Title: a manufacturing roadmap for heterogeneous integration and electronics packaging (mrhiep) purpose statement: the project will bring together leaders in the microelectronic supply chain to…

Ended Cooperative Agreement Awarded Last action

Award ID
70NANB22H038
Recipient
Awarding agency
Obligated
$299,879

Award facts

Completion date
Originally
Place of performance
Los Angeles, CA 90095, USA

Award details come from USAspending.gov.

Description

Activities
The project team will use a kick-off workshop to form technology working groups which will then develop roadmap content. The roadmap will include recommendations for manufacturing development infrastructure, pathways for manufacturing standards, workforce development and sustainability, manufacturing sustainability, and equitable manufacturing infrastructure. The roadmap will be disseminated through conference presentations.
Expected outcomes
The proposal will build on the existing heterogeneous integration roadmap to produce an actionable manufacturing blueprint for scaling these advanced packaging technologies and the developing the workforce needed for U.S. Production.
Intended beneficiaries
The project outcomes will benefit the organizations in the value chain for semiconductor manufacturing, including academic researchers, small and large domestic industry members, and federal agencies seeking to develop these capabilities.
Subrecipient activities
The recipient plans to subaward funds to support development of recommendations for manufacturing development infrastructure; identify pathways for publication of relevant manufacturing standards; develop recommendations for workforce development including identifying necessary curricula, training, and development areas; and provide recommendations for environment, health, and safety and sustainability assessments of prioritized technologies.

Transactions

Action Obligated Date
Amendment -$121
Amendment $0
Amendment $0
Original award $300,000

Subawards

Subrecipient Amount Awarded
Semi Together with UCLA, SEMI is submitting a proposal to the NIST Manufacturing USA Technology Roadmap (MfgTech) Grant Program for the purposes of furthering the… $93,000

Quick answers

Who received award 70NANB22H038?

70NANB22H038 was awarded to University Of California, LOS Angeles by National Institute of Standards and Technology (Department of Commerce) on April 1, 2022.

How much is award 70NANB22H038 worth?

$299,879 has been obligated on 70NANB22H038.

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