Attachment 1 SOW.pdf
PDF 641 KB Posted
- Attached to
- 16 MP EUV Vacuum Flanged Camera Federal contract opportunity
- Solicitation number
- 1333ND26QNB030094
About this file
Statement of Work Summary: 16 MP EUV Vacuum Flanged Camera
This Statement of Work defines requirements for the acquisition of a single 16 megapixel (MP) extreme ultraviolet (EUV) vacuum-flange-mounted charged-coupled device (CCD) camera system for the National Institute of Standards and Technology (NIST) Spin Electronics Group in Boulder, Colorado. The camera will support EUV ptychographic reflectometry research to develop advanced metrology capabilities for characterizing next-generation semiconductor transistor structures. The system must be new, commercially available (not custom, prototype, or experimental), flange-mounted to a DN160 CF (8-inch ConFlat) vacuum flange compatible with high-vacuum conditions (<10⁻⁸ Torr), and include all peripherals, software drivers for LabVIEW compatibility, and complete documentation. Delivery is F.O.B. Destination to NIST in Boulder, with approximately 18 weeks from award to completion, including factory acceptance testing at 12 weeks and system delivery at 15 weeks, followed by 2 weeks of post-delivery commissioning.
Critical sensor specifications include: back-illuminated CCD with quantum efficiency exceeding 60% for photon energies between 30-90 eV; minimum 4000×4000 pixel array (16 MP) with 14-16 micron pixels and 100% fill factor; active sensor area of at least 61mm×61mm; readout noise of ≤4 electrons rms at slow rates (<500 kHz) and <10 electrons rms at fast rates (≥1 MHz); three configurable ADC readout rates; frame rates exceeding 0.5 fps at full resolution and 8 fps at 16×16 binning; integrated thermoelectric cooling to below -80°C; and dark current specifications of <0.006 electrons/pixel/sec at -55°C, <1×10⁻⁴ electrons/pixel/sec at -90°C, and <20 electrons/pixel/sec at room temperature. The vendor must demonstrate delivery of at least 3 identical cameras to other customers and provide raw performance data from an identical unit at both room temperature and -90°C for NIST verification. Payment is scheduled as 35% upon drawing approval, 20% upon factory acceptance, 15% upon delivery, and 30% upon successful inspection and acceptance, with Net 30-day terms. The contractor must provide a 1-year minimum warranty covering parts, labor, and shipping and comply with NIST security and safety requirements, including badge requirements for the restricted campus and BNL security protocols.
View the file
Other files for this federal contract opportunity
| File | Type | Posted |
|---|---|---|
| CSS1333ND26QNB030094 16MP EUV Vacuum Flanged Camera .docx | DOCX document | |
| Solicitation questions and answers .docx | DOCX document | |
| CSS 1333ND26QNB030094 16 MP EUV Vacuum Flanged Camera.docx | DOCX document | |
| Attachment 2 Clauses and Provisions.docx | DOCX document |
On GovTribe
Work with this file on GovTribe
- Download the original file
- Contacts named in this file
- Similar government files
- Ask GovTribe AI about this file
Text version
STATEMENT OF WORK
16 MP EUV Vacuum Flanged Camera
EUV Ptychographic Reflectometry (1.06) 686.12
I. BACKGROUND INFORMATION
The semiconductor supply chain is global, specialized, and interconnected. Chipmakers do business with thousands of individual suppliers that provide the highly complex materials and tools used to produce semiconductors. To address the lack of full visibility into the semiconductors markets supply chain and R&D ecosystem gaps NIST will conduct the measurement science, or metrology, critical to the development of new materials, packaging, and production methods in chip manufacturing. As part of this effort, NIST has a program to develop new methods to non-destructively measure and characterize the structure of complex nanoscopic devices. This approach is based on applying an extreme ultraviolet (EUV) high-harmonic generation (HHG) light source to combine reflectometry with spatial imaging and atomic core level spectroscopy. In order to collect the scattered EUV light from the sample needed for imaging, a large area Charged Coupled Device (CCD) camera sensitive to EUV with sufficient dynamic range, pixel density and noise characteristic is required. Both operation at room temperature (RT) and at
– 80 C will be used to achieve high-throughput and high resolution/sensitivity, respectively. As a result, minimum performance metrics must be met at both temperatures must be met.
II. SCOPE
The Spin Electronics Group requires a large area 16 MP vacuum flange mounted CCD camera with a high quantum efficiency, low noise and high-dynamic range in the EUV and soft-x-ray portion of the electromagnetic spectrum. The area of active CCD and pixel spacing (density) set the ultimate spatial resolution that can be achieved with ptychography. The noise floor, dark counts, background consistency, and dynamic range ultimately set the limits of detection within the image. The settings affecting frame rate (e.g., kinetics mode, readout rate, vertical shift speed, binning and region of interest settings) ultimately determine the rate of imaging and data acquisition. All of these factors require careful consideration in selecting the best CCD camera to achieve the goals of the CHIPS R&D EUV ptychographic reflectometry (1.06) that include spatial resolution of 50 nm with sensitivity to detect trace impurities or defects. This is needed to develop a new measurement and imaging capability that supports the need of semiconductor manufacturing. Specifically, our EUV ptychographic reflectometry program will develop new metrology to characterize the physical, interfacial and material structure of next generation transistors. The proposed metrology was explicitly called for by semiconductor companies and currently does not exist. This program critically relies on efficiently collecting and imaging the scattered EUV light obtained from a sample over a large dynamic range.
This camera is most critical to this program since – as with most microscopes – nothing can be done without capturing an image with a camera. EUV ptychographic reflectometry is no exception. The camera itself determines many of the limitations of the technique such as resolution and detection sensitivities. The inability to obtain a 16 MP camera outlined in this acquisition would greatly limit the ability to achieve the resolution needed to address the metrology needs at the transistor level.
Awarding this procurement within this Fiscal Year is necessary to maintain project timelines and meet critical milestones related in developing the first-of-it-kind instrument and employing it to improve time-to-market for new semiconductor technologies. Furthermore, current supply chain dynamics indicate potentially long lead times for this specialized camera system.
III. MINIMUM REQUIREMENTS
The Contractor shall provide a system that meets all technical specifications identified below.
All items must be new. Used or remanufactured equipment will not be considered for award.
Experimental, prototype, or custom items will not be considered. The use of “gray market” components are not authorized for sale in the U.S. by the Contractor is not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.
Line Item 0001:
Description: 16 MP EUV camera and peripherals Quantity: 1
A. Technical Specifications
General Specifications:
1. The camera must be a flange-mounted camera compatible with high-vacuum or better ( < 10-8 Torr).
2. The camera must be mounted to a DN160 CF (8 inch ConFlat) vacuum flange, with through holes (unthreaded).
3. The communication interface must be USB or ethernet
4. Software drivers must be provided to communicate with the camera using LabVIEW.
5. All required peripherals such as cables, software and power supplies must be included.
6. Must include a complete software package that allows for full operation of and data acquisition with the camera.
7. Must have an output (either TTL or high-voltage) to control an external shutter between exposures.
8. Custom, unproven products will not be considered. Delivery of at least 3 identical cameras to other customers must be demonstrated.
Sensor Specifications:
1. The sensor must be a back-illuminated charge-coupled device (CCD) sensor and exposed on the vacuum side of the flange.
2. The sensor must have a quantum efficiency greater than 60% for light for photon energies between 30 eV and 90 eV.
3. The camera must have at least three (3) ADC readout rates: one 500 kHz or less (slow rate), one nominally at 1 MHz, one between 1 MHz and 5 MHz (fast rate).
4. The camera frame rate must exceed 0.5 frames per second at full ROI with 1x1 binning (aka unbinned), 4-port readout, the fast readout rate, and a vertical shift rate between 40usec/row and 50usec/row.
5. The camera framerate must exceed 8 frames per second at full ROI with 16x16 binning, 4-port readout, the fast readout rate, and a vertical shift rate between 40usec/row and 50usec/row.
6. The camera framerate must exceed 3.9 frames per second when configured to read two ROIs that are 100 x 100 pixels (width x height) placed at opposite corners of the sensor, with 1x1 binning (aka unbinned), 1-port readout, the fast readout rate, and a vertical shift rate between 40usec/row and 50usec/row.
7. The pixels on the sensor must have an active area full well depth of at least 150,000 electrons.
8. The output node must have a full well depth at least 300,000 electrons.
9. The sensor must have pixels with a width and height between 14 microns and 16 microns with a
100% fill factor.
10. The sensor must have a number of active pixels in a minimum of 4000 x 4000 array (16
MegaPixel)
11. The sensor must be able to read out a software-configurable number of “virtual pixels,” sometimes referred to as “overscan region/rows/columns,” that are insensitive to any light present and accurately represent the readout and amplifier electronics over all modes of operation. The number of overscan rows/columns must be configurable from 0 to at least 200.
12. The dimensions of the sensor active area must meet or exceed 61 mm x 61 mm.
13. The camera must be reconfigurable during normal operation between vertical shift speeds ranging from <50 us to >150 us.
14. The sensor must have a readout noise of 4 electrons rms or less when using the slow readout rate (< 500 kHz).
15. The sensor must have a readout noise under 10 electrons rms when using the fast readout rate
(>= 1 MHz).
16. The sensor must have an integrated thermoelectric cooler capable of cooling the sensor to below -80 C.
17. Must have a dark current below 0.006 electrons/pixel/sec at -55 C, below 1e-4 electrons/pixel/sec at -90C, and below 20 electrons/pixel/sec at room temperature (+25 C).
Vendor is required to provide raw data/images recorded at both room temperature and -90 C sufficient for NIST to verify performance.
18. Frame-to-frame background variation at room temperature (RT) must be below the following metric: Record at least 100 frames at room temperature with full ROI, 1x1 binning, an exposure time between 3 and 7 seconds, and a readout rate of 1MHz. Compute the difference between consecutive frames, forming “difference images.” Compute the root-mean-square of each difference image, forming a 500x1 vector. The standard deviation divided by the mean (std/mean) of that vector must be below 1%. In other words, the standard deviation divided by the mean (std/mean) of the root-mean-square (RMS) differences between consecutive pairs of a series of dark background images must be below 1 % at RT for exposure times of 3-7 sec with a readout rate of 1 MHz. We require the vendor to provide a series of 100 consecutive images taken from an identical camera of the RT background under the above conditions for NIST to verify this performance metric. NIST will perform the analysis and calculation of the raw data provided. This metric will also need to be met with 500 frames during the factory acceptance testing.
19. The ADC must have a bit depth of at least 18 bits
20. Must be able to switch between 1-port, 2-port and 4-port readout modes.
21. The region of interest must be able to be a rectangle with corners located anywhere on the sensor when using 1x1 binning and 1-port readout.
22. The sensor must be able to be configured using the camera software to read out multiple, smaller regions of interest each frame instead of reading out the full chip or a larger, single region of interest.
23. The sensor must be able to perform hardware-scale binning.
24. The system must be able to operate with both air cooling (down to -60 C) and water cooling
(down to – 90 C).
25. The camera must have both “full-frame” mode (in which the pixels are all exposed as a single frame and read out together) and “kinetics” mode (in which a few rows are designated as those to be exposed and the remainder of the sensor is configured to act as storage for those rows, thereby enabling a single frame readout of the camera to contain multiple exposures that can be captured at a much higher, “burst” framerate).
26. The camera operation and software must support using 1-port, 2-port, and 4-port readout in both full-frame and kinetics readout modes.
27. In Kinetics Mode, the user must be able to set the kinetics window height from 1 to at least 1024 rows.
28. In Kinetics Mode, the user must be able to set the storage shift rate to at least two different rates: one < 50 us/row and one > 150 us/row.
29. In addition to any other trigger modes supported by the camera, the camera must support a trigger mode (most relevant to kinetics mode) that triggers one shift per trigger.
30. The camera must be able to operate with exposure times spanning at least 1 ms to 20 minutes.
31. The camera must support at least two analog gain settings (aka low noise and high capacity).
Other specifications:
1. The sensor itself must protrude from the plane of the flange by 1.5 to 2.0 inches.
2. Shall include PC compatible (Windows 11) software to run and operate the camera and acquire images.
3. Before shipping the system, the contractor shall provide the Government a standard factory acceptance (FAT) report demonstrating that the DWEBL system performs according to the contractor’s standard factory acceptance test. The Government reserves the right to be present during the factory acceptance test. The contractor shall provide the Government with a schedule of the factory acceptance test at least 60 days prior to the test to ensure that the Government has enough time to arrange for travel to the factory.
4. The contractor shall supply all parts, hardware, equipment, and labor required to perform the tasks listed.
IV. DELIVERABLES
Standards of Acceptance: The NIST POC or COR shall review all the above deliverables and respond with an acceptance or request for revision email to the Contractor Point of Contact (POC) within 14 days of receipt of deliverable. This section applies to deliverables which must be reviewed and approved for acceptances (e.g., draft plans, drawings, etc.)
V. PLACE OF PERFORMANCE
a. The camera shall be installed at the 325 Broadway, Boulder CO 80305
VI. PERIOD OF PERFORMANCE/LEAD TIME
The period of performance will take approximately 18 weeks ARO.
Item Description Period Date(s) Factory Acceptance 12 weeks ARO Site Visit N/A System Delivery 15 weeks ARO Installation N/A Commissioning the system 2 weeks post delivery
VII. DELIVERY TERMS
Delivery shall be F.O.B Destination and shall occur in accordance with the delivery due dates provided in the above table.
Deliverable Number
Description
Quantity Due Date Format
1 Provide final drawings and configuration for approval
One (1) 2 weeks Electronic (PDF, .doc, .docx, etc.)
2 Factory acceptance testing One (1) 12 weeks In person or electronic
3 Delivery & Installation with remote support
One (1) 15 weeks
FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The contractor shall deliver all Line Items to:
Attn: Justin Shaw
DOC/NIST
Shipping & Receiving 325 Broadway MS686.12 Boulder, CO 80305 +1 303-497-4421 justin.shaw@nist.gov
VIII. Installation The system shall be installed by NIST and meet contract specifications no later than 12 weeks after delivery. Contractor shall provide remote support to NIST as needed during this process.
IX. INSPECTION & ACCEPTANCE
In addition to the inspection and acceptance terms articulated in 52.212-4, the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.
Performance Tests:
1. NIST will perform acceptance testing to verify all specifications listed above. Testing will be performed in a high vacuum environment.
NIST may choose at its discretion to forego this part of acceptance testing.
A visual inspection of the equipment will be performed by the NIST COR to identify surface defects or any form of indication that any equipment was damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the equipment due to defects and/or nonconformance. The vendor is responsible for latent defects discovered any time after final inspection. However, the extent of its liability shall be prorated over the useful life of the equipment.
Ownership of the equipment shall transfer to NIST upon acceptance by the Government.
The Government will test, inspect, and accept or reject the equipment within 14 days of the receipt of the equipment unless otherwise indicated above. The Government reserves the right to conduct quality assurance testing to confirm that a given instrument(s) meets the manufacturer’s and/or the Government’s performance specifications. It is anticipated that the equipment will meet all manufacturer’s specifications and/or the Government’s performance specifications identified in the most recent operations and maintenance manual for each piece of equipment and/or in this document.
X. WARRANTY
The contractor shall warranty the entire system for a period of a minimum of 1 year after receipt of the equipment and shall be in accordance with terms in FAR 52.212-4. Warranty shall commence upon acceptance of the system by the Government and at a minimum shall include the following: parts, labor and shipping All parts, shipping, and labor costs shall be covered by the vendor
XI. PAYMENT SCHEDULE
The Contractor will be paid, in accordance with the payments clause in the contract and as otherwise noted in this document, upon receipt of a proper invoice The Contractor must invoice in arrears according to the payment schedule. The Contractor shall be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice, in accordance with the following schedule:
Approval of drawing and configuration 35% Factory Acceptance 20% Delivery to site 15% Successful Inspection and Acceptance
30%
NOTE: Partial shipments and partial invoices will not be accepted, unless otherwise requested and accepted by the Contracting Officer prior to award offer. Proposed payment schedules shall be submitted with vendor’s response to the RFQ for consideration.
XII. REQUIREMENTS FOR CONTRACTOR PERSONNEL
Identify all qualifications that the Contractor and/or their personnel working on this contract must possess.
Safety: The Contractor employee must be responsible for knowing and complying with all installation safety prevention regulations. Such regulations include, but are not limited to, general safety, fire prevention, and waste disposal.
Security: NIST is a restricted campus. An identification badge is required for access for entry into buildings and is shown to the armed Security Police when entering the campus. Additionally, the Contractor must meet BNL security requirements.
Identification Badges: Contractor employees must comply with NIST identification and access requirements. Each Contractor employee must wear a visible identification badge provided by the NIST Security Office. Additionally, the Contractor must meet BNL security requirements.
Vehicle Registration: All Contractor employees must register their vehicles with the NIST Security Office to gain access to the campus. A valid driver’s license, Government-furnished civilian ID, proof of insurance and current registration must be presented to the NIST Security Office, at which time a NIST vehicle pass will be issued. The pass must be displayed on the vehicle in accordance with NIST Security Office instructions. Additionally, the Contractor must meet BNL security requirements.
Media Inquiries: The Contractor shall not respond to any media inquiries. Any inquiries from the media shall be immediately relayed to the NIST COR and/or Contracting Officer (CO). There shall be no interviews, comments, or any other response without the knowledge and approval of the NIST COR or Designated Government Official.
File details come from the government source that posted it. Updated .