High thermal conductivity, multi-layer, ALN-based PCB enabling component embedding and rapid prototyping

Ended Project Grant Awarded Last action

Award ID
DESC0020758
Recipient
Awarding agency
Obligated
$1,299,440

Award facts

Assistance listing
81.049 Office of Science Financial Assistance Program
Completion date
Originally
Place of performance
San Jose, CA 95134, USA

Award details come from USAspending.gov.

Transactions

Action Obligated Date
Amendment $0
Amendment $0
Amendment High thermal conductivity, multi-layer, ALN-based PCB enabling rapid prototyping with embedded printed components $1,099,833
Original award $199,607

Quick answers

Who received award DESC0020758?

DESC0020758 was awarded to Kuprion, Inc. by Office of Science (Department of Energy) on June 29, 2020.

How much is award DESC0020758 worth?

$1,299,440 has been obligated on DESC0020758.

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