Questions and Answers.doc

Questions and Answers – Laser Marker and Enclosure Hardware Purchase – SOW 10-0L8 –

PR 1MJ0L801 – RFQ H94003-11-Q-0005

Q1. In Table 1.1, Q-switch frequency is specified at CW, 1-400kHz. What is the reason 400kHz is needed? Could 1-200kHz be sufficient?

A1. The reason we chose a 400 kHz frequency was driven by our future requirement; putting more information on smaller spaces. By having a 400 kHz Q-switch, it will allow much finer resolution of characters as we shrink our text size or create barcodes. This will also enhance our future need; accommodating production lines.

Q2. For Marking Area, 300mm x 260mm x >= +/- 10mm is specified. I understand 300mm x 260mm but what is meant by "x >= +/- 10mm"? Does this mean the system needs to accommodate Z height range of 20mm while marking due to the tray height difference between the thick (12.192mm) and the thin (7.62mm) trays? In the notes section of this item, it states, "without physically moving the marking unit or target". Does this mean that the system is not allowed to use a programmable Z function to adjust to various marking plane heights?

A2. We want a marking unit that will be able to mark at various focal lengths because we have requirements for marking packages, boards, and tools that have inconsistent marking heights. Some laser vendors perform this action by physically moving the z height of the part or moving the entire marking head up/down using motors. This increases tool complexity, reduces focal performance, and increases cycle time. By restricting lasers to those that have variable focal lengths internal to the marking head, we will avoid potential manufacturing and enclosure issues.

Q3. What is meant by the Marking Resolution of 5 microns?

A3. Laser resolution is a variable that determines depth, darkness, and quality of image when engraving/marking. The marking resolution is the minimum focused spot size.

Q4. There's an item, "Laser Cutting" which specifies "Fixed Point/Straight Line/Dashed Line/Oval". Is there a cutting requirement? If yes, which materials (FR4, Kovar, ceramics, etc) and how thick?

A4. The requirements are for cutting/deburring PCB and plastic. There are no minimum thickness requirements.

Q5. Under Marking Style, it reads, "movement marking (constant speed/encoder)". Are parts intended to be marked on the fly as well?

A5. Our future requirements will require marking higher volumes of product. We require our laser markers to be capable of meeting those needs so only the automation/enclosure system, not the laser unit, changes.

Q6. Is there a specification for marking speed?

A6. No, only that it can mark on moving objects.

Q7. Could an xy table be used to expand the marking area, as opposed to using a larger field lens? If not, what is the reason?

Q7. Yes, but it must be fully integrated into the software to allow easy programming of the marking field.

Q8: In your RFQ, Table 1.1 specifies the Nd:YVO4 vanadate laser. The wavelength is specified as either 1064nm or 532nm. There is a significant price and performance difference between these two laser configurations. If the contract award is going to be judged by lowest complying bidder, we will have to quote the lower cost 1064nm laser even though the 532nm laser may be the better choice for some of your materials, particularly gold plated kovar and some ceramics.

Q8: It is up to the vendor to decide which wavelength laser will be quoted for the configuration, as long as the vendor meets the specifications listed in the Statement of Work.