Clarification Comments.docx

Question 1 "Item 4 states that the wafer size is to be less than or equal to 200mm. Item 20 is looking for leveling capabilities on pieces and wafers up to 150mm. Item 21 is looking for a wafer chuck system to accommodate pieces as large as 100mm"

We are not sure what the technical user is really asking for. The use of three different sizes is a little confusing. What specifically is the user going to process?

Question 2 We also need clarification on Item 21 itself. Our "system" can handle pieces as small as 5mm and wafers as large as 200mm. What sized substrates are going to be used with the chuck that is referenced? Each size, for a given wafer chuck, needs to be specified so that the proper vacuum and banking pins can be applied. We would need to know if multiple chucks are going to be ordered, or just one chuck.

Clarification that answers question 1&2 We are a research lab and will be processing 2", 3" and 4" wafers and pieces of wafers as small as 5mm on a side. We are looking at one chuck which will need to accommodate these sizes by having movable pins and vacuum switches. The system will need to be capable (with modifications) of handling 200mm wafers.