Attachment 1 - SOW.docx
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- Attached to
- Custom Magneto-resistive Sensors
- Solicitation number
- 1333ND26QNB030051-01
About this file
This is a Statement of Work (SOW) for the fabrication of custom magneto-resistive sensors and sensor arrays for the National Institute of Standards and Technology (NIST) Sensor Science Division. The sensors will be used in a scanning magnetic microscope being developed for the CHIPS Metrology Project 03.12, specifically for acquiring 3D thermal images in semiconductor packages. The contractor must fabricate bare-die detectors meeting strict performance specifications, including a frequency range from DC to 100 kHz with a 1/f knee at 1 kHz or below, field sensitivity of 1 nT/(Hz)^0.5 at both 10 kHz and 1 kHz, and operational capability in saturation fields up to 10 mT across a temperature range of 10°C to 85°C. Single pixel sensors must measure 2 mm x 2 mm, while 2D arrays must contain at least 2,500 sensors (50 in each direction) with a total area of 50 mm in each direction, positioned within 1 mm of the device under test surface.
Deliverables consist of three line items: initial design drawings (20 days), final design drawings (20 days), and at least two wafers of magneto-resistive sensors (200 days lead time). The contractor must deliver a minimum of 100 single pixel sensors and 4 arrays, preferably diced, with complete CAD documentation, measured specifications, operation instructions, and one year of technical support. Delivery must be FOB Destination or equivalent (INCOTERMS Delivered Duties Paid) to NIST in Gaithersburg, Maryland, no later than 240 days after receipt of order. The Government reserves the right to perform performance testing and inspections, including visual inspection for surface defects and compliance with approved CAD designs. The contractor must warrant the sensors for a minimum of one year after acceptance, and payment will be made at 100% upon inspection, acceptance testing, and receipt of a proper invoice under Net 30-day terms, contingent upon the system passing performance testing.
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| File | Type | Posted |
|---|---|---|
| Attachment 2 - Clauses .docx | DOCX document | |
| Combined Synopsis Solicitation 1333ND26QNB030051.docx | DOCX document |
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NIST Requirements Document Custom Magneto-resistive Sensors and Arrays
I. Background The NIST Sensor Science Division is responsible for advancing the measurement science, standards, and applications for sensing optical power, temperature, humidity, pressure, vacuum, flow, and related physical phenomena to support U.S. industry and trade. Our laboratory performs measurements and calibrations using magnetic and infrared optical detectors, and we fabricate our own measurement systems around custom detectors optimized for use with these systems. The custom-designed magneto-resistive sensors to be purchased will be used as part of a scanning magnetic microscope we are developing for acquisition of 3D thermal images in semiconductor packages.
II. Scope We require fabrication of custom magneto-resistive sensors and sensor arrays according to designs that meets our specifications. The contract will begin with initial design drawings from the manufacturer, and after review and modifications, the final design will be approved by both parties before fabrication begins. These sensors and sensor arrays will be used for magnetic field detection in a scanning magnetic microscope we are developing for the CHIPS Metrology Project 03.12 (3D Thermal Imaging of Advanced Packages).
III. Minimum Requirements The system shall meet or exceed the minimum requirements identified below. All items must be new. Used or remanufactured equipment will not be considered for award. Experimental, prototype, or custom items will not be considered. The use of “gray market” components not authorized for sale in the U.S. by the Contractor is not acceptable. All line items shall be shipped in the original manufacturer’s packaging and include all original documentation and software, when applicable.
The sensors delivered must be bare-die detectors, meeting the following minimum specifications:
1) Frequency range
a) detectors must operate from DC to 100 kHz
b) 1/f knee must be at frequency of 1 kHz or below
2) Field sensitivity
a) 1 nT/(Hz)0.5 at 10 kHz
b) 1 nT/(Hz)0.5 at 1 kHz
c) 10 nT/(Hz)0.5 at 100 Hz
3) Operating conditions
a) The sensor must be able to operate in saturation fields up to 10 mT, where the saturating field can be DC or AC
b) Magnetometer, gradiometer, Wheatstone bridge, and compensation coil designs are all acceptable if they can meet all the specifications required
c) In-plane or perpendicular sensing are acceptable as long as all technical specifications are met
d) Operating temperature of at least 10 C – 85 C
4) Dimensions and Geometry
a) Single pixel sensor size must be 2 mm x 2mm
b) 2D arrays must contain at least 50 sensors in each direction (≥ 2500 sensors total) and have a total area ≤ 50 mm in each direction
c) It must be possible for the sensors to be placed within 1 mm of the surface of a device under test
5) Deliverable specifications
a) At least two wafers of sensors will be delivered (minimum 100 single pixel sensors, minimum 4 arrays), preferably diced into individual die. In the bid, manufacturers have the option to quote the price for additional single pixel and array wafers, undiced.
b) Multiple designs can be fabricated on the wafer to test different geometries. Single sensor designs and 2D arrays are required, but linear arrays up to 50 devices are also possible.
c) Sensors must be delivered according to the timeline in the Deliverables section, and the final wafer design must be approved by both parties before fabrication
d) Documentation of wafer sensor CAD, measured specifications, operation instructions must be provided. Technical support must be offered for 1 year.
IV. Deliverables
| Line-Item Number |
| Description |
| Quantity |
| Lead Time |
| Initial Design Drawings |
| Initial design of full wafer of magnet-resistive sensors |
| One set of initial design drawings |
| 20 days |
| Final Design Drawings |
| Final design of sensor wafer |
| One set of final design drawings |
| 20 days |
| At Least two Wafers of Magneto-resistive Sensors |
| Magneto-resistive sensors as approved in Final Drawings |
| One (1) |
| 200 days |
V. Delivery Delivery shall be FOB Destination (or equivalent terms, such as INCOTERMS Delivered Duties Paid) are required and shall occur not later than (NLT) 240 days ARO.
FOB Destination means: The contractor shall pack and mark the shipment in conformance with carrier requirements, deliver the shipment in good order and condition to the point of delivery specified in the purchase order, be responsible for any loss of and/or damage to the goods occurring before receipt and acceptance of the shipment by the consignee at the delivery point specified in the purchase order; and pay all charges to the specified point of delivery. The contractor shall deliver all Line Items to:
The National Institute of Standards and Technology 100 Bureau Drive, Building 221 Gaithersburg, MD 20899 VI. Inspection and Acceptance In addition to the inspection and acceptance terms articulated in 52.212-4, the Government reserves the right to perform such performance tests and evaluations as defined below to verify specified system performance. Such tests and evaluations, if performed, shall be conducted within the environment that the system is to be operated. The Contractor has the right to be present during the tests and evaluations, if performed, at the Contractor’s expense.
A list of specifications and dimensioned drawings of the sensors shall be provided to us by the vendor before fabrication indicating that the sensors will meet all of our requirements. Representative sensors from the wafer or from a witness wafer must be tested by the manufacturer prior to shipping to ensure that performance specifications (frequency range, field sensitivity, operation in background fields) have been met. Upon receipt at NIST, the sensor wafer will be inspected for damage and then inspected for compliance with the approved CAD design. If there is no damage and the sensor wafer matches the design, representative sensors will be tested to ensure that performance specifications (frequency range, field sensitivity, operation in background fields) have been met. If there is no damage and the performance tests are passed, NIST will accept the magneto-resistive sensors.
The Government will test, inspect, and accept the equipment onsite within 7 business days of the receipt. Visual inspection of the sensor wafer will be performed by the NIST TPOC to identify surface defects or any form of indication that the sensors were damaged during transport to NIST. The Government shall have sole discretion to require repair or replacement of damaged and/or nonconforming supplies at no cost to the Government. The Government at any time prior to acceptance shall reject the magneto-resistive sensors due to defects and/or nonconformance.
VII. Warranty The contractor shall warrant the sensors for a period of a minimum of 1 year after acceptance of the equipment and shall be in accordance with terms in FAR 52.212-4
VIII. Payment Schedule The Contractor shall be paid, in accordance with Net 30-day payment terms, upon receipt and acceptance of a proper invoice, in accordance with the following schedule:
1. 100% after inspection and acceptance testing by the TPOC of representative sensors.
2. The Government anticipates acceptance will occur:
a. After the system passes the performance testing set forth in this document
b. After receiving an invoice submitted properly, in accordance with the purchase order terms and conditions
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