1 each tresky T4909 epoxy DIE bonding system WITH1 stamping set for T4909 and 1 each fine adjustment with micrometer screws for the precision placement and mounting of silicon microcircuit dice to…
Ended Purchase Order Awarded
- Contract number
- W31P4Q17P0070
- Awardee
-
Tresky Corp UEI NACFQLGK8JH9
- Awarding agency
-
Aviation and Missile Command
Army Materiel Command, Department of Defense
- Obligated
- $32,210
Award facts
- Opportunity
-
- W31P4Q17Q0054 Solicitation number
- Sole Source Tresky T4909 Epoxy Bonder Award Notice · Posted Mar 7, 2017
- Contract value 100% obligated
- $32,210.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- Funding agency
- Research Development and Engineering Command Army Materiel Command, Department of Defense
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- Set-aside
- No set-aside
- Competition
- Not Competed under SAP · 1 offer Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- Morganville, Marlboro, NJ, USA
Award details come from SAM.gov/FPDS.
Description
1 each tresky T4909 epoxy DIE bonding system WITH1 stamping set for T4909 and 1 each fine adjustment with micrometer screws for the precision placement and mounting of silicon microcircuit dice to substrates using epoxy in a laboratory environment
Quick answers
Who was awarded contract W31P4Q17P0070?
W31P4Q17P0070 was awarded to Tresky Corp by Aviation and Missile Command (Army Materiel Command) on March 15, 2017.
How much is contract W31P4Q17P0070 worth?
The government has obligated $32,210 on W31P4Q17P0070.
Which agency awarded contract W31P4Q17P0070?
Aviation and Missile Command (Army Materiel Command) awarded W31P4Q17P0070, with funding from Research Development and Engineering Command (Army Materiel Command).
Was contract W31P4Q17P0070 competed?
The extent of competition for W31P4Q17P0070 was not competed under sap. The government received 1 offer.
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