Clarification Comments

Question 1 "Item 4 states that the wafer size is to be less than or equal to 200mm. Item 20 is looking for leveling capabilities on pieces and wafers up to 150mm. Item 21 is looking for a wafer chuck system to accommodate pieces as large as 100mm"

We are not sure what the technical user is really asking for. The use of three different sizes is a little confusing. What specifically is the user going to process?

Question 2 We also need clarification on Item 21 itself. Our "system" can handle pieces as small as 5mm and wafers as large as 200mm. What sized substrates are going to be used with the chuck that is referenced? Each size, for a given wafer chuck, needs to be specified so that the proper vacuum and banking pins can be applied. We would need to know if multiple chucks are going to be ordered, or just one chuck.

Clarification that answers question 1&2

We are a research lab and will be processing 2", 3" and 4" wafers and pieces of wafers as small as 5mm on a side. We are looking at one chuck which will need to accommodate these sizes by having movable pins and vacuum switches. The system will need to be capable (with modifications) of handling 200mm wafers.

Question 3 in response to Clarification to questions 1&2

One chuck with interchangeable banking pins is time consuming and inconvenient to the user who is changing out the pins when they go to run different sized substrates. Also, in our experience with our other clients who have used chucks that have banking pins that can be swapped out for different sizes, there has been the issue of users stripping out the threaded screw holes for the banking pins, thus damaging the chuck and requiring a new chuck to be manufactured.

Finally, a chuck that can support such a wide range of sizes, if not designed correctly, will not be able to meet the flatness specifications that a chuck needs to maintain specified performance criteria, such as resolution over the full field.

As an added benefit, the system we use for interchangeability of chucks allows the end user the flexibility to use different substrate thicknesses on the same chucks, by simply ordering an appropriate spacer, which cost much less and can be manufactured much faster than another chuck built to handle a different thickness.

Would WPAFB accept multiple chucks for this requirement?

Updated Clarification that answers questions 1&2

It is up to the discretion of the contractors on how many chuck/s they propose. As long as the contractor can display that all requirements are meet they may propose a single chuck or multiple chucks.