24-4F6 PWS KLA P-7.pdf

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KLA P-7 Stylus Profilometer
Solicitation number
HQ072724QNR02
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This document is a Performance Work Statement (PWS) for the procurement of a KLA P-7 Stylus Profilometer. The purpose of this tool is to provide topographical metrology capabilities to measure and analyze features such as trenches, vias, surface roughness, wafer shape, and film stress.

The key requirements include providing a turnkey COTS product capable of measuring 50mm to 150mm wafers, having an automated motorized stage, wafer bow/stress measurement, continuous 150mm wafer scans, 3D and contour analysis software, pattern recognition, and compatibility with an ISO class 5 cleanroom environment. The vendor is to provide full system installation, user manuals, training, a 1-year warranty, and certification that only genuine parts are used. Travel for a field service engineer to perform onsite checks and training is included. The related federal contract opportunity is a solicitation issued by the Defense Microelectronics Activity for the procurement of this KLA P-7 Stylus Profilometer.

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Combined Synopsis and Solicitation HQ072724QNR02.pdf PDF
JA PWS 24-4F6 - Redacted.pdf PDF

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Performance Work Statement (PWS)

DMEA 24-4F6

16 April 2024

Project Engineer: Benjamin Contract Officer Representative:

1.0 SCOPE:

1.1 TITLE: KLA P-7 Stylus Profilometer

1.2 PURPOSE: Purchase of KLA P-7 Stylus Profilometer for topographical metrology capability to allow the foundry to measure and analyze features such as trenches and vias as well as other characteristics such as surface roughness, wafer shape, and film stress.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES:

2.1 GOVERNMENT DOCUMENTS:

Document No. Date Title eB 100714 ARMS Cleanroom Protocol

2.2 GOVERNMENT FURNISHED EQUIPMENT:

None.

2.3 GOVERNMENT FURNISHED FACILITIES/ACCESS:

Facility/Access Date DMEA 4234 54th Street, McClellan, CA 95652-2100 Upon installation

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

a. Include all items (e.g. hardware, software, and other documentations) as listed in the tool purchase package.

b. Provide User Manuals (softcopy and/or hardcopy).

c. Provide full system installation including connection to system facilities.

d. Correct or fix any hardware or software problems encountered during initial installation and testing.

e. Be operational and functional in accordance to tool vendor specifications.

f. Provide DMEA with User Licenses and License Agreement.

g. Provide DMEA personnel with training (including but not limited to operational, routine maintenance, upkeep, and other pertinent functions) to effectively use the tool.

h. Provide DMEA with 1 year tool warranty and support clause.

i. The tool shall not be a refurbished, remanufactured, or used unit.

j. If tool is not from an OEM source, contractor shall have the OEM certify the tool stating that it meets their quality and operational standards.

k. The contractor shall verify that only genuine hardware and software shall be provided with no non-OEM or counterfeit items substituted. A written guarantee and corresponding paperwork shall be provided to DMEA at contract award. The contractor shall provide full service support, upgrades, replacement guarantees, a valid software license and full warranty.

l. Include all items as listed in Appendix A of the PWS.

3.2 PROGRAM MANAGEMENT: None

3.3 TASK REQUIREMENTS: DMEA is tasked with installation of tool but vendor will perform checks to guarantee tool is operational, according to vendor specs, and also provide tool training. Travel for Field Service Engineer to perform tool checks post installation and tool training is included in quote.

3.3.1 Travel: The vendor will travel to DMEA to perform testing of the tool onsite. The vendor performing the testing onsite shall provide proof of US citizenship. The vendor is required to check in with DMEA Security to obtain appropriate badge upon arrival.

3.4 TOOL REQUIREMENT: The tool shall be a turn-key COTS product capable of measuring topographical and surface features and characteristics on silicon carbide and silicon but may be capable of processing additional materials as well. The tool shall be able to process 50mm - 150mm wafer sizes.

a. The tool shall have an automated motorized stage capable of holding standard semiconductor wafer sizes of 50mm – 150mm on a vacuum chuck without needing to change the chuck to accommodate different sizes.

b. The tool shall be capable of holding a 150mm wafer in a relaxed state and perform wafer bow and stress measurements.

c. The tool shall be able to perform a full wafer diameter (150mm) scan length in a continuous pass without interruption or requiring data stitching or other combination methods.

d. The tool shall have a scan flatness of <200nm over a 130mm range.

e. The tool shall have a measurement range from 0 to at least 300um with a vertical resolution of < 1A and a step height repeatability of ≤4A when measuring on a step height standard of about 1um.

f. The tool shall have a stylus force capability ranging from <1 mg to >25mg.

g. The tool shall have a scan speed of at least 20mm/s with a data acquisition rate of >1500 Hz.

h. The tool shall have analysis software capable of 3D analysis of the collected scan data.

i. The tool shall have analysis software capable of performing contour analysis of the collected data.

j. The tool shall have analysis software capable of exporting data into non-proprietary formats.

k. The tool shall have a top-down view camera with calibration capability such that the view accurately shows where the measurement is being performed.

l. The tool shall include relevant NIST traceable calibration standards to ensure tool performs according to specifications.

m. The tool shall have pattern recognition software capability to allow automated measurements of programmed locations with minimal user intervention.

n. The tool shall be capable of performing automated measurements of at least 50 different sites within a single sequence/recipe.

o. The tool shall be capable of being retrofitted or upgraded to handle KLARF files.

p. The main tool unit (i.e. excluding PC, monitor, input devices) shall be tabletop installable not to exceed 30” by 30”.

q. The tool shall be compatible with installing and operating in an ISO class 5 or better cleanroom environment.

3.5 PROGRAM SUMMARY: None

4.0 POINTS OF CONTACT:

DMEA/ MEBA/ PE:

Address:

Voice:

E-Mail:

DMEA/ MEBA/ COR:

Address:

Voice:

E-Mail:

APPENDIX A – Required Item Options

Item Description Qty. Unit 1 Motorized Theta with 3D and 3D Stress

2 Apex 3D Adv w Profiler 3D

3 Microhead 5 SR, P-7 1

4 Motorized Theta, P-7 1

5 Universal Chuck 150 mm (motor) 1

6 Top View Optics, P-7 1

7 2D/3D Stress Analysis Software 1

8 Univ/Solar Stress Chuck Kit 1

9 Enable 3D Stress on Apex 3D B 1

10 Productivity Pkg w/Pat Rec,W10 1

11 Contour Analysis 1

12 8.0 μm VLSI NIST SHS, Si/Qtz 1

13 50.0 μm VLSI NIST SHS, Si/Qtz 1

14 940 nm VLSI NIST SHS, Si/Qtz 1

15 Stylus 2um Rad, 20 deg 1

16 Stylus 2um Rad, 45 deg 1

17 Installation & Training 1

18 1 Year Basic Warranty 1

19 DDU Freight 1

20 No Air Table (DMEA Will Provide) 0

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