Multi-chip module packaging of SIC pressure sensors and electronics

Active Purchase Order Awarded Last action

Contract number
80NSSC24PC199
Awardee
Awarding agency
Obligated
$65,500

Award facts

Opportunity
Contract value 100% obligated
$65,500.00 Current and potential, with all options
Completion date 92% complete
Current and potential, with all options
Contracting staff
Set-aside
No set-aside
Competition
Competed under SAP · 1 offer Simplified Acquisition
Pricing
Firm Fixed Price
Place of performance
Mukilteo, WA 98275, USA

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Other Administrative Action P00002 $0
Other Administrative Action P00001 $0
Original award $65,500

About this award

NASA's Shared Services Center awarded a purchase order to Sienna Technologies, Inc. for $65,500 on August 26, 2024, for multi-chip module packaging of silicon carbide pressure sensors and electronics under sole-source authority (FAR 13.106-1(b)(1)(i)). Performance occurs at Sienna's facility in Mukilteo, Washington. The order requires packaging of SiC integrated pressure/temperature sensors and SiC amplifier chips onto an aluminum nitride circuit board in multi-chip module configuration, with ultimate completion by December 31, 2026. The procurement was issued under firm fixed-price terms with no small business set-aside.

Quick answers

Who was awarded contract 80NSSC24PC199?

80NSSC24PC199 was awarded to Sienna Technologies, Inc. by Shared Services Center (National Aeronautics and Space Administration) on August 26, 2024.

How much is contract 80NSSC24PC199 worth?

The government has obligated $65,500 on 80NSSC24PC199.

Was contract 80NSSC24PC199 competed?

The extent of competition for 80NSSC24PC199 was competed under sap. The government received 1 offer.

On GovTribe

See this award's full record

  • Every transaction and funding action
  • The awardee's other awards and teaming partners
  • Similar awards and recompete opportunities
  • Ask GovTribe AI about this award