Enclosure_L.2-Compliance_Matrix.pdf

Section Requirement Compliant (C)/Non-

Compliant (NC)

Comment

4.0a Func./Perform. Req - Env.

4.0b Func./Perform. Req - 70W

4.1.1 Center Frequency

4.1.2 Operating Band

4.1.3 Saturated Output Power

4.1.4a Stability - Saturation Point

4.1.4b Stability - Pout vs. Pin

4.1.4c Stability - Input Drive Levels

4.1.4d Stability - Simult. Terminated

4.1.4e Stability - W/Out Use of Isolators

4.1.4f Stability - Elec. and Therm. Ranges

4.1.5.1a RF Input Interface - Type of RF Input

4.1.5.1b RF Input Interface - Waveguide

4.1.5.1c RF Input Interface - Flange Config.

4.1.5.1d RF Input Interface - RF-IN

4.1.5.2a RF Input Return Loss - Cold

4.1.5.2b RF Input Return Loss - Hot

4.1.5.3a RF Output Interface - Waveguide

4.1.5.3b RF Output Interface - Flange Config.

4.1.5.3c RF Output Interface - RF-OUT

4.1.5.4a RF Output Return Loss - Cold

4.1.5.4b RF Output Return Loss - Hot

4.1.5.5 Load Return Loss

4.1.6a Input RF Power - Input Signal Level

4.1.6b Input RF Power - Over Accept. Temp.

4.1.6c Input RF Power - Over 15 Degree C

4.1.6d Input RF Power - Vs. Frequency

4.1.6e Input RF Power - Obtain. Output Pwr

4.1.7 Over Drive Capability

4.1.8 Noise Figure

Enclosure L.2-Compliance Matrix

4.1.9 Carrier-to-Intermodulation Ratio

4.1.10 Signal Phase Shift

4.1.11 AM to PM Conversion

4.1.12a Signal Gain - Compression

4.1.12b Signal Gain - Flatness

4.1.12c Signal Gain - Slope

4.1.12d Signal Gain - Group Delay

4.1.12e Signal Gain - Group Delay Slope

4.1.13a Spurious - 4 kHZ band

4.1.13b Spurious - 1 MHZ band

4.1.13c Spurious - Out-of-Band

4.1.14 Harmonics - 2nd

4.1.14 Harmonics - 3rd

4.1.15.1 Undervoltage Protection

4.1.15.2 Overpower Protect. and Auto Restart

4.1.16a Helix Overcurrent Protect - Enable

4.1.16b Helix Overcurrent Protect. - Disable

4.1.16c Helix Overcurrent Protect. - Restart

4.2.1 Mass Allocation

4.2.2a Nominal Power Allocation - Standby

4.2.2b Nominal Power Allocation - Peak

4.2.2c Nominal Power Allocation - On

4.3.1 Pri. (Unregulated) Power Input Req.

4.3.1.1 Operating Voltage Range

4.3.1.2 Abnormal Voltages

4.3.1.3 Voltage Ripple

4.3.1.4 Voltage Transients

4.3.1.5 Sudden Removal of Power

4.3.1.6 Polarity Reversal Protection

4.3.1.7 Over-Current Protection

4.3.1.8 Pri. Power Return Ground

4.3.1.9 Power Wiring Redundancy

4.3.2.1 Turn-on Current Transients

4.3.2.2a Op. Current Transients

4.3.2.2b Current Rate Change

4.3.2.3 Repetitive Transients

4.4.1 Primary Power DC Isolation

4.4.2 Secondary Returns

4.4.3 Secondary to Primary DC Isolation

4.4.4 Mechanical Contact Resistance

4.4.6 Ground Strap, Non-Conductive Sur.

4.4.6.1 Ground Lug Contact Area

4.4.8 Connector DC Resistance

4.5.1.1a Active Analog Tlm. Interface - Min.

4.5.1.1b Active Analog Tlm. Interface - S/C

4.5.1.2 Active Analog Tlm. Short Circuit Protect.

4.5.1.3 Active Analog Tlm. Srce and Load Resist.

4.5.1.4 Anode V, Helix Curr., DC Pwr Tlm. Char.

4.5.1.4 Active Analog Tlm. Accuracy

4.5.1.4 Active Analog Tlm. Output Imped.

4.5.1.5a TWTA RF Power Output Tlm.

4.5.1.5b TWTA RF Power Output Tlm.

4.5.2.1 Passive Analog Tlm. Interface

4.5.3.1 Digital Status Telemetry

4.5.3.2 Digital Tlm. Voltage Range

4.5.3.3 Digital Tlm. Short Circuit Protected

4.5.3.4 Digital Tlm. Source and Load Resistance

4.5.3.5 Digital Status Max Voltage

4.5.3.6 Digital Status Return Line

4.5.5.1a Pulse Commands - Redundancy

4.5.5.1b Pulse Commands - Characteristics

4.5.5.1c Pulse Commands - Dedicated Return

4.5.5.1d Pulse Command - Return Isolated

4.5.6.2 Multipaction

4.6.1 TWTA States

4.7 Command/Data

5.1 Interface Documentation

5.1.1 Mechanical Interface

5.1.2 Electrical Interface

5.2.1a Comp. Mass - EPC

5.2.1b Comp. Mass - TWT

5.2.2 Center of Mass Location

5.2.3 Center of Mass Accuracy

5.2.4 Moments and Prod. Inertia

5.3a Physical Envelope - EPC

5.3b Physical Envelope - TWT

5.3c Physical Envelope - Cable

5.4a Mounting - MICD

5.4b Mounting - Flatness

5.4c Mounting - Connector locations

6.1a Margins of Safety

6.1b Proof Test

6.2 Quasi Static Limit Loads

6.3.1 Fundamental Launch Freq.

6.4.1 Sinusoidal Vibration

6.4.2 Random Vibration

6.5a Shock - Design

6.5b Shock - Assessment

6.5c Shock - Assessment Provide

6.5d Shock - Test

6.5e Shock - Test 2 Actuations

6.7 Transportation

6.7.1 Transportation Cleanliness

6.8.1 Operating Pressure Range

6.8.2a Max. Depressurization Rate - Perf.

6.8.2b Max. Depressurization Rate - Vent

6.10a Ground Environments - General

6.10b Ground Environments - Off

6.11.1a Temp. Limits - OFF

6.11.1b Temp. Limits - ON

6.11.1c Temp. Limits - Qual limits

6.11.1d Temp. Limits - Dissipation at Satur.

6.11.1e Temp. Limits - Conduction Only

6.11.1f Temp. Limits - No-Drive Mode

6.12.2.1 Min. TID Tolerance

6.12.2.2 ELDR Evaluation

6.12.3 Displacement Damage Dose

6.12.4 SEE - Tolerate Errors

6.12.4.1a SELs - Threshold

6.12.4.1b SELs - Eval

6.12.4.1c SELs - No Latent Damage

6.12.5 Charging Environment

7.1.1.1 Particulate Contamination

7.1.2.1 Particulate Generation

7.1.2.2.1 Material Selection

7.1.2.2.2 Material Selection - Silicones

7.1.2.2.3a Assembly Outgassing - Measure

7.1.2.2.3b Assembly Outgassing - NTE

7.1.2.2.3c Assembly Outgassing - Cold Finger

7.1.2.3 Intentional and Unint. Vents

7.1.2.4 Intentional and Unint. Vents – Filters

7.1.2.5a Pressure Buildup Prevent. - Ascent

7.1.2.5b Pressure Buildup Prevent. - High Vacuum

7.1.3.1 Cleanability – Sensitive Surfaces

7.1.3.2 Cleanability – Cleaning Methods

7.2.1 Conductive Surface Ground Path

7.2.3 Closeout of Gaps and Apertures

7.2.3.1 Conductive Tape Surface Resistivity

7.2.3.2 Conductive Tape, Grounding

7.2.4 Exposed Harness Specific Req.

8.1.1 EEE Parts

8.1.2a Materials - Assembly

8.1.2b Materials - External Mounting

8.1.2c Materials - External Non-Mounting

8.1.2.1 Material Conductivity

8.1.2.2a Material Limit for DCA - Limit

8.1.2.2b Material Limit for DCA - Mass

8.1.2.2c Material Limit for DCA - Assemblies

8.2.1a Test Sensors - Designed for Flight

8.2.1b Test Sensors - Not Removed

8.2.2.1.1a Connector Specifications - INST-0002

8.2.2.1.1b Connector Specifications - Env. Seals

8.2.2.1.2 Prohibit External Box Power Connector

8.2.2.1.3 Contact Derating

8.2.2.1.4 Redundant Contact Derating

8.2.2.2a Signal Segregation - Separate

8.2.2.2b Signal Segregation - Isolate

8.2.2.3 Test and Flight Signal Isolation

8.2.2.4.2 Facility-Induced ESD GSE Malfunction

8.2.2.4.3 Facility-Induced GSE Malfunction

8.2.3.1a Mitigat. for Internal Charging - Impl.

8.2.3.1b Mitigat. for Internal Charging - Analyze

8.2.3.2 Floating Conductors

8.2.3.3.1 Bulk Resistivity

8.2.3.3.2 Charge Bleed-Off

8.3 Safety - ELV Safety Req.

8.4.1.2 CE101

8.4.1.3 CE102

8.4.1.4 CMCE

8.4.2.2 CS101

8.4.2.3 CS114 - Radio Freq. Ripple

8.4.2.4 CS106

8.4.2.5 CS114 - Power and Signal Cables

8.4.3.1 RE102

8.4.4.1 RS103

8.4.5.1 CE106

8.5a Identification and Marking - ID

8.5b Identification and Marking - Mark

8.6.1 Workmanship Standards

8.6.2.2.1 Connector Uniqueness

8.6.2.2.3 Connector Keying

8.6.2.2.4 Accessibility

8.6.2.2.5 Connector Gender

8.6.2.3 Test Connectors

8.6.2.4 Connector Identification

8.6.2.5 Protection of Unused Test Connectors

8.6.2.6 Connector Savers

8.7.1a Mission Life

8.7.1b Ground Storage Time

8.7.2.1 Total Time

8.7.2.2a Failure Free Time - Last Hours

8.7.2.2b Failure Free Time - Vacuum

8.7.3a Mean Time to Failure - EPC

8.7.3b Mean Time to Failure - TWT

8.7.4 Operating Times

8.7.5 On/Off Cycle

9.1a Structural Req. - Worst Case Loads

9.1b Structural Req. - Margins

9.1.1 Component Fatigue

9.1.2a Fracture Control Req. - MUA

9.1.2b Fracture Control Req. - Application

9.1.2c Fracture Control Req. - Analysis

9.2.1.1 Factors of Safety

9.2.1.2 Supplemental Factor

9.2.1.3 Ultimate Design Loads

9.2.1.4 Yield Design Loads

9.2.1.5 Design Separation Load

9.2.2.1.1 Locking Feature Minimum

9.2.2.1.2 Locking Feature Verification

9.2.2.1.3 Locking Feature Installation

9.2.2.1.4 Snap Ring & Cotter Pin Use Limitation

9.2.2.1.5 Snap Ring & Cotter Pin Use

9.2.2.2.1 Torque Measurement

9.2.2.2.2 Witness Coupons

9.2.2.2.3 Cure Samples

9.2.2.3.1 Locking Features - Spec.

9.2.2.3.2 Locking Features - Validation

9.2.2.4.1 Installation Torque Range

9.2.2.4.2 Running Torque Identification

9.2.3.1 Minimum and Maximum Preload

9.2.3.2 Analysis Addressing Potential Rupture

9.2.3.3 Ultimate Strength Analysis

9.2.3.4 Applied Shear Loading

9.2.3.5 Shear Loading

9.2.3.6 Simult. Applied Tensile and Shear Loads

9.2.3.7 Allowable Yield Tensile Load

9.2.3.8 Separation Analysis

9.2.3.9 Seal Analysis

11.0 Verification Requirements

11.2 Inspection Requirements

11.2.1 Visual Inspection

11.2.2 Physical Measurement

11.2.3 Documentation Search

11.4a Test Requirements - Trends

11.4b Test Requirements - Previous Qual

11.4.2 Test Factors

11.4.4.1 Failure During Tests

11.4.4.2 Modification of Hardware

11.4.4.3 External Adjustment

11.5.3a Static Loads/Strength Test - Application

11.5.3b Static Loads/Strength Test - Powered

11.5.3c Static Loads/Strength Test - Performance

11.5.3d Static Loads/Strength Test - Functional

11.5.3.2 Static Pull

11.5.4 Sine Sweep Survey

11.5.5 Sine Vibration

11.5.6 Random Vibration

11.5.9 Shock

11.5.10 Thermal Vacuum Bake-out

11.5.11.1 Thermal Vacuum Test Parameters

11.5.11.2 Thermal Vacuum Test Profile

11.5.15 EMI/EMC Tests

11.5.15.1 Conducted Emissions Tests

11.5.15.2 Conducted Susceptibility Tests

11.5.15.3 Radiated Emissions Tests

11.5.15.4 Radiated Susceptibility Tests