21-1F4_MSI_RevEng_PWS 15Apr2021_Redacted.pdf

UNCLASSIFIED//FOR OFFICIAL USE ONLY

PERFORMANCE WORK STATEMENT (PWS)

DMEA 21-1F4

15 April 2021

Project Engineer/Contracting Officer Representative:

1.0 SCOPE:

1.1 TITLE: Printed Circuit Board Destructive Reverse Engineering through MSI. (MSI RevEng)

1.2 APPLICABILITY: Printed Circuit Board (PCB) and mounted semiconductor parts analysis and activities for the Semiconductor Assurance and Engineering Branch (MEBE).

1.3 BACKGROUND:

perform the destructive reverse engineering and schematic generation with accompanying Pix2Net data files, Bill of Materials, and Schematic drawings of highly complex PCBs. The contractor performing this work must be ITAR registered and must not use sub-contractors because of the security and time constraints.

1.4 PURPOSE: The purpose of this task is to reverse engineer PCBs, providing netlists of all board routing, complete circuit schematics, and complete bills of materials for each PCB.

NOTE: The information described within paragraphs 1.0 through 1.4 above is given for information only and has no contractual effect.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES:

2.1 GOVERNMENT DOCUMENTS:

Document No. Date Title 1 01-April 2021 PCB4 Assembly Diagram 2 01-April 2021 PCB5 Assembly Diagram 3 01-April 2021 PCB6 Assembly Diagram

2.2 OTHER DOCUMENTS:

Document No. Date Title 1 05-Dec-2014 Pix2Net Operating Manual for release 1.08.0 or greater 2 08-Mar-2021 Altium Designer Documentation 20.0 - Interfacing to other Design

Tools

2.3 GOVERNMENT FURNISHED EQUIPMENT/MATERIAL (GFE/GFM): The following table lists the hardware to be provided to contractor MicroNet Solutions, Inc. (MSI) for destructive RE. The government shall provide one (1) PCB of each type to the contractor at the start of the effort for destructive reverse engineering. The boards shall be consumed at the completion of the effort and will not be returned.

Hardware No. Hardware Nomenclature Priority

Board Available as of

1 PCB 4 1 01-April 2021 2 PCB 5 2 01-April 2021 3 PCB 6 3 01-April 2021

2.4 GOVERNMENT FURNISHED INFORMATION: At the start of the effort, coincident with the shipping of the PCB hardware to the contractor, DMEA shall provide Assembly Diagrams in PDF format containing FIND numbers for each part on the three boards. The provided nomenclature shall be used by the contractor to construct their own documentation.

Nomenclature Date Date Available PCB4 Assembly Diagram 01-April 2021 01-April 2021 PCB5 Assembly Diagram 01-April 2021 01-April 2021 PCB6 Assembly Diagram 01-April 2021 01-April 2021

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS: the contractor MicroNet Solutions, Inc. (MSI) shall provide services subject to review by DMEA described within section 3.1, based upon the required specifications provided by DMEA through individual call orders. The contractor shall complete the work for each board and make delivery of the data package to DMEA before starting the next board.

3.1.1 TRAVEL: No travel is authorized for the execution of the requirements of this contract by the contractor.

3.1.2 NOTIFICATION OF RIGHTS: The contractor shall identify and receive written government approval from the Administrative Contracting Officer (ACO) prior to committing to the use of any privately developed items, components, processes, computer software, and/or technical data relating to this effort which they:

(i) intend to deliver with Limited Rights

(ii) intend to deliver with Government Purpose Rights

(iii) intend to deliver with Restricted Rights

(iv) have not yet determined if such rights should apply.

3.1.3 DISPOSITION OF MATERIAL: All material shall be consumed in the destructive reverse engineering process. No physical material or board hardware shall be returned as GFM to the government.

3.1.4 SECURITY: All data acquired under this effort is to be treated as proprietary, and is not to be disseminated to any entity without prior written authorization from DMEA.

3.1.5 US BASED AND OWNED: The contractor shall be United States (US) based and US owned and shall provide evidence of being a US based service provider without foreign ownership, and shall not subcontract any of the work.

3.1.6 ITAR: The contractor shall be International Traffic in Arms Regulations (ITAR) registered with the United States Department of State.

3.2 PROGRAM MANAGEMENT: None

3.2.1 TECHNICAL INTERCHANGE MEETINGS (TIMs): The contractor (MSI) may conduct technical interchange meetings (TIMs) with the government as they deem necessary in the performance of this task. The content of the meeting can include the discussion of any information that has impact upon the task activities, including documentation contents or format.

3.3 TASK REQUIREMENTS: the contractor MicroNet Solutions, Inc. (MSI) shall provide RE services to DMEA, based upon the required specifications provided below.

3.3.1 NETLIST GENERATION: The contractor (MSI) shall provide a complete netlist representing all metal traces, routing, vias, solder pads, and through holes for each PCB furnished by the government to the contractor, subject to review by DMEA. The contractor shall deliver netlists that are compatible with Altium Designer 20.0 software versions and above and Pix2Net in a period of time not to exceed six (6) weeks from the date of receipt of the first GFE PCB, and six (6) weeks thereafter upon receipt of each subsequent GFE PCB. The contractor shall deliver netlists to DMEA through DoD SAFE (Secure Access File Exchange) or a contractor proposed format agreed upon by DMEA. All soldered electrical components in the netlist shall be correlated with a location on a digital map or image of the associated PCB. (A001).

3.3.2 SCHEMATIC GENERATION: The contractor (MSI) shall provide a complete circuit schematic representing all electronic connections, nets, netlists, and electronic devices soldered to the boards for each PCB furnished by the government to the contractor, subject to review by DMEA. The contractor shall deliver schematics in a period of time not to exceed six (6) weeks from the date of receipt of the first GFE PCB, and six (6) weeks thereafter upon receipt of each subsequent GFE PCB. Schematics delivered to DMEA shall be compatible with Pix2Net software and Altium Designer 20.0 software versions and above. The contractor shall deliver schematics to DMEA through DoD SAFE (Secure Access File Exchange) or a contractor proposed format agreed upon by DMEA. All components in the schematic shall be correlated with a location on a digital map or image of the associated PCB. (A002).

3.3.3 BILL OF MATERIALS (BOM): The contractor (MSI) shall provide a complete BOM for all microelectronics devices soldered to each of the PCBs furnished by the government to the contractor consistent with the nomenclature in the GFI, subject to review by DMEA in a period of time not to exceed six (6) weeks from the date of receipt of the first GFE PCB, and six (6) weeks thereafter upon receipt of each subsequent GFE PCB. The BOM shall include the quantity, measured values (e.g. resistance, capacitance, inductance values etc.), type of components (e.g. active or passive: e.g. resistor, capacitor, inductor, diode, operational amplifier, etc.), top marking as read on each component, manufacturer (if able to identify), part number (if able to identify), case size and type, notes or remarks for each part. The contractor shall deliver the BOM in Microsoft Excel format to DMEA through DoD SAFE (Secure Access File Exchange) or a contractor proposed format agreed upon by DMEA. The contractor shall correlate all electronic components in the BOM to a physical location on a searchable digital map, image, or PDF of the associated PCBs, and all components shall be readily searched for in a manner that allows the exact location of each component to be found. If the contractor cannot create readily searchable digital maps for DMEA using Pix2Net software, then the contractor shall provide a searchable PDF with unique identifying numbers overlaid on electronic components on a high-resolution image of the PCBs populated with all electronic components. (A003).

3.4 FINAL REPORT: The contractor (MSI) shall submit a report at the conclusion of the effort noting any findings and anomalies experienced during the engineering process. This report shall include tabulated labor hours and costs on a per-service-category (and subcategory, if applicable) basis, and a compilation of all purchase orders received and invoices delivered. The contractor shall deliver to DMEA all Pix2Net files and Pix2Net digital content (e.g.

including but not limited to all board layers, images, routing information, 3D CAD data, netlists, schematics, circuit diagrams, parts numbers, etc.) related to the reverse engineering of the PCBs furnished by DMEA. The contractor shall deliver the final report to DMEA through DoD SAFE (Secure Access File Exchange) (A004).

4.0 DATA ITEMS: See attached DD1423.

4.1 DISTRIBUTION LIST: The contractor shall deliver electronic copies via DoD SAFE (Secure Access File Exchange) to the address indicated. The subject block shall contain the contract number, delivery order number, PWS number, CDRL title, and date.

Code Copies (regular/reproducible/electronic) Address DMEA/MEBE All deliverables: 0/0/1

DMEA/MEBE

Attn:

Project Engineer 4234 54th Street McClellan, CA 95652-2100

5.0 ENGINEERING TECHNICAL POINTS OF CONTACT:

TPOC/COR:

Address: 4234 54th Street McClellan, CA 95652-2100