HR001123S0036_HOTS_FAQ_6-5-23.pdf

High Operational Temperature Sensors (HOTS)

HR001123S00236

Frequently Asked Questions (FAQs)

Updated on 6/5/2023

Question 1: What is the anticipated funding level?

Answer 1: Funding requests should based on cost realism as outlined in Section V.A in the

BAA.

Question 2: Is there an envisioned number of performers?

Answer 2: No

Question 3: Can Subcontractors be on multiple teams?

Answer 3: Yes

Question 4: What evaluation testing will be done?

Answer 4: Proposers should outline technical tasks regarding developing test plan and capability to demonstrate meeting or exceeding all metrics in Table 2 as stated in the page

11 BAA.

Question 5: What is the test environment?

Answer 5: See BAA, Table 2, note 1 for test environment details.

Question 6: Are abstracts considered non-binding?

Answer 6: Yes, abstracts are non-binding (including rough-order-of-magnitude cost estimates).

Question 7: Why is the pressure sensor dynamic range 90 dB?

Answer 7: This value was determined to represent the intersection of technology and impact.

Question 8: What is the timeline for Phase 1 hardware deliverables?

Answer 8: The delivered hardware will be submitted to the IV&V team one quarter before the conclusion of each phase. See BAA Section I.F

Question 9: What is the pressure range of interest?

Answer 9: See BAA, Table 2, Linear pressure metric and note 6 for details.

Question 10: How about other components (resistors, capacitors, inductors)?

Answer 10: We require a full high-temperature sensor solution that operates at 800 °C .

- If other off-chip components are required for the sensor module to achieve metrics, then describe this in proposal.

- If other off-chip components are required for the packaged sensor demonstrator, discuss and assess the risk to realizing the packaged sensor demonstrator.

Question 11: What is the lowest operating temperature?

Answer 11: The lowest operating temperature is not required in this BAA.

Question 12: Are there any supply voltage or current requirements?

Answer 12: There is no formal requirement. It is recommended that performers apply reasonability to voltage and current requirements for their proposed sensor module to maximize technology transition opportunities.

Question 13: Is the +/-10% voltage threshold variability referring to manufacturing variability or variation over temperature range?

Answer 13: The +/- 10% variability is a manufacturing metric measured over the size scale of the sensor module proposed.

Question 14: Can a performer propose to overcome just one technical challenge?

Answer 14: No

Question 15: Is there an opportunity to propose alternative sensors to pressure sensors?

Answer 15: No. Proposed solutions must meet or exceed the metrics of the program, which are based on pressure sensors as request in Table 2 of BAA. Proposers can describe their vision of alternative sensors for potential Phase 3 program expansion, as outlined in the BAA.

Question 16: Are mixed signal processing electronics considered or analog only?

Answer 16: HOTS BAA calls for a technology development and demonstration of a pressure sensor module (i.e., integrated transducer and signal-conditioning microelectronics) achieving the program metrics. Depending on proposed approaches, analog and/or mixed signal processing electronics can be considered if necessary for the specific approach to meet program metrics.

Question 17: How does DARPA foresee addressing the supply chain for the raw materials in the transducers and circuits?

Answer 17: Issues of supply chain for materials and equipment are the responsibility of the performer and should be clearly stated in their proposal.

Question 18: How can you go from the independent transducer measurements to the simulated sensor performance?

Answer 18: It is the responsibility of the individual performer to propose their method for demonstrating that they have achieved program metrics.

Question 19: Will DoD operational impact information be provided to performers?

Answer 19: No additional information will be provided outside of the BAA.

Question 20: Is the HOTS program tied to any specific US or foreign government agency or organization?

Answer 20: No.

Question 21: Would a passive sensor interrogated by remote electronics via wireless or optical fiber be an acceptable solution to HOTS?

Answer 21: No. Each proposal must demonstrate how they will overcome the technical challenges outlined in the BAA. As such, the integrated sensor and transistor circuit must be mutually contained in a single element and exposed to a common temperature.

Question 22: Can an internal or external circuit or look-up table be used to compensate temperature sensitivity of the sensor readout when the device is operating at high temperatures?

Answer 22: Yes, as long as the sensor meets the metrics of the program and the results are repeatable.

Question 23: Is there any interest in intermediate sensor system performance values while ramping temperature up to the 800 °C measurement value?

Answer 23: The Government IV&V will not formally evaluate temperature ramping effects in assessing the performance of the device under test in Phase 1 and 2; however, performers may use information from the temperature ramping for their own internal performance assessments and design considerations as they consider concepts for sensor demonstrates in a potential Phase 3 expansion.

Question 24: Can a Technical Challenge be deferred to later in the program, such as in Phase 2?

Answer 24: No. As stated on p. 10 of the BAA "All submitted proposals are expected to address the sensor goals and all three Technical Challenges described in the above Section B of this solicitation throughout all phases of HOTS"