Engineering services the purpose of this task is to review the 3D IC system requirements of a 3D IC with one-third party DIE in a single package, perform preliminary and final design tasks to create a…

Ended Awarded Last action

Contract number
HQ072718F1802
Awardee
Awarding agency
Obligated
$8,718,694

Award facts

Opportunity
Contract value 100% obligated
$8,718,694.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Funding agency
Missile Defense Agency Department of Defense
NAICS code
541330 Engineering Services
Set-aside
No set-aside
Competition
Full and Open Competition · 1 offer Multiple Award, Fair Opportunity
Pricing
Cost Plus Fixed Fee
Place of performance
Albuquerque, NM 87109, USA
Legislative mandates

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Other Administrative Action P00006 · Engineering services - cap to GFP transfer. $0
Other Administrative Action P00005 · Rfniu access $0
Funding Only Action P00004 $2,252,458
Funding Only Action P00003 · Incremental funding $1,142,000
Funding Only Action P00002 · Engineering services: the purpose of this modification is to add an increment of funding. $1,800,000
Supplemental Agreement for work within scope P00001 · The purpose of this modification is to incorporate CET 18-855 REV 1. $1,193,645
Original award $2,330,591

About this award

Written by GovTribe AI ·

This federal contract was awarded to Honeywell International Inc. by the Department of Defense (DoD) Missile Defense Agency. The purpose is to review 3D Integrated Circuit (IC) system requirements, perform preliminary and final design tasks to create a new 3D IC device with three or more third-party dies in a new custom package, build test fixtures, and conduct initial device fabrication. The contract has a potential value of $8,718,694.00 and is a Cost Plus Fixed Fee delivery order under the Advanced Technology Support Program IV (ATSP4) IDIQ vehicle. There is no set-aside designation for this award. Honeywell Aerospace - Deer Valley OEM Division, doing business as Honeywell International, is the prime contractor. The award supports the Missile Defense Agency's mission to develop advanced technologies for missile defense systems.

Description

As the agency reported it.

Engineering services the purpose of this task is to review the 3D IC system requirements of a 3D IC with one-third party DIE in a single package, perform preliminary and final design tasks to create a new 3D IC device with three or more third-party DIE in a new custom package, build test fixtures, and conduct initial device fabrication.

Quick answers

Who was awarded contract HQ072718F1802?

HQ072718F1802 was awarded to Honeywell International Inc. by Defense Microelectronics Activity (Department of Defense) on September 5, 2018.

How much is contract HQ072718F1802 worth?

The government has obligated $8,718,694 on HQ072718F1802.

Which agency awarded contract HQ072718F1802?

Defense Microelectronics Activity (Department of Defense) awarded HQ072718F1802, with funding from Missile Defense Agency (Department of Defense).

Is contract HQ072718F1802 an order under another contract?

Yes. HQ072718F1802 is a delivery order under HQ072716D0008, an indefinite delivery contract, on Advanced Technology Support Program IV (ATSP4).

Was contract HQ072718F1802 competed?

The extent of competition for HQ072718F1802 was full and open competition. The government received 1 offer.

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