HR001123S0036_HOTS_FAQ_8-2-23_update.pdf

High Operational Temperature Sensors (HOTS)

HR001123S00236

Frequently Asked Questions (FAQs)

Question 1: What is the anticipated funding level?

Answer 1: Funding requests should be based on cost realism as outlined in Section V.A in the

BAA.

Question 2: Is there an envisioned number of performers?

Answer 2: No

Question 3: Can Subcontractors be on multiple teams?

Answer 3: Yes

Question 4: What evaluation testing will be done?

Answer 4: Proposers should outline technical tasks regarding developing test plan and capability to demonstrate meeting or exceeding all metrics in Table 2 as stated in the page

11 BAA.

Question 5: What is the test environment?

Answer 5: See BAA, Table 2, note 1 for test environment details.

Question 6: Are abstracts considered non-binding?

Answer 6: Yes, abstracts are non-binding (including rough-order-of-magnitude cost estimates).

Question 7: Why is the pressure sensor dynamic range 90 dB?

Answer 7: This value was determined to represent the intersection of technology and impact.

Question 8: What is the timeline for Phase 1 hardware deliverables?

Answer 8: The delivered hardware will be submitted to the IV&V team one quarter before the conclusion of each phase. See BAA Section I.F.

Question 9: What is the pressure range of interest?

Answer 9: See BAA, Table 2, Linear pressure metric and note 6 for details.

Question 10: How about other components (resistors, capacitors, inductors)?

Answer 10: We require a full high-temperature sensor solution that operates at 800 °C .

- If other off-chip components are required for the sensor module to achieve metrics, then describe this in proposal.

- If other off-chip components are required for the packaged sensor demonstrator, discuss and assess the risk to realizing the packaged sensor demonstrator.

Question 11: What is the lowest operating temperature?

Answer 11: The lowest operating temperature is not required in this BAA.

Updated on 8/2/2023

Question 12: Are there any supply voltage or current requirements?

Answer 12: There is no formal requirement. It is recommended that performers apply reasonability to voltage and current requirements for their proposed sensor module to maximize technology transition opportunities.

Question 13: Is the +/-10% voltage threshold variability referring to manufacturing variability or variation over temperature range?

Answer 13: The +/- 10% variability is a manufacturing metric measured over the size scale of the sensor module proposed.

Question 14: Can a performer propose to overcome just one technical challenge?

Answer 14: No.

Question 15: Is there an opportunity to propose alternative sensors to pressure sensors?

Answer 15: No. Proposed solutions must meet or exceed the metrics of the program, which are based on pressure sensors as request in Table 2 of BAA. Proposers can describe their vision of alternative sensors for potential Phase 3 program expansion, as outlined in the BAA.

Question 16: Are mixed signal processing electronics considered or analog only?

Answer 16: HOTS BAA calls for a technology development and demonstration of a pressure sensor module (i.e., integrated transducer and signal-conditioning microelectronics) achieving the program metrics. Depending on proposed approaches, analog and/or mixed signal processing electronics can be considered if necessary for the specific approach to meet program metrics.

Question 17: How does DARPA foresee addressing the supply chain for the raw materials in the transducers and circuits?

Answer 17: Issues of supply chain for materials and equipment are the responsibility of the performer and should be clearly stated in their proposal.

Question 18: How can you go from the independent transducer measurements to the simulated sensor performance?

Answer 18: It is the responsibility of the individual performer to propose their method for demonstrating that they have achieved program metrics.

Question 19: Will DoD operational impact information be provided to performers?

Answer 19: No additional information will be provided outside of the BAA.

Question 20: Is the HOTS program tied to any specific US or foreign government agency or organization?

Answer 20: No.

Question 21: Would a passive sensor interrogated by remote electronics via wireless or optical fiber be an acceptable solution to HOTS?

Answer 21: No. Each proposal must demonstrate how they will overcome the technical challenges outlined in the BAA. As such, the integrated sensor and transistor circuit must be mutually contained in a single element and exposed to a common temperature.

Question 22: Can an internal or external circuit or look-up table be used to compensate temperature sensitivity of the sensor readout when the device is operating at high temperatures?

Answer 22: Yes, as long as the sensor meets the metrics of the program and the results are repeatable.

Question 23: Is there any interest in intermediate sensor system performance values while ramping temperature up to the 800 °C measurement value?

Answer 23: The Government IV&V will not formally evaluate temperature ramping effects in assessing the performance of the device under test in Phase 1 and 2; however, performers may use information from the temperature ramping for their own internal performance assessments and design considerations as they consider concepts for sensor demonstrates in a potential Phase 3 expansion.

Question 24: Can a Technical Challenge be deferred to later in the program, such as in Phase 2?

Answer 24: No. As stated on p. 10 of the BAA "All submitted proposals are expected to address the sensor goals and all three Technical Challenges described in the above Section B of this solicitation throughout all phases of HOTS."

Question 26: Are the resolution specifications in Tables 1 and 2 consistent?

Answer 26: The resolution is 1 Pa/sqrt (Hz), which could be measured as 1 Pa at 1 Hz bin width. Note that 1 kHz is the frequency at which the resolution is measured, it is not the bin width of the resolution measurement.

Question 27: What is considered responsive to the HOTS BAA’s request for innovative claims?

Answer 27: As an introduction in your technical proposal, you are encouraged to succinctly introduce your proposed technical approach and to substantiate the novel, innovative claims. The innovative claims should not be a simple statement of the technical approach or the tasks to complete the technical approach. The innovative claims should be the key novel innovations of your technical approach that will enable it to overcome the technical challenges and meet program metrics. In doing so, each innovative claim should map to a technical challenge. For example, proposing to develop a transistor in response to TC1 in-and-of-itself is not the innovation. Transistors and the majority of transistor types have previously been realized in some fashion. The key innovations are the novel aspects of your transistor approach with respect to the related state-of-the-art transistors of today that will enable your transistor approach to be successful at overcoming the technical challenges meeting the program metrics. This guidance applies to TC2 and TC3 as well.

Question 28: Are modeling, simulation, and/or experimental results recommended in a proposal response?

Answer 28: You are encouraged to present the quantitative projected performance of the technical approach in a table that compares to all of the metrics and constraints found in Table 2 of the BAA. In doing so, as discussed in the BAA (page 26, B. Technical Approach), the technical proposal should provide “…detailed technical rationale, technical approach, and constructive plan for accomplishment of technical goals in support of innovative claims and deliverable creation” and “…explicitly address each of the technical challenges as well as describe how the proposed approach will meet the overall DARPA program metrics and goals.”

Question 29: What are the required maximum and minimum pressure values for the dynamic pressure

Answer 25: The SNR of the transducer MDS and the pressure resolution are both 1 (i.e., 0 dB).

signal (MDS) and the pressure resolution (see table sub-bullet #2) specified?

Question 25: In Table 2, at what signal-to-noise ratio (SNR) is the transducer minimum detectable transducer?

Answer 29: For this dynamic pressure transducer, the noise floor is specified at less than 1 Pa/rtHz at 1 kHz. This means that the dynamic pressure noise floor should be no more than 1 Pa, measured at 1 kHz with a 1 Hz bin width.

The upper limit of the dynamic range of the transducer is specified at 33 kPa. This means that the transducer must be able to measure signals as small as 1 Pa and up to 33 kPa with the linearity requirements as stated in the HOTS BAA’s Table 2 metrics.

Question 30: What is the frequency range for the integrated sensor?

Answer 30: The BAA specifies integrated sensor minimum bandwidth > 1 MHz. There is no maximum bandwidth requirement for the integrated sensor.