Title: 5G/6G mmwave materials and electrical test technology roadmap (5G/6G maestro) purpose: the project will develop a roadmap for advancing the leading edge 5G and 6G products to accelerate the…
Ended Cooperative Agreement Awarded Last action
- Award ID
- 70NANB22H050
- Recipient
-
International Electronics Manufacturing Initiative, Inc. UEI QPLLHMN6CX99
- Awarding agency
-
National Institute of Standards and Technology
Department of Commerce
- Obligated
- $289,690
Award facts
- Assistance listing
- 11.619 Arrangements for Interdisciplinary Research Infrastructure
- Completion date
- Originally
- Place of performance
- Morrisville, NC, USA
Award details come from USAspending.gov.
Description
- Activities
- The project team will develop three work packages: a survey-based technology and market needs assessment, a technical roadmap, and an implementation strategy for a proposed radiofrequency cluster to support the domestic semiconductor industry sector. These products will be disseminated through public webinars, technical papers, conference presentations and post-award through curricula developed for community colleges and universities.
- Expected outcomes
- The published roadmap will consolidate a world-leading knowledge base for the U.S. To accelerate development of high-performance 5G and 6G wireless networks and will nucleate an anticipated consortium for developing a manufacturing USA institute.
- Intended beneficiaries
- The intended beneficiaries of project outcomes will be the domestic microelectronics and telecommunications industries, as well as the academic research community and federal laboratories supporting the innovation value chain for next generation communication technologies.
- Subrecipient activities
- The recipient plans to subaward funds to perform analysis & recommendation of radio frequency (RF) test cluster, system design analysis of mobile and network products to provide key material and test recommendations, characterization of next generation materials, high frequency (THZ) measurement methods. Wafer level analysis, and to support guidelines for the development for systemic characterization of new materials (glass, ceramic, organic, flex) as a function of environmental and design criteria, and market analysis and report.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Amendment | -$1,175 | |
| Amendment | $0 | |
| Original award | $290,865 |
Quick answers
Who received award 70NANB22H050?
70NANB22H050 was awarded to International Electronics Manufacturing Initiative, Inc. by National Institute of Standards and Technology (Department of Commerce) on May 1, 2022.
How much is award 70NANB22H050 worth?
$289,690 has been obligated on 70NANB22H050.
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