218669-DD-10 Sputter System Request for Information.docx

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Sputter System
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218669-DD-10
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dd10-10170201supp12 foa final 5.14.12.doc May 14, 2012 —
dd10-1015e final 02.23.10.doc Feb 23, 2010 —
dd10-001 amend i 02.22.10.doc Feb 22, 2010 —
RFP - 218669-DD-10 - Sputter.doc Revision not stated Sputter System
cdc-rfa-dd-10-1006 amended final 06 24 10.doc Revision not stated —
cdc-rfa-dd-10-1005 amended final 06 24 10.doc Revision not stated —
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cdc-rfa-dd10-1010 new final 4 30 10.doc Revision not stated —
cdc-rfa-dd10-1014 revised final 04 7 10.doc Revision not stated —
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RFP - 218669-DD-10 - Sputter.doc DOC document
COMMERCIALSupply Exhibit C 3-23-10.doc DOC document

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218669-DD-10 Sputter System Request for Information (RFI) 17 Aug 10

Question: Is the application for production or R&D?

Answer: This system will be used for R&D.

Question: Is this for a single substrate or multiple substrates?

Answer: Multiple substrates.

Question: What size and shape is/are the substrate?

Answer: As small as a ¾” X 1” oval to a diameter of about 6”.

Question: Is there any uniformity specification?

Answer: With the size of the substrate with respect to the size of the target, there will not be a concern with uniformity. We will have the substrates mostly towards the center of the target.

Question: How thick of a film is to be deposited of the various materials?

Answer: The thinness films would be approximately 50Å on some substrates and up to a thickness of about 2µm on other substrates

Question: Is there a need for substrate heating? If so, to what temperature?

Answer: Yes we would like to have the option of substrate heating up to about 100˚C

Question: Is there a need for substrate cooling? If so, to what temperature?

Answer: No, we do not require substrate cooling.

Question: Is there a need for substrate rotation?

Answer: No, we do not require substrate rotation.

Question: Can the loadlock be separately pumped with a turbopump instead of a cryo?

Answer: Yes, the loadlock can be pumped with a turbo pump as long as the backing pump is a dry pump.

Question: Do you require a manually operated transfer arm for the substrate?

Answer: No, we do not require a transfer arm

Question: What gas(es) is/are are required for the sputtering process?

Answer: Our current processes only require argon as our process gas. However we do require CDA for the pneumatics and nitrogen for vent and purge gas

Question: Is there an ultimate pressure requirement?

Answer: The ultimate pressure would be 2.0 X10-7 Torr

Question: What is the reason for the very high powered power supplies?

Answer: We are looking into other materials that may require higher current for sputtering.

Question: The request asks for two 10Kw DC power supplies. We would like to offer the system with the standard one supply switching sequential setup.

Answer: Yes…one standard supply switching sequential setup is acceptable.

Question: The request also asks for a 10.6 cfm dry scroll pump; this is too small for this size system. (We will) offer a proper sized dry pump as an alternative.

Answer: Yes, please submit alternated in the quote.

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