36E77619B0020-0003008.pdf

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Expand Patient Parking Garage - Cleveland - Minor Construction
Solicitation number
36E77619B0020
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This document provides details for an upcoming federal construction contract opportunity to expand an existing patient parking garage at the Cleveland VA Medical Center. The project scope involves completing the fourth deck of the garage to add 132 parking spaces, extending vertical transportation and stairs, and improving lighting and façade work including a suicide prevention barrier. The solicitation will be issued as an Invitation for Bid and awarded as a firm-fixed-price contract using design-bid-build procedures. It will be set aside as a Service-Disabled Veteran-Owned Small Business opportunity with a NAICS code of 236220 and size standard of $39.5 million. The solicitation is expected to be released on October 18, 2019 with all bids due on the date specified. The period of performance is approximately 280 calendar days from notice to proceed. The magnitude of construction is estimated between $2,000,000 and $5,000,000.

36E77619B0020 0003 270526_-_Grounding_and_Bonding_for_Communications_Systems.pdf

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VA Project No. 541-378 Louis Stokes Cleveland VAMC AE Works Project No. 18027 Expand Patient Parking Garage

100% Construction Drawings

GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS

27 05 26 - 1

SECTION 27 05 26

GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS

PART 1 - GENERAL

1.1 DESCRIPTION

A. This section identifies common and general grounding and bonding requirements of communication installations and applies to all sections of Divisions 27.

1.2 RELATED WORK

A. Low voltage wiring: Section 27 10 00, CONTROL, COMMUNICATIONS AND

SIGNAL WIRING.

1.3 SUBMITTALS

A. Submit in accordance with Section 27 05 11, REQUIREMENTS FOR

COMMUNICATIONS INSTALLATIONS.

B. Provide plan indicating location of system grounding electrode connections and routing of aboveground and underground grounding electrode conductors.

C. Closeout Submittals: In addition to Section 27 05 11, REQUIREMENTS FOR

COMMUNICATIONS INSTALLATIONS provide the following:

1. Certified test reports of ground resistance.

2. Certifications: Two weeks prior to final inspection, submit following to COR:

a. Certification materials and installation is in accordance with construction documents.

b. Certification complete installation has been installed and tested.

PART 2 - PRODUCTS

2.1 COMPONENTS

A. Grounding and Bonding Conductors:

1. Provide UL 83 insulated stranded copper equipment grounding conductors, with the exception of solid copper conductors for sizes

6 mm² (10 AWG) and smaller. Identify all grounding conductors with continuous green insulation color, except identify wire sizes 25 mm²

(4 AWG) and larger per NEC.

2. Provide ASTM B8 bare stranded copper bonding conductors, with the exception of ASTM B1 solid bare copper for wire sizes 6 mm² (10 AWG) and smaller.

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GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS

27 05 26 - 2

B. Splices and Termination Components: Provide components meeting or exceeding UL 467 and clearly marked with manufacturer’s name, catalog number, and permitted conductor sizes.

C. Ground Terminal Blocks: Provide screw lug-type terminal blocks at equipment mounting location (e.g. backboards and hinged cover enclosures) where rack-type ground bars cannot be mounted.

1. Electroplated tin aluminum extrusion.

2. Accept conductors ranging from #14 AWG through 2/0.

3. Hold conductors in place by two stainless steel set screws.

4. Two 6 mm (1/4 inch) holes spaced on 15.8 mm (5/8 inch) centers to allow secure two-bolt attachment.

5. Listed as a wire connector.

D. Splice Case Ground Accessories: Provide splice case grounding and bonding accessories manufactured by splice case manufacturer when available. Otherwise, use 16 mm² (6 AWG) insulated ground wire with shield bonding connectors.

E. Irreversible Compression Lugs:

1. Electroplated tinned copper.

2. Two holes spaced on 15.8 mm (5/8 inch) or 25.4 mm (1 inch) centers.

3. Sized to fit the specific size conductor.

4. Listed as wire connectors.

F. Antioxidant Joint Compound: Oxide inhibiting joint compound for copper-to-copper, aluminum-to-aluminum or aluminum-to-copper connections.

PART 3 - EXECUTION

3.1 EQUIPMENT INSTALLATION AND REQUIREMENTS

A. Exterior Equipment Grounding: Bond exterior metallic components

(including masts and cabinets), antennas, satellite dishes, towers, raceways, primary telecommunications protector/arresters, secondary surge protection, waveguides, cable shields, down conductors and other conductive items to directly to Intersystem Bonding Termination.

B. Install telecommunications bonding backbone conductor throughout building via telecommunications backbone pathways effectively bonding all interior telecommunications grounding busbars in telecommunications rooms to telecommunications main grounding busbar in Demarc room after testing bond to verify bonding conductor for telecommunications from grounding electrode conductor is installed per NEC. Size

100% Construction Drawings

GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS

27 05 26 - 3 telecommunications bonding backbone conductor as specified in TIA-607-

B.

C. Inaccessible Grounding Connections: Utilize exothermic welding for bonding of buried or otherwise inaccessible connections with the exception of connections requiring periodic testing.

D. Conduit Systems:

1. Bond ferrous metallic conduit to ground.

2. Bond grounding conductors installed in ferrous metallic conduit at both ends of conduit using grounding bushing with #6 AWG conductor.

E. Boxes, Cabinets, and Enclosures:

1. Bond each pull box, splice box, equipment cabinet, and other enclosures through which conductors pass (except for special grounding systems for intensive care units and other critical units shown) to ground.

F. Corrosion Inhibitors: Apply corrosion inhibitor for protecting connection between metals used to contact surfaces, when making ground and ground bonding connections.

G. Telecommunications Grounding System:

1. Bond telecommunications grounding systems and equipment to facility’s electrical grounding electrode at Intersystem Bonding

Termination.

2. Provide hardware as required to effectively bond metallic cable shields communications pathways, cable runway, and equipment chassis to ground.

3. Install bonding conductors without splices using shortest length of conductor possible to maintain clearances required by NEC.

4. Provide paths to ground that are permanent and continuous with a resistance of 1 ohm or less from each raceway, cable tray, and equipment connection to telecommunications grounding busbar.

5. Below-Grade Connections: When making exothermic welds, wire brush or file the point of contact to a bare metal surface. Use exothermic welding cartridges and molds in accordance with manufacturer’s recommendations. After welds have been made and cooled, brush slag from weld area and thoroughly clean joint areas. Notify COR prior to backfilling at ground connections.

6. Above-Grade Bolted or Screwed Grounding Connections:

a. Remove paint to expose entire contact surface by grinding.

100% Construction Drawings

GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS

27 05 26 - 4

b. Clean all connector, plate and contact surfaces.

c. Apply corrosion inhibitor to surfaces before joining.

7. Bonding Jumpers:

a. Assemble bonding jumpers using insulated ground wire of size and type shown on drawings or use a minimum of 16 mm² (6 AWG) insulated copper wire terminated with compression connectors of proper size for conductors.

b. Use connector manufacturer’s compression tool.

8. Bonding Jumper Fasteners:

a. Conduit: Connect bonding jumpers using lugs on grounding bushings or clamp pads on push-type conduit fasteners. Where appropriate, use zinc-plated external tooth lockwashers or Belleville Washers.

b. Wireway and Cable Tray: Fasten bonding jumpers using zinc-plated bolts, external tooth lockwashers or Belleville washers and nuts.

Install protective cover, e.g., zinc-plated acorn nuts, on bolts extending into wireway or cable tray to prevent cable damage.

c. Grounding Busbars: Fasten bonding conductors using two-hole compression lugs. Use 300 series stainless steel bolts, Belleville Washers, and nuts.

d. Slotted Channel Framing and Raised Floor Stringers: Fasten bonding jumpers using zinc-plated, self-drill screws and

Belleville washers or external tooth lock washers.

H. Backboards: Provide a screw lug-type terminal block or drilled and tapped copper strip near top of backboards used for communications cross-connect systems. Connect backboard ground terminals to cable runway using an insulated 16 mm² (6 AWG) bonding jumper.

I. Other Communication Room Ground Systems: Ground metallic conduit, wireways, and other metallic equipment located away from equipment racks or cabinets to cable tray or telecommunications ground busbar, whichever is closer, using insulated 16 mm² (6 AWG) ground wire bonding jumpers.

J. Communications Cable Grounding:

1. Bond all metallic cable sheaths in multi-pair communications cables together at each splicing or terminating location to provide 100 percent metallic sheath continuity throughout communications distribution system.

100% Construction Drawings

GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS

27 05 26 - 5

2. Install a cable shield bonding connector with a screw stud connection for ground wire, at terminal points. Bond cable shield connector to ground.

3. Bond all metallic cable shields together within splice closures using cable shield bonding connectors or splice case manufacturer’s splice case grounding and bonding accessories. When an external ground connection is provided as part of splice closure, connect to an effective ground source and bond all other metallic components and equipment at that location.

K. Communications Raceway Grounding:

1. Conduit: Use insulated 16 mm² (6 AWG) bonding jumpers to bond metallic conduit at both ends and intermediate metallic enclosures to ground.

2. Cable Tray Systems: Use insulated 16 mm² (6 AWG) grounding jumpers to bond cable tray to column-mounted building ground plates (pads) at both ends and approximately 16 meters (50 feet) on centers.

L. Ground Resistance:

1. Install telecommunications grounding system so resistance to grounding electrode system measures 5 ohms or less.

2. Measure grounding electrode system resistance using an earth test meter, clamp-on ground tester, or computer-based ground meter as defined in IEEE 81. Record ground resistance measurements before electrical distribution system is energized.

3. Backfill only after below-grade connection have been visually inspected by COR. Notify COR twenty-four hours before below-grade connections are ready for inspection.

3.2 FIELD QUALITY CONTROL

A. Perform tests per BICSI’s Information Technology Systems Installation

Methods Manual (ITSIMM), Recommended Testing Procedures and Criteria.

B. Perform two-point bond test using trained installers qualified to use test equipment.

C. Conduct continuity test to verify that metallic pathways in telecommunications spaces are bonded to TGB or TMGB.

D. Conduct electrical continuity test to verify that TMGB is effectively bonded to grounding electrode conductor.

E. Visually inspect to verify that screened and shielded cables are bonded to TGB or TMGB.

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GROUNDING AND BONDING FOR COMMUNICATIONS SYSTEMS

27 05 26 - 6

F. Perform a resistance test to ensure patch panel, rack and cabinet bonding connection resistance measures less than 5 Ohms to TGB or TMGB.

- - - E N D - - -

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