454244 - Statement of Work_DRAFT_10-23-2024.pdf
PDF 142 KB Posted
- Attached to
- GaAs Sensors
- Solicitation number
- 454244
- Issued by
-
Department of Energy Office of Science
About this file
This document is a Draft Statement of Work for a federal contract opportunity regarding the fabrication of GaAs strip and pixel sensor devices. The contractor is required to fabricate 384 strip sensors and 128x128 pixel array sensors on a total of 2 GaAs wafers. The strip sensors are to have a 6mm length and 125 micron pitch, while the pixel sensors are to have a 150 micron pitch. The wafers are to be diced before shipment to Brookhaven National Laboratory.
The related federal contract opportunity is for a full and open competition for GaAs Sensors, with a Firm Fixed Price Contract anticipated to be awarded on or around December 20th, 2024. The applicable NAICS code is 334413 "Semiconductor and Related Device Manufacturing" and the anticipated delivery timeline is 3 months after contract award. Interested parties must be registered under the applicable NAICS code in SAM prior to submitting quotes.
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Other files
| File | Type | Posted |
|---|---|---|
| 454244 - Synopsis_10-25-2024.pdf |
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Text version
P.O. Box 5000
Upton, NY 11973-5000 managed by Brookhaven Science Associates for the U.S. Department of Energy
Subject: GaAs Strip and Pixel Sensor
Date: October 23, 2024
SCOPE:
The Contractor shall fabricate 384 strip and 128X128 pixel array sensor in GaAs wafer.
REQUIREMENTS:
Brookhaven National Laboratory (BNL) requests the following devices in GaAs wafer (total number of wafers – 2).
1. Each wafer shall contain 3-4 pcs of strip sensor 384 strips, 6mm long, and a pitch of 125 micron (exact number shall be decided based on the available space in a 3-inch wafer).
2. Each wafer shall contain 2 pcs of MMPAD pixel sensors (150 micron pitch and 128x128 pixel array).
3. Wafer shall be diced before shipment to BNL.
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