1 - medium force module 400G - 4KG, 1 - ultrasonic bonding set, 1 - flip station, 1 - ultrasonic tool, 5X5, tungsten carbide, 1 - custom vacuum pickup tool, installation & training, packing and…
Ended Purchase Order Awarded
- Contract number
- 80NSSC20P0549
- Awardee
-
Tresky Corp UEI NACFQLGK8JH9
- Awarding agency
-
Shared Services Center
National Aeronautics and Space Administration
- Obligated
- $29,110
Award facts
- Opportunity
-
- Tresky flip-chip die-bonding parts for T-3000 die-bonder, installation of parts on an existing Tresky T-3000 bonder, and providing technical training Solicitation · 80NSSC20Q0245 · Posted Jan 14, 2020
- Contract value 100% obligated
- $29,110.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- Set-aside
- No set-aside
- Competition
- Competed under SAP · 1 offer Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- Morganville, Marlboro, NJ, USA
Award details come from SAM.gov/FPDS.
Description
1 - medium force module 400G - 4KG, 1 - ultrasonic bonding set, 1 - flip station, 1 - ultrasonic tool, 5X5, tungsten carbide, 1 - custom vacuum pickup tool, installation & training, packing and shipping
Quick answers
Who was awarded contract 80NSSC20P0549?
80NSSC20P0549 was awarded to Tresky Corp by Shared Services Center (National Aeronautics and Space Administration) on February 3, 2020.
How much is contract 80NSSC20P0549 worth?
The government has obligated $29,110 on 80NSSC20P0549.
Was contract 80NSSC20P0549 competed?
The extent of competition for 80NSSC20P0549 was competed under sap. The government received 1 offer.
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