details the procurement of a Hot Bar Reflow Soldering System for the Defense Microelectronics Activity (DMEA) to address reliability issues with Iridium modem-based technologies. The system is specifically required for the Quick Reaction Engineering (QRE) team to improve soldering performance for flex circuits and rigid circuit boards with fine pitch footprints in the PAS Lab.

The SOW specifies a comprehensive system configuration including a TCW-315 Pulse Heat Unit, NA-152 System Head, electric valve unit, base, cylinder head, various cables, a thermode, microscope mounting stand, microscope set, LED light, and a two-position rotary indexer. Key technical requirements include precise temperature profiling, rapid heating and cooling, consistent pressure distribution, programmable process parameters, data logging, and compatibility with various solder and component materials. The system must fit within a 36 x 36 x 24 inch benchtop footprint, and an Operations Manual is required to be submitted 10 days prior to the end of the performance period.

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Combined Synopsis and Solicitation SOW 25-5C0.pdf PDF
JA 25-5D6_Redacted.pdf PDF

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STATEMENT OF WORK (SOW)

DMEA 25-TBD

31 March 2025

Project Engineer:

1.0 SCOPE: Procure Hot Bar Reflow Soldering System to establish a reliable and precise soldering capability for connecting QRE Sword technology flex circuits to rigid circuit boards and Iridium modems designed with fine pitch footprints in the PAS Lab. This acquisition will enable DMEA’s Quick Reaction Engineering (QRE) Iridium modem-based technologies ensuring high reliability soldering performance.

1.1 TITLE: Hot Bar Reflow Soldering System.

1.2 APPLICABILITY: Recent environmental testing of QRE Iridium technologies revealed a significant reliability issue; specifically, modem connectors exhibited unacceptable weakness leading to failures at cold temperatures under environmental stress. To mitigate this issue, the QRE team is developing and implementing a more robust soldering approach to eliminate the connector based issues.

1.3 BACKGROUND: Pulse heated Hot Bar reflow soldering is a process where two pre-fluxed, solder coated parts are heated to a temperature sufficient to cause the solder to melt, flow, and solidify, forming a permanent electro-mechanical bond between the parts and solder.

1.4 PURPOSE: To create a consistent and reliable electromechanical bonds between flex and rigid printed circuit boards. The Hot Bar Soldering system allows for selective heating on specific areas that are very difficult to solder with traditional soldering methods, enabling rapid heat application while maintaining precise temperature control.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES: N/A

2.1 GOVERNMENT DOCUMENTS: N/A

2.2 OTHER DOCUMENTS: N/A

2.3 GOVERNMENT FURNISHED EQUIPMENT: N/A

2.4 GOVERNMENT FURNISHED INFORMATION: N/A

2.5 GOVERNMENT FURNISHED FACILITIES/ACCESS: N/A

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

3.1.1 RESERVED

3.2 PROGRAM MANAGEMENT: None

3.2.1 TECHNICAL INTERCHANGE MEETINGS (TIMs):

3.3 TASK REQUIREMENTS: Hot Bar soldering equipment shall provide precise and repeatable reflow soldering of pre tinned pads or electrically conductive adhesives through controlled applications of heat and pressure. Key requirements include accurate temperature profiling with rapid heating and cooling and consistent pressure distribution. The equipment shall offer programmable process parameters, data logging and compatibility with various solder, flex and component materials ensuring operator safety and ease of maintenance for efficient and reliable production in a lab environment.

3.3.1 REQUIREMENT: Contractor shall provide a Hot Bar Soldering System as identified in the table below, or equivalent:

Qty Model Description P/N

TCW-315 (750VA, 240

120VAC/6.25A)

PULSE HEAT UNIT 7000821-100

1 NA-152 SYSTEM HEAD 5-70 NEWTONS 7001003-100

1 15X-SOL-1 ELECTRIC VALVE UNIT 7013150-101

1 NA.301 BASE 7000864-100

1 NA-221 CYLINDER HEAD 7001067-100

1 NA-221-SVOL-24V ELECTRIC VALVE KIT 7013412-100

1 SH-INRF-500 ACTUATOR CABLE 7013380-100

1 CLD-BL-FSW-HIO-2000 CLD FOOT SWITCH CABLE 7013153-100

1 SFC-60-500-DD-97 WELD CABLE ASSY 7012739-103

1 SLD-14 SLD-14 STYLE THERMODE

1 S-SMS-MS MICROSCOPE MOUNTING STAND 7001175100

1 S-SMS MICROSCOPE SET 7001174100

1 S-SMS-LED LED LIGHT 7001176100

1 IND-2-R1 Two-Position Rotary Indexer

3.3.2 REQUIREMENT: The Hot Bar Soldering System shall fit on a benchtop within a total footprint of 36 x 36 x 24 inches (L x W x H).

3.4 PROGRAM SUMMARY:

4.0 DATA ITEMS: The following CDRLs apply to this delivery order and shall be submitted as described below.

Indicate on the cover of all delivered data the contract number, delivery order number, CET number, CET title, and the current DMEA Project Engineer name and office symbol.

1. Sequence Number A001

2. Title Operations Manual

3. Subtitle

4. Authority TBD

5. Contract Reference Para 3.TBD

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement A

10. Frequency OTIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

15. Total See Distribution List

16. Remarks Contractor format is acceptable.

Block 9: Mark all CDRL items with the distribution statement as shown above in Block 9 and with the following additional statement:

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do not apply to those items identified as technical data or computer software to be furnished with restrictions.

5.0 POINTS OF CONTACT:

DMEA/MEAB:

Address:

Voice:

E-Mail:

DMEA/MEAB:

Address:

Voice:

E-Mail:

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