Title: microelectronic and advanced packaging technology (mapt) roadmap development purpose statement: the project will accelerate U.S. Leadership in semiconductors by roadmapping needs across the…

This cooperative agreement award from the Department of Commerce National Institute of Standards and Technology will support the development of a microelectronic and advanced packaging technology roadmap. The $300,000 award made to Semiconductor Research Corporation on April 1, 2022 is part of the Arrangements for Interdisciplinary Research Infrastructure federal grant program.

Under the award, the recipient will convene a consortium of stakeholders across the semiconductor advanced packaging supply chain. Working groups will identify emerging applications at the convergence of semiconductors and microelectronics. They will develop a clear and actionable roadmap to guide $300k in technology and workforce investments supporting U.S. competitiveness in this sector. Deliverables include a published roadmap and in-person conference by September 2023. The recipient plans to subaward funds for targeted technology assessments and meeting support to further the program's goals.

Activities

The project team will form a consortium to identify emerging applications at the convergence of semiconductors and microelectronics and associated advanced packaging technology needs. The proposers will create a roadmap executive committee to coordinate the activities of application working groups and technical working groups who will develop the content for the roadmap through primarily virtual conferencing. The consortium will hold an in-person 1.5-day conference at the end of the first year of activities to ensure the broader stakeholder community will have sufficient input into the final published roadmap.

Expected outcomes

The project deliverable will be a clear, actionable and widely disseminated roadmap to guide technology and workforce development investments in semiconductor advanced packaging to support U.S. Competitiveness. The proposers anticipate that the consortium convened will foster partnerships across a diversity of organizations and geographies that will stimulate the growth of the U.S. Advanced packaging ecosystem across the supply chain.

Intended beneficiaries

Intended beneficiaries of the project outcomes are the domestic stakeholders in the semiconductor advanced packaging and microelectronics industry sectors.

Subrecipient activities

The recipient plans to subaward funds to support the contracts for targeted technology assessments and meeting support.