The research aims to support the advancement of hybrid 3D additive manufacturing (am) science by combining multiscale processing of highly conductive and high dielectric constant printable INK…

The University of Maryland, College Park received a $300,000 Cooperative Agreement awarded on August 15, 2025, by the Research Development and Engineering Command (a Department of Defense agency) under the Basic Scientific Research program (CFDA 12.431). The award supports research aimed at advancing hybrid three-dimensional additive manufacturing science through the integration of multiscale processing techniques for highly conductive and high dielectric constant printable ink materials. The research will focus on hybrid interfacial adhesion mechanisms and non-destructive evaluation methodologies for printed electronics designed to perform in extreme dynamic environments.

The five-year performance period, extending through August 14, 2030, will be conducted at the University of Maryland's College Park, Maryland campus through the Office of Research Administration & Advancement. As part of the Department of the Army's Basic Scientific Research program, which prioritizes high-risk, high-payoff investigations to advance long-term national security objectives, this cooperative agreement represents a fundamental research investment in advanced materials and manufacturing technologies with potential applications to strategic defense capabilities.

The research aims to support the advancement of hybrid 3D additive manufacturing (am) science by combining multiscale processing of highly conductive and high dielectric constant printable INK materials with hybrid interfacial adhesion and non-destructive evaluation of printed electronics for extreme dynamic environments.