Tresky flip-chip die-bonding parts for T-3000 die-bonder, installation of parts on an existing Tresky T-3000 bonder, and providing technical training

Synopsis:

NASA/NSSC has a requirement for Tresky flip-chip die-bonding parts for T-3000 die-bonder, installation of parts on an existing Tresky T-3000 bonder, and providing technical training.

NASA/NSSC intends to issue a sole source contract to TRESKY CORP. 704 GINESI DR STE 11 MORGANVILLE NEW JERSEY 07751-1278 under the authority of FAR 13.106-1(b)(1)(i). It has been determined that TRESKY CORP. is the sole provider of Tresky flip-chip die-bonding parts for T-3000 die-bonder, installation of parts on an existingTresky T-3000 bonder, and providing technical training.

NASA/NSSC will be the procuring center for this effort. Performance will be located at NASA/ Glenn Research Center (GRC).

The Government intends to acquire commercial items and services using the provisions, clauses and procedures prescribed in FAR Part 12 and FAR Part 13.

The NAICS Code for this procurement is 334413

Interested organizations may submit their capabilities and qualifications to perform the effort in writing to the identified point of contact not later than 2:00 p.m. Central Standard Time on January 17, 2020. Such capabilities/qualifications will be evaluated solely for the purpose of determining whether or not to conduct this procurement on a competitive basis. A determination by the Government not to compete this proposed effort on a full and open competition basis, based upon responses to this notice, is solely within the discretion of the government.

Oral communications are not acceptable in response to this notice.

NASA Clause 1852.215-84, Ombudsman, is applicable. The Center Ombudsman for this acquisition can be found at http://prod.nais.nasa.gov/pub/pub_library/Omb.html .

Primary Point of Contact:

Dalonna Penton

Contract Specialist

Dalonna.d.penton@nasa.gov

228-813-6331