25-5E1 PWS Microelectronics Systems Integration IDIQ Redacted.pdf

PERFORMANCE WORK STATEMENT (PWS)

DMEA 25-5E1

13 June 2025

1.0 SCOPE: Manufacturing Service Contract enabling a turn key solution for full turn-key Microelectronic

Systems Integration tasks including PCB Fabrication, Component Procurement, PCB Assembly, CCA Cleaning and

Coating, PCB/CCA/System Rework/Repair, Mechanical Component Manufacturing, , Automated CCA/System

Testing, Burn-In/Environmental Screening, and Microelectronics System Integration/Assembly.

1.1 TITLE: Microelectronics Systems Integration IDIQ

1.2 APPLICABILITY: DMEA frequently produces developmental, prototype, and production electronics systems for use by Department of Defense (DoD) Programs.

1.3 BACKGROUND: DMEA’s mission includes developing electronics solutions that solve DoD obsolescence issues and/or provides state of the art Microelectronics solutions to DoD Programs. As such, there is a need to (1) produce Printed Circuit Board Assemblies (PCBAs), (2) procure and fabricate electronic and electro-mechanical components, (3) post process CCAs including testing, screening, and subsequent assembly steps, (4) Integrate all sub-components into a full Microelectronic Solution and (5) Program, Test, Validate, and Screen the full system per

Design specifications

1.4 PURPOSE: Obtain full system Microelectronics Manufacturing services and products from a commercial entity including all possible fabrication, manufacturing, testing, assembly, and integration processes common to Producing a robust, reliable Microelectronics System or sub-system suitable for use in Aerospace, Defense, Automotive and

Space applications.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES: The government will provide engineering drawings, assembly drawings, material lists (e.g. bill of materials (BOM) and Government Furnished Material

(GFM)), and/or requirement specifications (e.g. technical data package (TDP)), to define PCB Fabrication and

Assembly requests, as required.

2.1 GOVERNMENT DOCUMENTS:

Document No. Date Title

Varies per design/order PCB (Printed Circuit Board) Design TDP (Technical Data Package)

Varies per design/order Bill of Materials (BOM) for Electrical Sub-Components

Varies per design/order CCA (Circuit Card Assembly) Design TDP (Technical Data Package)

Varies per design/order Mechanical Component TDP (Technical Data Package)

Varies per design/order Bill of Materials (BOM) for Mechanical Sub-Components

Varies per design/order System Assembly TDP (Technical Data Package)

Varies per design/order Microelectronic System Bill of Materials (BOM)

Varies per design/order CCA/System Automated Test Plan (ATP)

Varies per design/order Environmental Test Plan

Varies per design/order Cable/Harness TDP (Technical Data Package)

2.2 GOVERNMENT FURNISHED EQUIPMENT/MATERIALS/INFORMATION:

2.2.1: GOVERNMENT FURNISHED MATERIAL (GFM): The government may provide Electronic or Mechanical

Components necessary for the Contractor to assemble PCBAs and/or Microelectronics System. Any components that will be provided by DMEA to the contractor shall be identified in a Government Furnish Material (GFM) list, as a subset of the production Bill of Materials (BOM). The GFM and BOM may be consolidated into a single list

(BOM) so long as quantities of GFM are sufficiently annotated within the BOM.

2.2.2: GOVERNMENT FURNISHED EQUIPMENT (GFE): The government may provide fixtures and equipment necessary for Contractor to test and validate various elements of the Microelectronics System. Any items that will be provided by DMEA to the contractor shall be identified when the order is coordinated. The contractor shall safeguard this government equipment and limit its distribution to personnel that need it to perform subject electronics programming, testing, validation, and screening tasks. Unless otherwise directed within an order, the contractor shall return all Government Furnished Equipment (GFE) to the government upon completion of the associated order.

2.2.3: GOVERNMENT FURNISHED INFORMATION (GFI): The government may provide Software, Firmware, or other information/applications to enable automated Microelectronics System programming, testing, validation, and screening use as Government Furnished Information (GFI). The contractor shall safeguard this government information and limit its distribution to personnel that need it to perform subject electronics programming, testing, validation, and screening tasks.

2.2.3.1: DISPOSITION OF GFI: GFI material that cannot be physically returned, the following Destruction Notice applies: For classified documents, follow the procedures in DoD 5200.22M, “Industrial Security Manual”, Section

II-19 or DoD 5200.lR, “Information Security Program Regulation,” Chapter IX. For unclassified, limited documents, destroy by any method that will prevent disclosure of contents or reconstruction of the document.

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS: The contractor shall manufacture, fabricate, procure, assemble, test, and integrate the products described within Section 3.1 through individual Integration orders per government provided

TDPs. Microelectronic Manufacturing and Integration efforts could include all of the tasks described forthwith or be limited to just one of the tasks. The contractor shall have in-house capabilities for PCB Assembly (Section 3.1.3), PCB/CCA Cleaning (Section 3.1.4), PCB/CCA/System Repair (Section 3.1.8), and Microelectronic System

Programming/Acceptance Testing (Section 3.1.9); the contractor shall also propose an internal or out-sourcing plan that captures at least 6 of the remaining 10 Microelectronics Systems Manufacturing and Integration tasks described forthwith:

3.1.1 PCB FABRICATION REQUIREMENT: The contractor shall produce requested quantities of PCBs in accordance with fabrication requirements and specification documents for board thickness, layer count, surface finish, trace tolerance, and any other pertinent fabrication specifications.

3.1.1.1 The contractor shall fabricate PCBs in accordance with specified IPC-A-600 classification; if IPC

Classification is not specified in the provided TDP, the contractor shall fabricate PCBs to IPC Class 3 requirements.

3.1.1.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, impedance matching test results, and/or results of Quality Control inspections. (A002, A003)

3.1.1.3 Unless otherwise specified in the TDP, the contractor has control over panelization strategies, fiducial markings, and excess materials needed to account for production fall out.

3.1.1.4 If the contractor does not have internal PCB Fabrication capabilities, it is acceptable to sub-contract PCB

Fabrication to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of PCB fabrication activities.

3.1.1.5 The contractor shall return all excess PCB materials to DMEA after completion of production activities.

3.1.2 COMPONENT PROCUREMENT AND INVENTORY STORAGE REQUIREMENT: The contractor shall procure sufficient materials and components, as identified on the BOM, to enable the assembly of requested quantities of PCBAs/CCAs. Any components that will be consigned to the contractor by DMEA will be identified on the BOM.

3.1.2.1 The contractor shall review suitability of Government furnished materials (GFM) and components and request any additional information, materials, and/or components within 5 days of receipt of the GFM

3.1.2.2 The contractor shall only use authorized distributors or Original Equipment Manufacturers (OEMs) to source electronic components. Any alternative sources, like third party distributers or brokers, shall be approved by DMEA prior to components being procured.

3.1.2.3 The contractor shall rapidly execute component orders, to ensure supply chain disruptions can be immediately accounted for and lead times can be minimized. The contractor shall provide evidence of orders being placed and received. For component and material orders that are excessively costly, partial payments and/or early payments can be negotiated prior to award of the order, upon contractor request. (A005)

3.1.2.4 The contractor shall identify suitable alternates to components that are not immediately available, or that have prohibitively long lead times. Any alternate components shall be approved by DMEA subject matter experts

(SMEs: the PE or COR as identified on the SOW) prior to procurement of the components.

3.1.2.4.1 Note: DMEA may request some additional spares of critical components be procured, to support rework due to post-production test and validation activities; these spares will be identified in the TDP and BOM, when applicable.

3.1.2.5 Unless quantities of components are deliberately specified or limited in the TDP or BOM, the contractor has control over quantities of sufficient spares needed to accommodate losses possible in their PCB Assembly processes.

Any alternate components shall be approved by DMEA SMEs prior to procurement of the components.

3.1.2.6 The contractor shall return all excess materials and components to DMEA after completion of production activities.

3.1.2.7 The contractor shall ensure procured material and equipment are stored in a controlled environment suitable for storage of electrical and mechanical components in accordance with IPC-J-STD-033D.

3.1.3 PCB ASSEMBLY REQUIREMENT: The contractor shall assemble requested quantities of PCBAs (also referred to as Circuit Card Assemblies (CCAs)) in accordance with layout specifications and assembly requirement documents for solder selection, component placement, bill of materials, stencil design, and any other pertinent assembly specifications.

3.1.3.1 The contractor shall assemble PCBAs in accordance with specified J-STD-001 and IPC-A-610 classification;

if IPC Classification is not specified in the provided TDP, the contractor shall assemble PCBAs to IPC Class 2 requirements.

3.1.3.2 The contractor shall provide technical reports, as required, documenting electrical continuity test results, and/or results of Quality Control inspections performed in accordance with specified IPC-A-610 inspections. (A003)

3.1.3.3 Unless otherwise specified in the TDP, the contractor shall use Tin-Lead (Sn-Pb) solder in all applicable assembly process.

3.1.3.3.1 Note: Some components may be fabricated with Lead-free solder. Unless specified in the TDP, these components shall not be reballed. Hybrid soldering processes are acceptable in the attachment of these components.

3.1.3.4 The contractor shall have PCB Assembly capabilities.

3.1.3.5 The contractor shall return all excess materials utilized in PCB Assembly process to DMEA after completion of production activities, including setup units and units that are not functional after assembly. Setup and failed units shall be clearly marked and segregated from the production units.

3.1.4 PCBA/CCA CLEANING REQUIREMENT: The contractor shall clean manufactured PCBs, PCBAs, and/or

CCAs in accordance with IPC classification level and per solder flux cleanliness best practices. Aqueous and

Chemical Surfactant based cleaning processes are both acceptable, and should be selected based on whether the flux chemistry is water soluble or “no-clean”.

3.1.4.1 The contractor shall clean bare PCBs and/or assembled CCAs in accordance with specified J-STD-001 and

IPC-A-610 classification; if IPC Classification is not specified in the provided TDP, the contractor shall clean PCBs and/or CCAs to IPC Class 2 requirements.

3.1.4.2 The contractor shall evaluate components for compatibility with cleaning processes and adjust the assembly and cleaning processes to ensure risk to components and CCAs is minimized. If there are questions about component compatibility with cleaning processes, contractor shall confirm cleaning options with government.

3.1.4.3 The contractor shall have PCB cleaning capabilities. If the project needs additional cleaning capabilities, it is acceptable to sub-contract PCB/CCA Cleaning to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of PCB/CCA Cleaning activities.

3.1.5 CCA COATING REQUIREMENT: The contractor shall conformally coat requested quantities of CCAs in accordance with coating specifications and instructions provided in the Technical Data Package. Government coating requirements could include, but are not limited to: Silicon, Acrylic, Urethane, and Parylene coatings.

3.1.5.1 The contractor shall coat PCBAs in accordance with specified J-STD-001 and IPC-A-610 classification; if not specified in the provided TDP or Order, the contractor shall apply coating to meet IPC-A-610 Class 2 requirements. Coating materials shall meet MIL STD I-46058C, unless otherwise specified by the government.

3.1.5.2 The contractor shall clean and remove Foreign Object Debris (FOD) prior to executing conformal coating processes.

3.1.5.3 The contractor shall provide technical reports, as required, documenting coated CCA acceptability and/or results of Quality Control inspections performed in accordance with IPC-A-610 criteria or other standard quality verification methods. (A003)

3.1.5.4 If the contractor does not have and internal Conformal Coating process adequate to meet TDP specifications, it is acceptable to sub-contract CCA Coating to another vendor. Any sub-contractors identified shall be approved by

DMEA in advance of the initiation of conformal coating activities.

3.1.6 CABLE/HARNESS ASSEMBLY REQUIREMENT: The contractor shall assemble cables/harness on requested quantities in accordance with assembly specifications and instructions listed in the cable/harness documentation provided.

3.1.6.1 The contractor shall assemble cables/harnesses in accordance with specific IPC-A-610 and IPC-A-620 guidelines; if classification is not specified in the provided TDP, the contractor shall assemble cables/harnesses in to meet Class 2 guidelines.

3.1.6.2 The contractor shall use Government Furnished Equipment (GFE), and Government Furnished Material

(GFM) only as instructed on assembly documentation.

3.1.6.3 Alternate assembly procedures or use of equipment not specified in the assembly instructions shall be approved by DMEA prior to the initiation of assembly activities.

3.1.6.4 If the contractor does not have Harness/Cable Assembly capabilities, it is acceptable to sub-contract

Harness/Cable Assembly to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of assembly activities.

3.1.6.5 The contractor shall provide documentation demonstrating the assembly passes specified classification.

(A004)

3.1.7 MECHANICAL SUB-COMPONENT FABRICATION REQUIREMENT: The contractor shall assemble sub-component assemblies on requested microelectronics systems in accordance with specifications and instructions listed in the TDP.

3.1.7.1 The contractor shall review suitability of Government furnished materials (GFM) and components and request any additional information, materials, and/or components upon receipt of the GFM

3.1.7.2 If the contractor does not have internal Mechanical Fabrication capabilities, it is acceptable to sub-contract

Mechanical Fabrication to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of Mechanical Component fabrication/assembly activities.

3.1.7.3 The contractor shall provide technical reports and assembly documentation as required.

3.1.7.4 The contractor shall provide a full assembly report notating any defects and/or issues during assembly.

3.1.7.5 The contractor shall provide a full report for DFM ensuring that any mechanical part is designed for efficient manufacturability.

3.1.8 MICROELECTRONIC SYSTEM ASSEMBLY REQUIREMENT: The contractor shall assemble all

Microelectronic and Electro-Mechanical sub-components into the full Microelectronic Systems in accordance with specifications and instructions listed in the TDP.

3.1.8.1 The contractor shall review suitability of Government furnished materials (GFM) and components and request any additional information, materials, and/or components within 5 days of receipt of the GFM

3.1.8.2 The contractor shall provide technical and quality assurance reports, as well as assembly documentation, including procedures, instructions, and fixture/jig drawings as required. (A003)

3.1.8.3 If the contractor does not have internal Microelectronic System Assembly capabilities, it is acceptable to sub-contract Microelectronic System Assembly to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of Microelectronic System Assembly activities.

3.1.9 MICROELECTRONIC SYSTEM MAINTENANCE, REPAIR, REWORK, AND REFURBISHING

REQUIREMENT: The contractor shall repair, rework, or otherwise maintain and refurbish requested quantities of

Microelectronics Systems, PCBAs/CCAs, and/or Cables/Harnesses in accordance with the associated TDP and dispositioned Microelectronics system documentation.

3.1.9.1 The contractor shall repair/rework PCBAs in accordance with specified J-STD-001, IPC-7711/7721, and

IPC-A-610 classification; if IPC Classification is not specified in the provided TDP, the contractor shall repair/rework PCBAs to IPC Class 2 requirements.

3.1.9.2 The contractor shall provide technical and/or inspection reports, as required, documenting electrical continuity test results, and/or results of Quality Control inspections performed in accordance with IPC-A-610 acceptability requirement.

3.1.9.3 Unless otherwise specified in the TDP, the contractor shall use Tin-Lead (Sn-Pb) solder in all applicable repair/rework processes.

3.1.9.4 The contractor shall have in-house Microelectronics Repair/Rework capabilities. If the contractor needs additional Microelectronics repair/rework capabilities or bandwidth, it is acceptable to sub-contract repair and/or rework to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of repair/rework activities.

3.1.9.5 The contractor shall return all excess materials utilized in Microelectronics Repair/Rework processes to

DMEA after completion of repair/rework activities, including setup units and units that remain non-functional after attempted repair/rework. Setup and failed units shall be clearly marked and segregated from the working units.

3.1.10 MICROELECTRONICS SYSTEM PROGRAMMING AND ACCEPTANCE TESTING

REQUIREMENT: The contractor shall program the Microelectronic Systems and perform Acceptance Tests as specified within an Acceptance Test Plan (ATP) include with the TDP. Government Furnished Equipment (GFE) software/hardware may be provided by the government to facilitate system programming and Acceptance Testing.

3.1.10.1 The contractor shall use Government Furnished Equipment (GFE) and Government Furnished Information

(GFI) only as instructed to, in testing documentation, or by Project Engineer (PE) listed.

3.1.10.2 The contractor shall have in-house capabilities to perform Microelectronic System Programming and

Acceptance Testing. If the contractor needs additional testing capabilities or bandwidth, it is acceptable to sub-contract such activities to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of programming and acceptance testing activities.

3.1.10.3 The contractor shall provide technical reports and acceptance testing documentation as required. (A004)

3.1.10.4 Testing shall be performed by a qualified test technician and signed-off by Quality Assurance (QA).

3.1.10.5 Manufacturer or sub-contractor shall provide timely notifications when testing will be performed and

DMEA may elect to witness any, or all testing as desired.

3.1.10.4 The contractor shall return all excess material, GFE and GFI to DMEA, after completion of all testing.

3.1.11 MICROELECTRONICS SYSTEM ENVIRONMENTAL TESTING REQUIREMENT: The contractor shall perform Environmental Tests for development, qualification or stress screening purposes of the manufactured microelectronics system, as identified within the TDP. Environmental testing shall include, at a minimum, Shock, Vibration, and Thermal testing; other Environmental tests may be requested by the government as well.

3.1.11.1 The contractor shall use Government Furnished Equipment (GFE) and Government Furnished Information

(GFI) only as instructed to, in testing documentation, or by Project Engineer (PE) listed.

3.1.11.4 The Contractor shall design and manufacture any necessary mechanical fixtures required for Environmental testing (e.g., shock and vibration fixture).

3.1.11.5 If the contractor does not have required testing capabilities, it is acceptable to sub-contract such testing activities to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of environmental testing activities.

3.1.11.6 The contractor shall provide technical reports and testing documentation as required. (A004)

3.1.11.7 Testing shall be performed by a qualified test technician and signed-off by Quality Assurance (QA).

3.1.11.8 Manufacturer or sub-contractor shall provide timely notifications when testing will be performed and

DMEA may elect to witness any, or all testing as desired.

3.1.11.9 The contractor shall return all excess material, GFE and GFI to DMEA, after completion of all testing.

3.1.12 MICROELECTORNICS SYSTEM BURN-IN AND SCREENING REQUIREMENT: The contractor shall perform burn-in and screening processes as part of the overall manufacturing services for full electronic system integration in accordance with TDP. These processes shall apply to all electronic assemblies, CCA subassemblies, and microelectronic component identified as requiring burn-in and screening for reliability assurance and to ensure long term reliability and operational stability of the delivered system. The contractor shall comply with IPC, JEDEC and MIL-STD or equivalent industry standards, as identified within the TDP.

3.1.12.1 The contractor shall conduct burn-in and screening on all PCBs, assembled CCA’s, Microelectronic components, fully integrated electronic modules and sub-systems in accordance to MIL-STD-883, or as specified in the TDP.

3.1.12.2 The contractor shall provide system traceability ensuring that all burn-in and screening activities shall be traceable to part number, board number, revision, lot and serial numbers. The contractor shall deliver and maintain records of results, failures, and corrective actions included in a deliverable data package. (A004)

3.1.12.3 The contractor shall provide and maintain Burn In and Screening procedures, detailed test logs for each unit, and failure/rework records.

3.1.12.4 The contractor shall provide calibration and NIST standard traceability for all testing equipment used during systems integration testing.

3.1.12.5 If the contractor does not have internal Burn-In and Screening capabilities, it is acceptable to sub-contract

Burn-In and Screening tasks to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of Burn-In and Screening activities.

3.1.13 MICROELECTRONIC SYSTEM KITTING, PACKING, AND SHIPPING REQUIREMENT: The contractor shall design and provide method to safely and reliably kit, pack, and ship Microelectronic Systems and/or

System sub-components and enabling components via any method of transportation.

3.1.13.1 The shipping materials shall protect the Microelectronics systems from physical, moistures, and ESD damage during shipping.

3.1.13.2 The shipping solution could include any common shipping materials including cardboard, pallets, bubble wrap, cellophane, ESD bag, Anti-static materials, shipping peanuts, tape, Styrofoam, stickers, and any other typical materials not specifically listed.

3.1.13.3 The contractor shall design solutions for shipping single units, and/or bulk deliveries as requested by the government.

3.1.13.4 If the contractor does not have internal Kitting, Packing, and Shipping capabilities, it is acceptable to sub-contract to another vendor. Any sub-contractors identified shall be approved by DMEA in advance of the initiation of Kitting, Packing, and Shipping activities.

3.1.14 MICROELECTRONIC SYSTEM MANUFACTURABILITY AND ENGINEERING REVIEW

REQUIREMENT: The contractor shall ensure configuration control is maintained, and provide upon request, documentation and artifacts (e.g. specifications, plans, test reports, inspections, analysis) related to the physical and functional requirements of the microelectronics system, as well as contractor manufacturing readiness to produce the sought after system. (A004)

3.1.14.1 The contractor shall summarize the manufacturing and assembly processes and their quality control and manufacturing planning activities and provide Engineering reports to the government, per specific requests associated with contractor manufacturing activities; these reports could include, but are not limited to the following:

3.1.14.1.1 Parts Management Plan

3.1.14.1.2 Counterfeit Prevention Plan

3.1.14.1.3 Supply Chain Risk Management report

3.1.14.1.4 Diminishing Manufacturing Sources & Material Shortages report

3.1.14.1.5 Configuration Management Plan

3.1.14.1.6 System Engineering Management Plan

3.1.14.1.7 Manufacturing Readiness Level Report

3.1.14.1.8 Quality Assurance plan

3.1.14.2 The contractor shall collaborate with the government, including attending technical interchange and manufacturing status meetings, to review and communicate government documentation formats and other requirements. Reference materials, standards, and requirements will be provided in the Microelectronics System

TDP.

4.0 DATA ITEMS: The following CDRLs will likely apply to resultant orders and shall be submitted as described below. Provided for context. Indicate on the cover of all delivered data the IDIQ number, IDIQ order number, SOW number, SOW title, and the current DMEA Project Engineer name and office symbol.

1. Sequence Number A001

2. Title Technical Report - PCB Electrical Tests

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S.

Government Agencies only. Other requests shall be referred to

DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

15. Total See Distribution List

16. Remarks Contractor format is acceptable.

Block 9: Mark all CDRL items with the distribution statement as shown above in Block 9 and with the following additional statement:

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do not apply to those items identified as technical data or computer software to be furnished with restrictions.

1. Sequence Number A002

2. Title Technical Report – Impedance Test

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S. Government

Agencies only. Other requests shall be referred to DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do

1. Sequence Number A003

2. Title Technical Report – Fabrication and Assembly Inspections

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference Para 3.4

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD

8. App Code N/A

9. Distribution Statement Req’d Distribution Statement B: Distribution authorized to U.S.

Government Agencies only. Other requests shall be referred to

DMEA

10. Frequency ONE TIME

11. As of N/A

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do

1. Sequence Number A004

2. Title Technical Report - Study/Services

3. Subtitle Final Report

4. Authority DI-MISC-80508B

5. Contract Reference

6. Requiring Office DMEA/MEAB

7. DD 250 Req. DD (LT?)

8. App Code N/A

9. Distribution Statement Req’d DISTRIBUTION STATEMENT D. Distribution authorized to the

Department of Defense and U.S. DoD contractors only Administrative or Operational Use 06/05/2025. Other requests for this document shall be referred to the Defense MicroElectronics Activity (DMEA).

10. Frequency ONE TIME

11. As of Completion of all Audits and Deliverables

12. Date of First Submission 10 days prior to the end of the period of performance indicated in the delivery order

13. Date of Subsequent Submission N/A

14. Distribution See Distribution List

"The U.S. Government retains unlimited data/computer software rights to this item." If DMEA #A16-001, paragraphs (o) and

(p) are included in the delivery order, these additional statements do