Project Grant DESC0024026

This award from the National Science Foundation (NSF) Division of Electrical, Communications and Cyber Systems under the Engineering CFDA program provides $1,499,996 to the University of Wisconsin System to conduct research on developing ultra-efficient, high-voltage monolithic bidirectional transistors (MBDTs) for use in power electronics applications. The key objectives are to: 1) demonstrate the first ultra-wide bandgap (UWBG) based MBDTs; 2) enhance the performance and manufacturability of...

This Project Grant awarded by the National Science Foundation (CFDA 47.041 - Engineering) to Lehigh University for $182,265 will investigate a novel high-current conversion technology to support various distributed energy resource (DER) applications. The project aims to develop a modular multiphase interleaved high current conversion system using wide bandgap semiconductor devices. Key innovations include resonant circuit topologies, integrated magnetic coupling, and advanced modeling and...

The National Science Foundation awarded Ai Linear Inc. a $252,830 Project Grant under the NSF Technology, Innovation, and Partnership's program to develop a smart amplifier integrated circuit. The circuit will intelligently alter its performance parameters in response to input conditions, enabling always-on, ultra-low power Internet of Things and smart sensor applications situated at the edge. Specifically, the company will design an IC amplifier using a novel circuit that adjusts speed,...

The Advanced Research Projects Agency-Energy (ARPA-E), a program under the Department of Energy, has awarded a $500,000 Project Grant to the Board of Regents of the University of Nebraska (University of Nebraska) under CFDA Program 81.135. The grant funding will support the University of Nebraska's development of a first-of-its-kind 10 kV high-frequency press-pack (HFPP) silicon carbide MOSFET module, referred to as "METAPAK." This module is intended to enable novel high-frequency HVDC...

This five-year $500,000 Project Grant from the National Science Foundation's Engineering program (CFDA 47.041) funds research at the University of California, San Diego to develop next-generation integrated hybrid DC-DC converters. The university will conduct engineering research from February 2021 through January 2026 to foster innovation in converter design for future power systems relying more heavily on direct current transmission. As the NSF Engineering program seeks to improve quality of...

This National Science Foundation (NSF) Engineering (CFDA 47.041) grant award in the amount of $1,103,042 to Virginia Polytechnic Institute & State University (Virginia Tech) aims to address fundamental knowledge gaps for realizing 48V vertical power delivery by heterogeneously integrating wide-bandgap microelectronics and power electronics. The goal is to enable more efficient power delivery to AI processors in data centers, which currently suffer from significant resistive losses. Key...

This National Science Foundation (NSF) Division of Electrical, Communications and Cyber Systems Project Grant, titled "ASCENT: ULTRA-COMPACT PV MICROINVERTERS WITH INTEGRATED ACTIVE POWER DECOUPLING", will provide $1,500,000 in funding from September 1, 2023 to August 31, 2027. The project aims to develop transformative solar micro-inverters enabled by innovative circuit topologies, control techniques, sensors, and electro-thermal co-design. Key innovations include single-stage...

This National Science Foundation (NSF) Integrative Activities (CFDA# 47.083) Project Grant award provides $300,000 to the University of Arkansas to enhance the power density and operating temperature range of traction inverters for electric vehicles (EVs) through the use of gallium oxide-based power modules. The key objectives are to: 1) innovate power module packaging techniques to optimize thermal resistances, minimize parasitic inductances, and enhance high-temperature operation; 2) explore...

This federal Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) provides $612,712 to The Leland Stanford Junior University to develop fundamental technologies for high-density 3D integrated circuits. The key objectives are to integrate atomically thin materials like carbon nanotubes and MoS2 into stacked 3D circuit layers, advancing materials science and reliability for 3D integration. This research aims to enable 3D integrated circuits that are over 50x...

This Project Grant award from the National Science Foundation (NSF) Integrative Activities program (CFDA 47.083) provides $299,938 to the Regents of the University of Idaho, doing business as the University of Idaho, to support research on the integration and packaging of wide bandgap semiconductor chips and sensors for extreme high-temperature (up to 600°C) applications. The key objectives of this 2-year project are to investigate the integration of silicon carbide (SiC), gallium nitride (GaN),...