Questions Set 3 7 OCT 25.pdf
PDF 22 KB Posted
- Solicitation number
- HQ072725RSW01
- Issued by
-
Defense Microelectronics Activity
About this file
This document is a set of Questions and Answers (Q&A) dated 7 OCT 25 related to a potential federal contract opportunity in microelectronics. The Q&A addresses two specific inquiries from potential vendors: first, regarding microelectronics support technologies, and second, about International Traffic in Arms Regulations (ITAR) compliance.
For the microelectronics support, the government agency clarifies they are not explicitly seeking wire bonding or specific die connect technologies, but noting that vendors with such capabilities could potentially add value to their proposal. Regarding ITAR/EAR99 compliance, the agency indicates that while ITAR certification is not required, having such certification might allow the vendor to be considered for a broader range of future projects and orders. The response suggests the agency is seeking flexibility and additional technical capabilities from potential vendors.
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Questions Set 3 7 OCT 25
1. Could you also clarify that for the support on Microelectronics are you looking for Wire bonding or another technology?
We’re not explicitly looking for Wire-bonding, or other Die connect technologies for this effort. But having a vendor that has these capabilities could add value to their proposal.
2. Does the facility require ITAR/EAR99?
No, ITAR is not required, but it is something that we’d like to know about from the vendors.
Not having it doesn’t hurt their proposal, having it might allow us to use that vendor for a larger set of projects and orders.
File details come from the government source that posted it. Updated .