Project Grant DESC0020893

The National Science Foundation (NSF) Directorate for Engineering awarded a two-year, $250,000 EAGER grant to the University of California, Santa Barbara (UCSB) to explore the development of gate-all-around (GAA) field-effect transistors (FETs) using two-dimensional transition metal dichalcogenide (2D-TMD) materials. The project aims to advance the scalability and performance of complementary metal-oxide-semiconductor (CMOS) transistors by leveraging the unique properties of 2D-TMDs compared...

This $300,000 federal Project Grant was awarded by the National Science Foundation's (NSF) Engineering program (CFDA 47.041) to Carnegie Mellon University (CMU). The grant aims to experimentally demonstrate wafer-scale 2D transistors in the "silicon-impossible" territory (sub-5-nm channel length) and investigate their fundamental limits through a combination of experimental and theoretical efforts. Key objectives include: (1) developing a high-throughput, scalable technique for...

This Project Grant award from the National Science Foundation's (NSF) Engineering program (CFDA 47.041) supports fundamental research to develop scalable nanomanufacturing techniques for precisely manufacturing aligned arrays of carbon nanotubes. The University of Wisconsin-Madison received $699,253 to conduct this research from August 1, 2024 to July 31, 2027. The goal is to develop scientific understanding and scalable processes for creating carbon nanotube arrays with precise alignment,...

This Project Grant from the National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation supports research to advance manufacturing processes for semiconductor electronic and quantum devices at the atomic scale. Funded for $292,392 over two years from January 1, 2023 through December 31, 2024, the award supports the University of Maryland, College Park under the NSF Engineering program (CFDA 47.041). The research aims to develop robust manufacturing techniques with...

The National Science Foundation awarded a $299,999 Project Grant to the California Institute of Technology from the Engineering program (CFDA 47.041) to support research in atomic-layer etching manufacturing processes for high-performance superconducting quantum devices. This two-year award will fund the development of atomic layer etching techniques to precisely engineer the surfaces of dielectric and metallic films used in superconducting quantum circuits. By enabling manufacturing with atomic...

The National Science Foundation (NSF) Division of Electrical, Communications and Cyber Systems awarded a $385,000 Project Grant to Northwestern University to develop cross-layer techniques from device to circuit and architecture for the large-scale integration of ferroelectric field effect transistors (FeFET) with complementary metal-oxide-semiconductor (CMOS) technology. This research aims to enable emerging computing applications, such as AI, robotics, augmented/virtual reality, and autonomous...

This $275,000 National Science Foundation (NSF) Project Grant, awarded under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program, funds the development and validation of materials and processes for advanced semiconductor manufacturing at Geminatio, a for-profit organization. The goal is to enable the progression of Moore's Law and strengthen domestic semiconductor manufacturing capacity and capability, which has been impacted by recent supply chain issues. The project seeks to...

This $274,995 Project Grant, awarded by the National Science Foundation (NSF) under the Technology, Innovation, and Partnerships (CFDA 47.084) program, aims to develop improved semiconductor nanoprobes for advanced microelectronics applications. The project, led by Tiptek, LLC, a small for-profit limited liability company, focuses on enhancing a critical technology called nanoprobing used to diagnose and analyze electrical faults in state-of-the-art computer chips. The improved nanoprobes will...

This federal Project Grant award of $612,712 from the National Science Foundation's Engineering program (CFDA 47.041) will support research to develop fundamental steps for three-dimensional (3D) integrated circuits using atomically thin materials. The project, titled "FUSE2 TOPIC 2: HETEROGENEOUS 3D INTEGRATION OF ENERGY-EFFICIENT ELECTRONICS (H3E3) WITH LOW-DIMENSIONAL DEVICE LAYERS", will integrate materials like carbon nanotubes and MoS2 into individual circuit layers that will...

This Cooperative Agreement, awarded by the National Institute of Standards and Technology (NIST) under the CHIPS Research and Development (CFDA 11.042) program, provides $257,367.33 in funding to Vapor Cell Technologies LLC to construct novel displacement measurement tools for semiconductor fabrication equipment. The goal is to enable more precise, accurate, and repeatable production of semiconductor chips, thereby minimizing the gap between physical and digital processes in semiconductor...