Attachment 1 - SOW Rev.docx

NIST Requirements Document Custom Magneto-resistive Sensors and Arrays

I. Background The NIST Sensor Science Division is responsible for advancing the measurement science, standards, and applications for sensing optical power, temperature, humidity, pressure, vacuum, flow, and related physical phenomena to support U.S. industry and trade. Our laboratory performs measurements and calibrations using magnetic and infrared optical detectors, and we fabricate our own measurement systems around custom detectors optimized for use with these systems. The custom-designed magneto-resistive sensors and arrays to be purchased will be used as part of a scanning magnetic microscope we are developing for acquisition of 3D thermal images in semiconductor packages.

II. Scope We require fabrication of custom magneto-resistive sensors and sensor arrays according to designs that meets our specifications. The contract will begin with initial design drawings from the manufacturer, and after review and modifications, the final design will be approved by both parties before fabrication begins. These sensors and sensor arrays will be used for magnetic field detection in a scanning magnetic microscope we are developing for the CHIPS Metrology Project 03.12 (3D Thermal Imaging of Advanced Packages).

III. Minimum Requirements The system shall meet or exceed the minimum requirements identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered. The use of “gray market” components not authorized for sale in the U.S. by the Contractor is not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.

Custom Magneto-resistive Sensors and Arrays Detailed Requirements

**The sensors and arrays delivered must have bare-die detectors, meeting the following specifications:

1) Frequency range

a) detectors must operate from DC to 100 kHz

b) 1/f knee must be at frequency of 1 kHz or below

2) Field sensitivity

a) 1 nT/(Hz)0.5 at 10 kHz

b) 1 nT/(Hz)0.5 at 1 kHz

c) 10 nT/(Hz)0.5 at 100 Hz

3) Operating conditions

a) The sensors must be able to operate in saturation fields up to 10 mT, where the saturating field can be DC or AC

b) Magnetometer, gradiometer, Wheatstone bridge, and compensation coil designs are all acceptable if they can meet all the specifications required

c) In-plane or perpendicular sensing are acceptable as long as all technical specifications are met

d) Operating temperature of at least 10 C – 85 C

4) Dimensions and Geometry

a) Single pixel sensor size must be 2 mm x 2mm

b) 2D arrays must contain at least 50 sensors in each direction (≥ 2500 sensors total) and have a total area ≤ 50 mm in each direction

c) It must be possible for the sensors to be placed within 1 mm of the surface of a device under test

5) Deliverable specifications

a) At least two wafers of sensors will be delivered (Wafer#1 = minimum 100 single pixel sensors, Wafer#2 = minimum 4 arrays), preferably diced into individual die. In the bid, manufacturers have the option to quote the price for additional single pixel and array wafers, undiced.

b) Multiple designs can be fabricated on the wafer to test different geometries. Single sensor designs and 2D arrays are required, but linear arrays up to 50 devices can also be added to one of the wafers.

c) Sensors must be delivered according to the timeline in the Deliverables section, and the final wafer designs must be approved by both parties before fabrication

d) Documentation of wafer sensor and array CAD, measured specifications, operation instructions must be provided. Technical support must be offered for 1 year.

IV. Deliverables

V. Delivery Delivery shall be FOB Destination (or equivalent terms, such as INCOTERMS Delivered Duties Paid) are required and shall occur not later than (NLT) 250 days ARO.

FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The contractor shall deliver all Line Items to:

The National Institute of Standards and Technology 100 Bureau Drive, Building 221 Gaithersburg, MD 20899 VI. Inspection and Acceptance In addition to the inspection and acceptance terms articulated in 52.212-4, the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.

A list of specifications and dimensioned drawings of the sensors and arrays shall be provided to us by the vendor before fabrication indicating that the sensors and arrays will meet all of our requirements. Representative sensors and arrays from the delivered wafers or from a witness wafer must be tested by the manufacturer prior to shipping to ensure that performance specifications (frequency range, field sensitivity, operation in background fields) have been met. Upon receipt at NIST, the sensor and array wafers will be inspected for damage and then inspected for compliance with the approved CAD design. If there is no damage and the sensor and array wafers match the designs, representative sensors and arrays will be tested to ensure that performance specifications (frequency range, field sensitivity, operation in background fields) have been met. If there is no damage and the performance tests are passed, NIST will accept the magneto-resistive sensors and arrays.

The Government will test, inspect, and accept the equipment onsite within 7 business days of the receipt. Visual inspection of the sensor wafer and array wafer will be performed by the NIST TPOC to identify surface defects or any form of indication that the sensors were damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the magneto-resistive sensors and arrays due to defects and/or nonconformance.

VII. Warranty The contractor shall warrant the sensors and arrays for a period of a minimum of 1 year after receipt of the equipment and shall be in accordance with terms in FAR 52.212-4

VIII. Payment Schedule The Contractor shall be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice, in accordance with the following schedule:

1. 100% after inspection and acceptance testing by the TPOC of representative sensors and arrays.

2. The Government anticipates acceptance will occur:

a. After the system passes the performance testing set forth in this document

b. After receiving an invoice submitted properly, in accordance with the purchase order terms and conditions