Attachment A - SOW.pdf
PDF 324 KB Posted
- Attached to
- Silicon Substrates
- Solicitation number
- RFQ-452273
- Issued by
-
Department of Energy Office of Science
About this file
This document is a Statement of Work (SOW) for the fabrication of six silicon substrates. The SOW provides detailed specifications for the size, surface quality, and other requirements of the substrates, including length, width, thickness, polishing, and optical specifications. The SOW is attached to a Request for Quote (RFQ) issued by Brookhaven Science Associates (BSA) on behalf of the U.S. Department of Energy Office of Science. The RFQ solicits proposals for the fabrication of these six silicon substrates per the SOW requirements. The proposal due date is October 18, 2024 at 5:00 p.m. EDT, and the deliverables are required 7-8 weeks after receipt of the order. This RFQ has been posted on the SAM.gov website under solicitation number RFQ-452273.
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Other files
| File | Type | Posted |
|---|---|---|
| Enclosure B - Pricing Sheet 452273.docx | DOCX document | |
| PO-452273 (Draft).PDF | ||
| RFQ-452273.pdf |
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Text version
P.O. Box 5000 Upton, NY 11973-5000 managed by Brookhaven Science Associates for the U.S. Department of Energy
Statement of Work Object: Silicon Substrate PI : Mourad IDIR midir@bnl.gov, 631 344 8127 Schedule 9 weeks
Project Objective This SOW is for the fabrication/design/of 6 Silicon Substrates
Project Scope The scope of this project is the fabrication of 6 Silicon substrates with the following specifications.
Size (mm)
Specs
L: 450+/-0.2 W: 30 +/-0.2 T: 30+/-0.2
One side polish, other side ground roughness 0.3 nm as seen by WLI x2.5 and x20 Clear aperture ~ 90% of the length x 20 mm Tolerance: +/-0.2mm - Surface quality: 60/40 Chips：≤0.8mm - Bevel：≤0.8mmx45°FW Deviation：FLAT 0.75 lambda
L: 110+/-0.2 W: 30+/-0.2\ T: 30+/-0.2
Concave-plane - One side polish (concave) -other side ground (plane) roughness 0.3 nm rms as seen by WLI x2.5 and x20 Clear aperture 100 mm x 25 mm - Tolerance: +/-0.2mm Surface quality: 60/40 - Chips：≤0.8mm - Bevel：≤0.8mmx45°FW IRR lambda/5 Radius 91.3 m +/-2% (concave)
L:150+/-0.2 W: 50+/-0.2 T: 50+/-0.2
Concave-plane, One side polish (concave) - other side ground (plane) Radius 18.6 m +/-1% (concave) roughness 0.3 nm rms as seen by WLI x2.5 and x20 Clear aperture 140 mm x 35 mm Tolerance: +/-0.2mm Surface quality: 60/40 - Chips：≤0.8mm - Bevel：≤0.8mmx45°FW IRR lambda/5
Deliverables Describe each deliverable.
Deliverable Description Due Date (in # of days or weeks after contract award) Do not put a specific date in here.
Deliverables: 6 Silicon Substrates
7-8 weeks ARO (after receipt of order)
This information is controlled by the U.S. Department of Commerce Export Administration Regulations 15 CFR Parts 730-774 as EAR99 Technology.”
Attachment A
Silicon Mirrors A
Silicon Mirrors B
Silicon Mirrors C mailto:midir@bnl.gov
File details come from the government source that posted it. Updated .